CMM-9-BD

2.0-9.0 GHz GaAs MMIC Amplifier February 2008 - Rev 03-Feb-08 CMM-9-BD Chip Diagram Features Wide Bandwidth 13 dB Typical Gain Small Size: 39x35 mils Directly Cascadable Self-Biased Single Power Supply General Description Mimix Broadband's CMM-9 is a 2 to 9 GHz GaAs MMIC amplifier. It is a two-stage feedback design which provides high gain and good power from a single power supply. Applications include oscillator buffers, RF and IF gain blocks and driver amplifiers. The CMM-9 is a very small chip which provides 13 dB of gain and 17 dBm of power from a 6 volt supply. The chip is directly cascadable with no additional components. The circuit’s self-biasing feature provides excellent performance from a 5 to 7 volt supply. Care must be taken to isolate the input from the external DC voltages. Mimix MMICs are fabricated on ion-implanted GaAs material with gold-based metalization. The FET gates are sub-half micron, tee cross-section construction. Air bridges are used for top level interconnection. Silicon nitride serves as capacitor dielectric and surface passivation. Mesa resistors are used for feedback and bias function. The CMM-9 is available in chip form. It can be screened to meet commercial, military Hi-Rel or space grade reliability requirements. Custom wafer qualification for special electrical and/or reliability requirements is also available. Absolute Maximum Ratings Voltage Continuous Power Dissipation Channel Temperature Storage Temperature Mounting Temperature Input Power JC 8V 1.25 W +175 ºC -65 to +175 ºC +320 ºC +20 dBm 80 ºC/W Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 1 of 5 Characteristic Data and Specifications are subject to change without notice. ©2008 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 2.0-9.0 GHz GaAs MMIC Amplifier February 2008 - Rev 03-Feb-08 CMM-9-BD Specifications (TA = 25ºC,VDD = 6V, 2-9 GHz) Bonding Diagram Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 2 of 5 Characteristic Data and Specifications are subject to change without notice. ©2008 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 2.0-9.0 GHz GaAs MMIC Amplifier February 2008 - Rev 03-Feb-08 CMM-9-BD Typical Performance (TA = 25ºC) Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 3 of 5 Characteristic Data and Specifications are subject to change without notice. ©2008 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 2.0-9.0 GHz GaAs MMIC Amplifier February 2008 - Rev 03-Feb-08 CMM-9-BD Typical Scattering Parameters,TA = 25ºC (S-Parameters Include Bonding Wire Parasitics) Equivalent Circuit Wafer Qualification Procedure 100% DC Text 100% Visual Insp. Sample Mechanical Evaluation Sample Circuit Performance Tests* Reliability Assessment *80% of tested samples must meet specifications for wafer acceptance. NF, Gain, P1dB, VSWR Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 4 of 5 Characteristic Data and Specifications are subject to change without notice. ©2008 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 2.0-9.0 GHz GaAs MMIC Amplifier February 2008 - Rev 03-Feb-08 CMM-9-BD Handling and Assembly Information CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures: • Do not ingest. • Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed. • Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures. Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support devices or systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein: (1) Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. (2) A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic containers, which should be opened in cleanroom conditions at an appropriately grounded antistatic workstation. Devices need careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers. Die Attach: Conductive epoxy or preform die attach is recommended. For preform die attach: Preform: AuSn (80% Au, 20% Sn); Stage Temperature: 290 ºC, +/-5 ºC; Handling Tool: Tweezers; Time: 1 min or less. Wire Bonding: Wire Size: 0.7 to 1.0 mil in diameter (prestressed); Thermocompression bonding is preferred over thermosonic bonding. For thermocompression bonding: Stage Temperature: 250 ºC ; Bond Tip Temperature: 150 ºC; Bonding Tip Pressure: 18 to 40 gms depending on size of wire. RoHS Compliant Parts - All Mimix products are RoHS compliant unless otherwise specified. Ordering Information Part Number for Ordering CMM-9-BD-000X Description Where “X” is RoHS compliant die packed in “V” - vacuum release gel packs or W” - waffle trays Caution: ESD Sensitive Appropriate precautions in handling, packaging and testing devices must be observed. Proper ESD procedures should be followed when handling this device. Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 5 of 5 Characteristic Data and Specifications are subject to change without notice. ©2008 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.