TSS-53LNB3+

TSS-53LNB3+

  • 厂商:

    MINI

  • 封装:

    MCLP12_3X3MM

  • 描述:

    宽带低噪声旁路放大器

  • 数据手册
  • 价格&库存
TSS-53LNB3+ 数据手册
WIDEBAND Low Noise Bypass Amplifier TSS-53LNB3+ 50Ω 0.5 to 5 GHz THE BIG DEAL y Wideband: 0.5-5 GHz y Built-in Bypass switching y Low Noise figure: 1.5 dB typ. at 2.0 GHz y High Gain: 18.4 dB typ. at 2 GHz y Ultra Flat Gain: 0.7 dB from 0.7 to 2.1 GHz y P1dB: +15.1 dBm typ. at 2.0 GHz y Minimal matching components y Specified over full band operation Generic photo used for illustration purposes only CASE STYLE: DQ1225 +RoHS Compliant The +Suffix identifies RoHS Compliance. See our web site for RoHS Compliance methodologies and qualifications APPLICATIONS y Wireless Base Station Systems y Test and Measurement Systems y Multi-Band Receivers PRODUCT OVERVIEW Mini-Circuits TSS-53LNB3+ is a low-noise amplifier offering industry-leading performance over its full frequency range from 500 MHz to 5 GHz. It contains internal switching, allowing the user control of the amplifier to handle both high and low signal levels by bypassing the LNA in the presence of large signals. The TSS-53LNB3+ utilizes E-PHEMT technology to achieve excellent noise figure performance in a unique cascade configuration enabling the combination of very wide band performance and flat gain. This model comes in a tiny, 3 x 3mm, 12-lead MCLP package. KEY FEATURES Feature Advantages Ultra-wideband: 500 MHz – 5 GHz Ideal for a wide range of receiver applications including military, commercial wireless, and instrumentation. Very flat gain Ideal for broadband or multi-band applications. Just one, cost-efficient model required for multiple frequency usage. Minimal external matching components required. 15 dB return loss typ. Minimizes the need for external matching networks, simplifying circuit designs, and enabling the amplifier to operate over multiple bands in a single application circuit. Internal bypass switch feature Unique design handles low to high signal levels with minimal noise distortion. Built-in DC blocking cap at RF-Out port & separate pads for RF-Out & Vdd Simplifies biasing eliminates need for Bias-Tee at output. Compact size: 3 x 3 x 0.9 mm Saves space in dense system layouts. Low inductance, repeatable transitions, and excellent thermal contact. REV. A ECO-011809 TSS-53LNB3+ TH/RS/CP 220128 www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com PAGE 1 OF 5 WIDEBAND Low Noise Bypass Amplifier TSS-53LNB3+ ELECTRICAL SPECIFICATIONS1 AT 25°C, ZO=50Ω AND VDD=3V, UNLESS OTHERWISE NOTED Parameter Condition (GHz) Frequency Range Noise Figure Gain Gain Flatness Input Return Loss Output Return Loss Output Power @1dB compression AMP-ON2 Input Power @1dB compression AMP-Bypass2 Output IP3 Device Operating Voltage (Vdd) Device Operating Current (Id) Enable Voltage (Ve) Enable Control Current (Ie) DC Current (Id) Variation Vs. Temperature3 DC Current (Id) Variation Vs. Voltage Thermal Resistance, junction-to-ground lead Min. Typ. 0.5 0.5 1.0 2.0 3.0 4.0 5.0 0.5 1.0 2.0 3.0 4.0 5.0 0.7 - 2.1 0.5 1.0 2.0 3.0 4.0 5.0 0.5 1.0 2.0 3.0 4.0 5.0 0.5 1.0 2.0 3.0 4.0 5.0 0.5 1.0 2.0 3.0 4.0 5.0 AmplifierBypass Amplifier-ON — — 16.5 — — — — — — — — — 2.7 Max. 5.0 1.3 1.3 1.5 1.6 1.7 1.8 19.5 19.3 18.4 17.2 16.1 14.8 ±0.7 16.6 16.6 12.4 9.8 10.1 11.3 18.5 18.3 18.8 12.9 10.2 6.5 13.6 14.8 14.9 14.7 14.7 13.9 25.2 24.5 24.8 23.6 23.8 20.7 3 42 3 2.0 -19 0.008 60 — — 20.2 — — — 3.3 Units Typ. GHz — — — — — — -0.8 -0.8 -1.1 -1.3 -1.6 -1.7 ±0.2 24.3 19.0 13.4 12.5 10.6 11.3 24.1 17.7 13.2 13.5 11.5 10.6 28 — 29 — — 29 28.7 20.7 26.6 28.3 29.2 30.1 3 2 0 0 — — — dB dB dB dB dB dBm dBm V mA V mA µA/°C mA/mV °C/W 1. Measured on Mini-Circuits Characterization test board TB-780+. See Characterization Test Circuit (Fig. 1) 2. Current increases at P1dB 3. (Current at 85°C ­- Current at -45°C)/130) www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com PAGE 2 OF 5 WIDEBAND Low Noise Bypass Amplifier TSS-53LNB3+ MAXIMUM RATINGS4 CONTROL VOLTAGE (VE) FIG. 1 Parameter Ratings Operating Temperature (ground lead) Storage Temperature Amplifier-Bypass -65°C to 150°C Total Power Dissipation Min. Typ. Max. Units 2.7 3.0 3.3 V 0 — 0.5 V 0.7 W Amplifier-ON Input Power Amplifier-ON -40°C to 85°C 8 dBm (continuous), 19 dBm (5 min max.) Amplifier Bypass 16 dBm (continuous), 29 dBm (5 min max.) DC Voltage Vdd 7.0 V DC Voltage Enable 7.0 V Max. Voltage on pad 8 15 V 5. Permanent damage may occur if any of these limits are exceeded. Electrical maximum ratings are not intended for continuous normal operation. SWITCHING SPECIFICATIONS (RISE/FALL TIME) Parameter Amplifier ON to Bypass Amplifier Bypass to ON Min. Typ. Max. OFF TIME (50% Control to 10% RF) — 55* — FALL TIME (90 to 10% RF) — 34 — ON TIME (50% Control to 90% RF) — 960* — RISE TIME (10% to 90% RF) — 240 — — 65 — Control Voltage Leakage Units ns ns mV * Measured with ±25nS uncertainty SIMPLIFIED SCHEMATIC AND BONDING PAD DESCRIPTION Control Current 12 TOP VIEW Vdd 9 12 RF-IN 2 8 RF-OUT 1,3,4,5,6,7,10 & Paddle 11 Voltage Enable GND 1 RF-IN 2 GND 3 11 10 Paddle (Ground) 4 5 Vdd 9 8 RF-OUT 7 GND 6 GND GND GND Function Pad Number Description (See Figure 2) RF-IN 2 RF-Input pad. Connect to Ground Via L1. Add a DC blocking cap in series of appropriate value if required. RF-OUT 8 RF-Output pad. No external DC blocking cap required. Current Control 12 Control Current pad, voltage level on this pad sets the Idd. Connect to pad 11 via 3.92 kΩ resistor. Voltage Enable 11 Voltage Enable Pad. Voltage level on this pad determines Amplifier is ON or bypassed. Vdd 9 Ground 1,3,4,5,6,7,10 & Paddle Supply Voltage Pad. Connect to Vdd via L2. Connect to ground. Use via holes as shown in “Suggested Layout for PCB Design” to reduce ground path inductance for best performance. www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com PAGE 3 OF 5 WIDEBAND Low Noise Bypass Amplifier TSS-53LNB3+ CHARACTERIZATION TEST CIRCUIT Voltage Enable (Ve) (Bypass) R1 12 11 DUT 9 Bias 2 RF-IN L2 Vdd C2 C1 8 RF-OUT L1 1,3,4,5,6,7,10 & Paddle Component Size Value Units L1 0402 47 nH L2 0402 56 nH C1 0402 0.1 µF C2 0402 10 pF R1 0402 3.92 KΩ Fig 1. Block diagram of Test Circuit used for characterization. (DUT soldered on Mini-Circuits Characterization test board TB-780+) Gain, Return loss, Output power at 1dB compression (P1 dB) , output IP3 (OIP3) and noise figure measured using Agilent’s N5242A PNA-X microwave network analyzer. Conditions: 1. Gain and Return loss: Pin= -25dBm 2. Output IP3 (OIP3): Two tones, spaced 1 MHz apart, 0 dBm/tone at output. 3. Switching Time: Pin=-25 dBm at 500 MHz. Venable=3V at 10 kHz. Vd=3V. TB-780+ RECOMMENDED APPLICATION CIRCUIT Schmitt Trigger (Optional) Vdd Voltage Enable L2 C2 C1 R1 12 11 RF-IN C3 2 L1 9 DUT RF-OUT 8 Component Size Value Units L1 0402 47 nH L2 0402 56 nH R1 0402 3.92 kΩ C1 0402 0.1 µF C2 0402 10 pF C3 0402 1000 pF Schmitt Trigger SN74LVC2G17DCKR Texas Instruments — Fig 2. Recommended Application Circuit. 1,3,4,5,6,7,10 & Paddle PRODUCT MARKING Index over pin MCL TSS53 Black body Model family designation Marking may contain other features or characters for internal lot control www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com PAGE 4 OF 5 WIDEBAND Low Noise Bypass Amplifier TSS-53LNB3+ ADDITIONAL DETAILED TECHNICAL INFORMATION IS AVAILABLE ON OUR DASH BOARD. TO ACCESS Performance Data Data Table Swept Graphs S-Parameter (S2P Files) Data Set (.zip file) Case Style DQ1225 Plastic package, exposed paddle lead finish: Matte-Tin Tape & Reel Standard quantities available on reel F66 7” reels with 20, 50, 100, 200, 500, 1K, or 2K devices Suggested Layout for PCB Design PL-421 Evaluation Board TB-779+ Environmental Ratings ENV12 C LIC K HERE ESD RATING Human Body Model (HBM): Class 1A (250 to
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