MITSUBISHI IGBT MODULES
CM500HA-34A
HIGH POWER SWITCHING USE INSULATED TYPE
CM500HA-34A
● I C … .………………….…….. 500 A ● V CES … …………..…...….. 1700 V ●Flat base Type Copper (non-plating) base plate No accessory (terminal screw) attach ●RoHS Directive compliant
Single
APPLICATION
AC Motor Control, Motion/Servo Control, Power supply, etc. OUTLINE DRAWING & INTERNAL CONNECTION
Dimension in mm
INTERNAL CONNECTION
Tolerance otherwise specified Division of Dimension 0.5 over over 3 6 to to to 3 6 30 Tolerance ±0.2 ±0.3 ±0.5 ±0.8 ±1.2
Di1 E Tr1 E G C
over 30 over 120
to 120 to 400
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July-2010
MITSUBISHI IGBT MODULES
CM500HA-34A
HIGH POWER SWITCHING USE INSULATED TYPE
ABSOLUTE MAXIMUM RATINGS (Tj=25 °C, unless otherwise specified)
Symbol VCES VGES IC ICRM Ptot IE IERM Tj Tstg Visol
(Note.1) (Note.1)
Item Collector-emitter voltage Gate-emitter voltage Collector current Total power dissipation Emitter current (Free wheeling diode forward current) Junction temperature Storage temperature Isolation voltage G-E short-circuited C-E short-circuited DC, TC=87 °C TC=25 °C TC=25 °C -
Conditions
Rating 1700 ±20 500 1000 5000 500
Unit V V A W A °C V
(Note.2) (Note.3)
Pulse, Repetitive
(Note.2, 4) (Note.2, 4)
Pulse, Repetitive
(Note.3)
1000 -40 ~ +150 -40 ~ +125 3500
Terminals to base plate, RMS, f=60 Hz, AC 1 min
MECHANICAL CHARACTERISTICS
Symbol Mt Mt Ms m ec Weight Flatness of base plate Mounting torque Item Main terminals Auxiliary terminals Mounting to heat sink On the centerline X, Y
(Note.5)
Conditions M 6 screw M 4 screw M 6 screw
Limits Min. 1.96 0.98 1.96 ±0 Typ. 2.45 1.18 2.45 480 Max. 2.94 1.47 2.94 +100
Unit
N·m g μm
ELECTRICAL CHARACTERISTICS (T j =25 °C, unless otherwise specified)
Symbol ICES IGES VGE(th) VCEsat Cies Coes Cres QG td(on) tr td(off) tf VEC trr Qrr Eon Eoff Err rg RG
(Note.1) (Note.1) (Note.1) (Note.1)
Item Collector-emitter cut-off current Gate-emitter leakage current Gate-emitter threshold voltage Collector-emitter saturation voltage Input capacitance Output capacitance Reverse transfer capacitance Gate charge Turn-on delay time Rise time Turn-off delay time Fall time Emitter-collector voltage Reverse recovery time Reverse recovery charge Turn-on switching energy per pulse Turn-off switching energy per pulse Reverse recovery energy per pulse Internal gate resistance External gate resistance
Conditions VCE=VCES, G-E short-circuited ±VGE=VGES, C-E short-circuited IC=50 mA, VCE=10 V IC=500 A VGE=15 V
(Note.6)
Limits Min. 5.5 T j =25 °C T j =125 °C 3.0 Typ. 7 2.2 2.45 3300 2.3 50 267.8 138.5 98.1 1.0 Max. 1 3 8.5 3.0 120 14 2.6 900 500 700 350 3.2 650 10
Unit mA μA V V
,
VCE=10 V, G-E short-circuited VCC=1000 V, IC=500 A, VGE=15 V VCC=1000 V, IC=500 A, VGE=±15 V, RG=3.0 Ω, Inductive load IE=500 A
(Note.6)
nF nC
ns
, G-E short-circuited
V ns μC mJ Ω Ω
VCC=1000 V, IE=500 A, VGE=±15 V, RG=3.0 Ω, Inductive load VCC=1000 V, IC=IE=500 A, VGE=±15 V, RG=3.0 Ω, T j =125 °C, Inductive load TC=25 °C -
THERMAL RESISTANCE CHARACTERISTICS
Symbol Rth(j-c)Q Rth(j-c)D Rth(c-s) Item Thermal resistance
(Note.2)
Conditions Junction to case, IGBT part
(Note.2)
Limits Min. Typ. 20 Max. 25 42 -
Unit K/kW K/kW K/kW
Contact thermal resistance
Junction to case, FWDi part Case to heat sink, (Note.7) Thermal grease applied
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July-2010
MITSUBISHI IGBT MODULES
CM500HA-34A
HIGH POWER SWITCHING USE INSULATED TYPE
Note.1: Represent ratings and characteristics of the anti-parallel, emitter-collector free wheeling diode (FWDi). Note.2: Case temperature (TC) and heat sink temperature (T s ) are defined on the each surface of base plate and heat sink just under the chips. (Refer to the figure of chip location) The heat sink thermal resistance {R t h ( s - a ) } should measure just under the chips. Note.3: Pulse width and repetition rate should be such that the device junction temperature (T j ) dose not exceed T j m a x rating. Note.4: Junction temperature (T j ) should not increase beyond T j m a x rating. Note.5: Base plate flatness measurement point is as in the following figure.
-: Concave +: Convex Bottom X Y
Bottom
-: Concave
Bottom
+: Convex
Note.6: Pulse width and repetition rate should be such as to cause negligible temperature rise. (Refer to the figure of test circuit) Note.7: Typical value is measured by using thermally conductive grease of λ=0.9 W/(m·K).
CHIP LOCATION (Top view)
Dimension in mm, tolerance: ±1 mm
Tr1: IGBT, Di1: FWDi. Each mark points the center position of each chip.
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July-2010
MITSUBISHI IGBT MODULES
CM500HA-34A
HIGH POWER SWITCHING USE INSULATED TYPE
TEST CIRCUIT AND WAVEFORMS
C VGE=15 V
G
C shortcircuited
G
IC
IE
V
Es
V
E
Es
E
VEC test circuit
vGE
V C E s a t test circuit
iE
∼
90 % 0
0V -V GE
iE
t
Q rr =0.5×I rr ×t r r t rr IE
L oad
+ VCC ∼ iC
0A
90 %
t Irr
+V GE 0V -V GE
RG vCE vGE iC
0.5×I r r
10 % 0A td ( o n ) tr t d( o ff) tf t
Switching characteristics test circuit and waveforms
t r r , Q r r test waveform
iE
IEM vEC VCC
vCE
ICM VCC
iC
iC VCC
ICM
vCE
0A
t
0
0.1×ICM
0.1×VCC
t
0
0.1×VCC
0.02×ICM
t
0V
t
ti
ti
ti
IGBT Turn-on switching energy
IGBT Turn-off switching energy
FWDi Reverse recovery energy
Turn-on, Turn-off switching and Reverse recovery energy test waveforms (integral range)
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July-2010
MITSUBISHI IGBT MODULES
CM500HA-34A
HIGH POWER SWITCHING USE INSULATED TYPE
PERFORMANCE CURVES
COLLECTOR-EMITTER SATURATION VOLTAGE CHARACTERISTICS (TYPICAL) VGE=15 V
4
OUTPUT CHARACTERISTICS (TYPICAL) T j =25 °C
1000
VGE=20 V 15 V
13 V 12 V
800
T j =125 °C COLLECTOR-EMITTER SATURATION VOLTAGE VCEsat (V)
3
COLLECTOR CURRENT
IC (A)
600
11 V
2
T j =25 °C
400
10 V
200
1
9V 8V
0 0 2 4 6 8 10 0 0 200 400 600 800 1000
COLLECTOR-EMITTER VOLTAGE
VCE (V)
COLLECTOR CURRENT
IC (A)
COLLECTOR-EMITTER SATURATION VOLTAGE CHARACTERISTICS (TYPICAL) T j =25 °C
10 1000
FREE WHEELING DIODE FORWARD CHARACTERISTICS (TYPICAL) G-E short-circuited
T j =125 °C
8
COLLECTOR-EMITTER SATURATION VOLTAGE VCEsat (V)
IC=1000 A IE (A) IC=500 A
6
T j =25 °C
EMITTER CURRENT
IC=200 A
100
4
2
0 5 10 15 20
10 0.5 1.5 2.5 3.5
GATE-EMITTER VOLTAGE
VGE (V)
EMITTER-COLLECTOR VOLTAGE
VEC (V)
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July-2010
MITSUBISHI IGBT MODULES
CM500HA-34A
HIGH POWER SWITCHING USE INSULATED TYPE
HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) VCC=1000 V, VGE=±15 V, RG=3.0 Ω, T j =125 °C INDUCTIVE LOAD
10000
HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) VCC=1000 V, IC=500 A, VGE=±15 V, T j =125 °C INDUCTIVE LOAD
10000
td(off)
SWITCHING TIME (ns)
tf td(on)
SWITCHING TIME (ns)
1000
1000
td(off) td(on) tf tr
100
tr
10 10 100 1000
100 1 10
COLLECTOR CURRENT
IC (A)
EXTERNAL GATE RESISTANCE
RG (Ω)
HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) VCC=1000 V, VGE=±15 V, RG=3.0 Ω, T j =125 °C INDUCTIVE LOAD, PER PULSE
1000
HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) VCC=1000 V, IC/IE=500 A, VGE=±15 V, T j =125 °C INDUCTIVE LOAD, PER PULSE
1000
SWITCHING ENERGY (mJ) REVERSE RECOVERY ENERGY (mJ)
SWITCHING ENERGY (mJ) REVERSE RECOVERY ENERGY (mJ)
Eon
Eon
Eoff
100
100
Err
Err
Eoff
10 10 100 1000
10 1 10
COLLECTOR CURRENT IC (A) EMITTER CURRENT IE (A)
EXTERNAL GATE RESISTANCE
RG (Ω)
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July-2010
MITSUBISHI IGBT MODULES
CM500HA-34A
HIGH POWER SWITCHING USE INSULATED TYPE
CAPACITANCE CHARACTERISTICS (TYPICAL) G-E short-circuited, T j =25 °C
1000 20
GATE CHARGE CHARACTERISTICS (TYPICAL) IC=500 A, T j =25 °C
VCC= 8 0 0 V Cies
100
VGE (V)
15
VCC= 1 0 0 0 V
CAPACITANCE (nF)
10
GATE-EMITTER VOLTAGE
100
10
Coes
1
Cres
5
0.1 0.1 1 10
0 0 1000 2000 3000 4000 5000
COLLECTOR-EMITTER VOLTAGE
VCE (V)
GATE CHARGE
QG (nC)
FREE WHEELING DIODE REVERSE RECOVERY CHARACTERISTICS (TYPICAL) VCC=1000 V, VGE=±15 V, RG=3.0 Ω, T j =125 °C INDUCTIVE LOAD
1000
TRANSIENT THERMAL IMPEDANCE CHARACTERISTICS (MAXIMUM) Single pulse, TC=25°C Zth(j-c) NORMALIZED TRANSIENT THERMAL IMPEDANCE
1
0.1
trr
t r r (ns), I r r (A)
100
Irr
0.01
0.001
0.00001 0.0001 0.001 0.01 0.1 1 10
10 10 100 1000
EMITTER CURRENT
IE (A)
R t h ( j - c ) Q =25 K/kW, R t h ( j - c ) D =42 K/kW TIME (S)
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July-2010
MITSUBISHI IGBT MODULES
CM500HA-34A
HIGH POWER SWITCHING USE INSULATED TYPE
Keep safety first in your circuit designs!
·Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
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July-2010