MITSUBISHI IGBT MODULES
CM75RX-24A
HIGH POWER SWITCHING USE
CM75RX-24A
¡IC ..................................................................... 75A ¡VCES ......................................................... 1200V ¡7pack (3-phase Inverter + Brake) ¡Flatbase Type / Insulated Package / Copper (non-plating) base plate ¡RoHS Directive compliant
APPLICATION General purpose Inverters, Servo Amplifiers
OUTLINE DRAWING & CIRCUIT DIAGRAM
(20.5)
Dimensions in mm
1.15 0.65 3.5
φ4.3
1.5
0.8
12.5
*91.2 *95 (102.25) (110) *114.06
(3.81)
φ2.5 φ2.1
(7.4)
LABEL
1.2 TERMINAL t = 0.8
0 (7.75) *15 *18.8
*30.24 *34.04
*45.48 *49.28
*60.72 *64.52
SECTION A 17 13
(21.14) 6.5
*54.2
34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13
(50)
17 12 6
12 35 11 10 9 8 7 36 1 2 3 4 6 5
17 12 6
39 50 ±0.5 57.5 62 77.1
*34.52 *30.72 *15.48 *11.66
13.64 14
22 39
(21.14)
0 A 6 12 13.5 20.71 8.5 17 22.86 22.86
6.5
(3)
(5.4)
12.5 (SCREWING DEPTH) 17 +1 -0.5
P(35)
6-M5 NUTS 22.86
*Pin positions with tolerance
φ 0.5
TH1(11)
NTC
Tolerance otherwise specified
Division of Dimension 0.5 over over 3 6 30 to to to to to 3 6 30 120 400 Tolerance ±0.2 ±0.3 ±0.5 ±0.8 ±1.2
GuP(34) B(4) EuP(33)
GvP(26) EvP(25) U(1)
GwP(18) TH2(10) EwP(17) V(2) W(3)
GB(6) EB(5) N(36) GuN(30) EuN(29) GvN(22) EvN(21) GwN(14) EwN(13)
over
over 120
CIRCUIT DIAGRAM
0.8
136.9 121.7 110 ±0.5 99 94.5
*75.96 *79.76
4-φ5.5 MOUNTING HOLES (20.5) 7
Jan. 2009
MITSUBISHI IGBT MODULES
CM75RX-24A
HIGH POWER SWITCHING USE
ABSOLUTE MAXIMUM RATINGS INVERTER PART
Symbol VCES VGES IC ICRM PC IE (Note.3) IERM(Note.3) Parameter Collector-emitter voltage Gate-emitter voltage
(Tj = 25°C, unless otherwise specified)
Conditions
G-E Short C-E Short DC, TC = 93°C Collector current Pulse Maximum collector dissipation TC = 25°C Emitter current TC = 25°C (Free wheeling diode forward current) Pulse
(Note. 1) (Note. 4) (Note. 1, 5) (Note. 1) (Note. 4)
Rating 1200 ±20 75 150 500 75 150
Unit V A W A
BRAKE PART
Symbol VCES VGES IC ICRM PC VRRM(Note.3) IF (Note.3) IFRM(Note.3) Parameter Collector-emitter voltage Gate-emitter voltage Conditions G-E Short C-E Short DC, TC = 97°C Collector current Pulse Maximum collector dissipation TC = 25°C Repetitive peak reverse voltage TC = 25°C Forward current Pulse Rating 1200 ±20 50 100 355 1200 50 100 Unit V A W V A
(Note. 1) (Note. 4) (Note. 1, 5) (Note. 1) (Note. 4)
MODULE
Symbol Tj Tstg Viso — — — — Parameter Junction temperature Storage temperature Isolation voltage Base plate flatness Torque strength Torque strength Weight Conditions Rating –40 ~ +150 –40 ~ +125 2500 ±0 ~ +100 2.5 ~ 3.5 2.5 ~ 3.5 330 Unit °C Vrms μm N·m g
Terminals to base plate, f = 60Hz, AC 1 minute (Note. 8) On the centerline X, Y M5 screw Main terminals M5 screw Mounting (Typical)
Note. 8: The base plate flatness measurement points are in the following figure.
Heat sink side
Y
+ –
+ convex : – concave :
X
–
+
Heat sink side
Jan. 2009 2
MITSUBISHI IGBT MODULES
CM75RX-24A
HIGH POWER SWITCHING USE
ELECTRICAL CHARACTERISTICS INVERTER PART
Symbol ICES VGE(th) IGES VCE(sat) Cies Coes Cres QG td(on) tr td(off) tf trr (Note.3) Qrr (Note.3) Parameter
(Tj = 25°C, unless otherwise specified)
Conditions
VCE = VCES, VGE = 0V Collector cutoff current Gate-emitter threshold voltage IC = 7.5mA, VCE = 10V Gate leakage current ±VGE = VGES, VCE = 0V Collector-emitter saturation voltage Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Turn-on delay time Turn-on rise time Turn-off delay time Turn-off fall time Reverse recovery time Reverse recovery charge IC = 75A, VGE = 15V IC = 75A, VGE = 15V VCE = 10V VGE = 0V VCC = 600V, IC = 75A, VGE = 15V VCC = 600V, IC = 75A VGE = ±15V, RG = 4.3Ω Inductive load (Note. 6) Tj = 25°C Tj = 125°C Chip (Note. 6)
(IE = 75A) IE = 75A, VGE = 0V (Note. 6) Tj = 25°C Tj = 125°C Chip
VEC(Note.3) Emitter-collector voltage Rth(j-c)Q Rth(j-c)R RGint RG
IE = 75A, VGE = 0V Thermal resistance per IGBT (Note. 1) (Junction to case) per free wheeling diode Internal gate resistance TC = 25°C, per switch External gate resistance
Min. — 6 — — — — — — — — — — — — — — — — — — — — 4.1
Limits Typ. — 7 — 2.0 2.2 1.9 — — — 380 — — — — — 3 2.6 2.16 2.5 — — 0 —
Max. 1 8 0.5 2.6 — — 11.5 1.0 0.23 — 100 50 300 600 150 — 3.4 — — 0.25 0.40 — 41
Unit mA V μA V
nF nC
ns
μC V
K/W Ω
BRAKE PART
Symbol ICES VGE(th) IGES VCE(sat) Cies Coes Cres QG IRRM(Note.3) Parameter Conditions Min. — 6 — — — — — — — — — — — — — — — 6.0 Limits Typ. — 7 — 2.0 2.2 1.9 — — — 250 — 2.6 2.16 2.5 — — 0 — Max. 1 8 0.5 2.6 — — 8.5 0.75 0.17 — 1 3.4 — — 0.35 0.63 — 62 Unit mA V μA V
VCE = VCES, VGE = 0V Collector cutoff current Gate-emitter threshold voltage IC = 5mA, VCE = 10V Gate leakage current ±VGE = VGES, VCE = 0V Collector-emitter saturation voltage Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Repetitive peak reverse current IC = 50A, VGE = 15V IC = 50A, VGE = 15V VCE = 10V VGE = 0V VCC = 600V, IC = 50A, VGE = 15V VR = VRRM IF = 50A (Note. 6) Tj = 25°C Tj = 125°C Chip (Note. 6) Tj = 25°C Tj = 125°C Chip (Note. 6)
nF nC mA V
VFM(Note.3) Forward voltage drop Rth(j-c)Q Rth(j-c)R RGint RG
IF = 50A per IGBT Thermal resistance (Note. 1) per Clamp diode (Junction to case) TC = 25°C Internal gate resistance External gate resistance
K/W Ω
Jan. 2009 3
MITSUBISHI IGBT MODULES
CM75RX-24A
HIGH POWER SWITCHING USE
NTC THERMISTOR PART
Symbol R ΔR B(25/50) P25 Parameter Zero power resistance Deviation of resistance B constant Power dissipation Conditions TC = 25°C TC = 100°C, R100 = 493Ω Approximate by equation TC = 25°C Min. 4.85 –7.3 — — Limits Typ. 5.00 — 3375 — Max. 5.15 +7.8 — 10 Unit kΩ % K mW
(Note. 7)
MODULE
Symbol Rth(c-f) Parameter Conditions (Note. 2) Min. — Limits Typ. 0.015 Max. — Unit K/W
Contact thermal resistance Thermal grease applied (Note. 1) per 1 module (Case to fin)
Note.1: Case temperature (TC), heat sink temperature (Tf) measured point is just under the chips. (Refer to the figure of the chip location.) 2: Typical value is measured by using thermally conductive grease of λ = 0.9W/(m·K). 3: IE, IERM, VEC, trr and Qrr represent ratings and characteristics of the anti-parallel, emitter-collector free wheeling diode (FWDi). IF, IFRM, VF, VRRM and IRRM represent ratings and characteristics of the Clamp diode of Brake part. 4: Pulse width and repetition rate should be such that the device junction temperature (Tj) dose not exceed Tjmax rating. 5: Junction temperature (Tj) should not increase beyond 150°C. 6: Pulse width and repetition rate should be such as to cause negligible temperature rise. (Refer to the figure of the test circuit for VCE(sat) and VEC) 1 7: B(25/50) = In( R25 )/( 1 ) T50 R50 T25 R25: resistance at absolute temperature T25 [K]; T25 = 25 [°C]+273.15 = 298.15 [K] R50: resistance at absolute temperature T50 [K]; T50 = 50 [°C]+273.15 = 323.15 [K]
Chip Location (Top view)
89.3 96.6 97.3 100.1 22.6 34.1 45.3 55.8 79.6 0
Dimensions in mm (tolerance: ±1mm)
LABEL SIDE
0
34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13
0
(77.1)
19.6 25.6 28.7 34.7
35
(62)
(50)
Tr UP Di UP
Tr UN Di UN
1
Tr VP T r D i VN VP D i VN
2 3
36
Di Tr WP T r B r D i WN Th WP D i WN T r Br
4
12 11 10 9 8 7 6 5
17.3 26.8
40.8
(110) (121.7) (136.9)
Each mark points the center position of each chip. Tr**: IGBT, Di**: FWDi (DiBr: Clamp diode), Th: NTC thermistor
Jan. 2009 4
MITSUBISHI IGBT MODULES
CM75RX-24A
HIGH POWER SWITCHING USE
P V VGE = 15V
GuP EuP
P IC VGE = 0V
GuP EuP
P
U VGE = 0V
GuN EuN
U VGE = 15V
GuN EuN
B IC V VGE = 15V
GB EB
IC N
V
N
N P side Inverter part Tr (example of U arm) VGE = 0V(GvP-EvP, GwP-EwP, GvN-EvN, GwN-EwN, GB-EB) N side Inverter part Tr (example of U arm) VGE = 0V(GvP-EvP, GwP-EwP, GvN-EvN, GwN-EwN, GB-EB) VCE(sat) test circuit Br Tr VGE = 0V(GuP-EuP, GvP-EvP, GwP-EwP, GuN-EuN, GvN-EvN, GwN-EwN)
P V VGE = 0V
GuP EuP
P IE VGE = 0V
GuP EuP
P V
IF
B U
U VGE = 0V
GuN EuN
VGE = 0V
GuN EuN
IE N
V
VGE = 0V
GB EB
N P side Inverter part Di (example of U arm) VGE = 0V(GvP-EvP, GwP-EwP, GvN-EvN, GwN-EwN, GB-EB) N side Inverter part Di (example of U arm) VGE = 0V(GvP-EvP, GwP-EwP, GvN-EvN, GwN-EwN, GB-EB) VEC/VFM test circuit
N Br Di VGE = 0V(GuP-EuP, GvP-EvP, GwP-EwP, GuN-EuN, GvN-EvN, GwN-EwN)
Arm
IE 0V Load
VGE
90% 0%
IE trr
–VGE + +VGE 0V –VGE VCC IC 90% 0A t
RG VGE
VCE IC 0A td(on) tr td(off) tf Irr 10%
1/2 ✕ Irr Qrr = 1/2 ✕ Irr ✕ trr
Switching time test circuit and waveforms
trr, Qrr test waveform
Jan. 2009 5
MITSUBISHI IGBT MODULES
CM75RX-24A
HIGH POWER SWITCHING USE
PERFORMANCE CURVES
OUTPUT CHARACTERISTICS (TYPICAL) Inverter part COLLECTOR-EMITTER SATURATION VOLTAGE CHARACTERISTICS (TYPICAL) Inverter part
COLLECTOR CURRENT IC (A)
VGE = 20V
15
COLLECTOR-EMITTER SATURATION VOLTAGE VCE(sat) (V)
150 125 100 75 50 25 0
Tj = 25°C 13
4 3.5 3 2.5 2 1.5 1 0.5 0 0
VGE = 15V
12
11
10 9 0 1 2 3 4 5 6 7 8 9 10
Tj = 25°C Tj = 125°C 25 50 75 100 125 150
COLLECTOR-EMITTER VOLTAGE VCE (V)
COLLECTOR CURRENT IC (A)
COLLECTOR-EMITTER SATURATION VOLTAGE CHARACTERISTICS (TYPICAL) Inverter part
FREE WHEELING DIODE FORWARD CHARACTERISTICS (TYPICAL) Inverter part 103
7 5 3 2
COLLECTOR-EMITTER SATURATION VOLTAGE VCE(sat) (V)
10
Tj = 25°C
8
EMITTER CURRENT IE (A)
102
7 5 3 2
6
4 IC = 150A 2 IC = 75A IC = 30A 0 6 8 10 12 14 16 18 20
101
7 5 3 2
100
Tj = 25°C Tj = 125°C 0 0.5 1 1.5 2 2.5 3 3.5 4
GATE-EMITTER VOLTAGE VGE (V)
EMITTER-COLLECTOR VOLTAGE VEC (V)
CAPACITANCE CHARACTERISTICS (TYPICAL) Inverter part 102
7 5 3 2 7 5 3 2 7 5 3 2 7 5 3 2
HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) Inverter part 103
7 5 3 2
tf td(off) td(on) tr
CAPACITANCE (nF)
101
Cies Coes
SWITCHING TIME (ns)
102
7 5 3 2
100
10–1
Cres
VGE = 0V 10–2 –1 10 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102 COLLECTOR-EMITTER VOLTAGE VCE (V)
Conditions: 101 VCC = 600V 7 5 VGE = ±15V 3 RG = 4.3Ω 2 Tj = 125°C Inductive load 100 0 10 23 5 7 101
2
3
5 7 102
COLLECTOR CURRENT IC (A)
Jan. 2009 6
MITSUBISHI IGBT MODULES
CM75RX-24A
HIGH POWER SWITCHING USE
HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) Inverter part 103 tf td(off) td(on) tr Conditions: VCC = 600V VGE = ±15V IC = 75A Tj = 125°C Inductive load
5 7 101 2 3 5 7 102 7 5 3 2
HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) Inverter part 101
7
SWITCHING LOSS (mJ/pulse)
5 3 2
SWITCHING TIME (ns)
102
7 5 3 2
Eoff Err Eon Conditions: VCC = 600V VGE = ±15V RG = 4.3Ω Tj = 125°C Inductive load
2 3 5 7 101 2 3 5 7 102
100
7 5 3 2
101
7 5 3 2
100 0 10
2
3
10–1 0 10
GATE RESISTANCE RG (Ω)
COLLECTOR CURRENT IC (A) EMITTER CURRENT IE (A) REVERSE RECOVERY CHARACTERISTICS OF FREE WHEELING DIODE (TYPICAL) Inverter part 103
7 5 3 2
HALF-BRIDGE SWITCHING CHARACTERISTICS (TYPICAL) Inverter part 102 Conditions: VCC = 600V 5 VGE = ±15V 3 IC, IE = 75A Tj = 125°C 2 Inductive load
7
SWITCHING LOSS (mJ/pulse)
Eon
lrr (A), trr (ns)
102
7 5 3 2
trr Irr
101
7 5 3 2
Eoff Err
101
7 5 3 2
100 0 10
2
3
5 7 101
2
3
5 7 102
100 0 10
Conditions: VCC = 600V VGE = ±15V RG = 4.3Ω Tj = 25°C Inductive load
2 3 5 7 101 2 3 5 7 102
GATE RESISTANCE RG (Ω)
EMITTER CURRENT IE (A)
GATE CHARGE CHARACTERISTICS (TYPICAL) Inverter part 20
TRANSIENT THERMAL IMPEDANCE CHARACTERISTICS 100
7 Single pulse, 5 TC = 25°C 3 2 7 5 3 2
GATE-EMITTER VOLTAGE VGE (V)
IC = 75A VCC = 400V
15 VCC = 600V 10
NORMALIZED TRANSIENT THERMAL IMPEDANCE Zth(j–c)
10–1
10–2
7 5 Inverter IGBT part : Per unit base = Rth(j–c) = 0.25K/W 3 Inverter FWDi part : Per unit base = Rth(j–c) = 0.40K/W : Per unit base = Rth(j–c) = 0.35K/W 2 Brake IGBT part
5
0
0
100
200
300
400
500
Brake Clamp-Di part : Per unit base = Rth(j–c) = 0.63K/W 10–3 10–52 3 5710–42 3 5710–32 3 5710–22 3 5710–12 3 57 100 2 3 57 101 TIME (s)
GATE CHARGE QG (nC)
Jan. 2009 7
MITSUBISHI IGBT MODULES
CM75RX-24A
HIGH POWER SWITCHING USE
COLLECTOR-EMITTER SATURATION VOLTAGE CHARACTERISTICS (TYPICAL) Brake part
CLAMP DIODE FORWARD CHARACTERISTICS (TYPICAL) Brake part 102
7 5 3 2
COLLECTOR-EMITTER SATURATION VOLTAGE VCE(sat) (V)
4 VGE = 15V
3 2.5 2 1.5 1 0.5 0 Tj = 25°C Tj = 125°C 0 10 20 30 40 50 60 70 80 90 100 COLLECTOR CURRENT IC (A)
FORWARD CURRENT IF (A)
3.5
101
7 5 3 2
Tj = 25°C Tj = 125°C 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 FORWARD VOLTAGE VF (V)
100
Jan. 2009 8