MITSUBISHI Nch POWER MOSFET
FK30SM-6
HIGH-SPEED SWITCHING USE
FK30SM-6
OUTLINE DRAWING
15.9MAX.
Dimensions in mm 4.5 1.5
r
2
2
4
20.0
φ 3.2
5.0
1.0 q 5.45 w e 5.45
19.5MIN.
4.4
0.6
2.8
4 wr q GATE w DRAIN e SOURCE r DRAIN e
¡VDSS ................................................................................ 300V ¡rDS (ON) (MAX) ........................................................... 0.143Ω ¡ID ......................................................................................... 30A ¡Integrated Fast Recovery Diode (MAX.) ........150ns
q
TO-3P
APPLICATION Servo motor drive, Robot, UPS, Inverter Fluorecent lamp, etc.
MAXIMUM RATINGS
Symbol VDSS VGSS ID IDM IS ISM PD Tch Tstg —
(Tc = 25°C)
Parameter Drain-source voltage Gate-source voltage Drain current Drain current (Pulsed) Source current Source current (Pulsed) Maximum power dissipation Channel temperature Storage temperature Weight Typical value VGS = 0V VDS = 0V
Conditions
Ratings 300 ±30 30 90 30 90 275 –55 ~ +150 –55 ~ +150 4.8
Unit V V A A A A W °C °C g
Feb.1999
MITSUBISHI Nch POWER MOSFET
FK30SM-6
HIGH-SPEED SWITCHING USE
ELECTRICAL CHARACTERISTICS
Symbol V (BR) DSS V (BR) GSS IGSS IDSS VGS (th) rDS (ON) VDS (ON) yfs Ciss Coss Crss td (on) tr td (off) tf VSD Rth (ch-c) trr Parameter
(Tch = 25°C)
Test conditions ID = 1mA, VGS = 0V IG = ±100µA, VDS = 0V VGS = ±25V, VDS = 0V VDS = 300V, VGS = 0V ID = 1mA, VDS = 10V ID = 15A, VGS = 10V ID = 15A, VGS = 10V ID = 15A, VDS = 10V VDS = 25V, VGS = 0V, f = 1MHz
Limits Min. 300 ±30 — — 2 — — 10 — — — — — — — — — — Typ. — — — — 3 0.110 1.65 15 2850 580 110 45 120 330 120 1.5 — — Max. — — ±10 1 4 0.143 2.15 — — — — — — — — 2.0 0.45 150
Unit V V µA mA V Ω V S pF pF pF ns ns ns ns V °C/W ns
Drain-source breakdown voltage Gate-source breakdown voltage Gate-source leakage current Drain-source leakage current Gate-source threshold voltage Drain-source on-state resistance Drain-source on-state voltage Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Source-drain voltage Thermal resistance Reverse recovery time
VDD = 150V, ID = 15A, VGS = 10V, RGEN = RGS = 50Ω
IS = 15A, VGS = 0V Channel to case IS = 30A, dis/dt = –100A/µs
PERFORMANCE CURVES
POWER DISSIPATION DERATING CURVE 300
POWER DISSIPATION PD (W) DRAIN CURRENT ID (A)
MAXIMUM SAFE OPERATING AREA 3 2 102 7 5 3 2 101 7 5 3 2
250 200 150 100 50 0
tw=100µs 1ms 10ms
0
50
100
150
200
100ms TC = 25°C 100 DC Single Pulse 7 5 3 100 2 3 5 7 101 2 3 5 7 102 2 3 5 7 103 DRAIN-SOURCE VOLTAGE VDS (V)
Feb.1999
CASE TEMPERATURE TC (°C)
MITSUBISHI Nch POWER MOSFET
FK30SM-6
HIGH-SPEED SWITCHING USE
OUTPUT CHARACTERISTICS (TYPICAL) VGS = 20V 50 10V TC = 25°C Pulse Test 40 6V 30 OUTPUT CHARACTERISTICS (TYPICAL) VGS=20V 20 10V TC = 25°C Pulse Test 5V 16 PD = 275W
DRAIN CURRENT ID (A)
DRAIN CURRENT ID (A)
12
20
5V PD = 275W 4V
8 4.5V 4 4V
10
0
0
10
20
30
40
50
0
0
4
8
12
16
20
DRAIN-SOURCE VOLTAGE VDS (V)
DRAIN-SOURCE VOLTAGE VDS (V)
ON-STATE VOLTAGE VS. GATE-SOURCE VOLTAGE (TYPICAL) 10 0.20
ON-STATE RESISTANCE VS. DRAIN CURRENT (TYPICAL) TC = 25°C Pulse Test 0.16 VGS = 10V
DRAIN-SOURCE ON-STATE VOLTAGE VDS (ON) (V)
8
ID = 50A
DRAIN-SOURCE ON-STATE RESISTANCE rDS (ON) (Ω)
6 30A
0.12
20V
4
0.08
2 TC = 25°C Pulse Test 0 0 4 8 12 16
15A
0.04 0 10–1 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102 DRAIN CURRENT ID (A)
20
GATE-SOURCE VOLTAGE VGS (V)
TRANSFER CHARACTERISTICS (TYPICAL) 40 TC = 25°C VDS = 50V Pulse Test 102 7 5
FORWARD TRANSFER ADMITTANCE VS.DRAIN CURRENT (TYPICAL) VDS = 10V Pulse Test
DRAIN CURRENT ID (A)
FORWARD TRANSFER ADMITTANCE yfs (S)
32
24
3 2 101 7 5 3 2 100 0 10 23 5 7 101
TC = 25°C 75°C 125°C
16
8
0
0
4
8
12
16
20
23
5 7 102
GATE-SOURCE VOLTAGE VGS (V)
DRAIN CURRENT ID (A)
Feb.1999
MITSUBISHI Nch POWER MOSFET
FK30SM-6
HIGH-SPEED SWITCHING USE
CAPACITANCE VS. DRAIN-SOURCE VOLTAGE (TYPICAL) 104 7 5 3 2 103 7 5 3 2 103 7 5
SWITCHING TIME (ns)
SWITCHING CHARACTERISTICS (TYPICAL)
Ciss
td(off)
CAPACITANCE Ciss, Coss, Crss (pF)
3 2 tf 102 7 5 3 2 101 100 23 tr td(on) Tch = 25°C VDD = 150V VGS = 10V RGEN = RGS = 25Ω 5 7 101 23 5 7 102
Coss
102 Crss 7 5 3 Tch = 25°C 2 f = 1MHz VGS = 0V 101 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102 2 3 DRAIN-SOURCE VOLTAGE VDS (V)
DRAIN CURRENT ID (A)
GATE-SOURCE VOLTAGE VS.GATE CHARGE (TYPICAL)
GATE-SOURCE VOLTAGE VGS (V)
SOURCE-DRAIN DIODE FORWARD CHARACTERISTICS (TYPICAL) 50
SOURCE CURRENT IS (A)
20 Tch = 25°C ID = 30A 16 VGS = 50V
TC=125°C 40
VGS = 0V Pulse Test 75°C 25°C
12
100V 200V
30
8
20
4
10
0
0
40
80
120
160
200
0
0
0.8
1.6
2.4
3.2
4.0
GATE CHARGE Qg (nC)
SOURCE-DRAIN VOLTAGE VSD (V)
DRAIN-SOURCE ON-STATE RESISTANCE rDS (ON) (25°C)
DRAIN-SOURCE ON-STATE RESISTANCE rDS (ON) (t°C)
ON-STATE RESISTANCE VS. CHANNEL TEMPERATURE (TYPICAL) 101 7 5 3 2 100 7 5 3 2 10–1 0 50 100 150 200 250 5.0
GATE-SOURCE THRESHOLD VOLTAGE VGS (th) (V)
THRESHOLD VOLTAGE VS. CHANNEL TEMPERATURE (TYPICAL) VDS = 10V ID = 1mA 4.0
VGS = 10V ID = 1/2ID Pulse Test
3.0
2.0
1.0
0
–50
0
50
100
150
CHANNEL TEMPERATURE Tch (°C)
CHANNEL TEMPERATURE Tch (°C)
Feb.1999
MITSUBISHI Nch POWER MOSFET
FK30SM-6
HIGH-SPEED SWITCHING USE
DRAIN-SOURCE BREAKDOWN VOLTAGE V (BR) DSS (25°C)
DRAIN-SOURCE BREAKDOWN VOLTAGE V (BR) DSS (t°C)
BREAKDOWN VOLTAGE VS. CHANNEL TEMPERATURE (TYPICAL) VGS = 0V ID = 1mA 1.2 REVERSE RECOVERY TIME trr (ns) 1.4
1.0
3 2 102 trr 7 5 3 2 101 100 23 5 7 101
3 2 101 7 5 3 2
0.8
Irr
0.6
0.4
–50
0
50
100
150
Tch = 25°C Tch = 150°C 100 23 5 7 102
CHANNEL TEMPERATURE Tch (°C) TRANSIENT THERMAL IMPEDANCE Zth (ch–c) (°C/W) DIODE REVERSE VS. SOURCE CURRENT dis/dt CHARACTERISTIC (TYPICAL) 5 5 3 2 trr 102 7 5 3 2 101 7 5 101 23 5 7 102 Irr IS = 30A VGS = 0V VDD = 150V 101 7 5 3 2 100 3 2
SOURCE CURRENT IS (A) TRANSIENT THERMAL IMPEDANCE CHARACTERISTICS 101 7 5 3 2
REVERSE RECOVERY CURRENT Irr (A)
REVERSE RECOVERY TIME trr (ns)
Tch = 25°C 7 Tch = 150°C 5 23 5 7 103
100 7 D=1 5 3 0.5 2 0.2 –1 10 7 0.1 5 3 2
PDM
tw T
0.05 D= tw 0.02 T 0.01 Single Pulse 10–2 10–4 2 3 5710–3 2 3 5710–22 3 5710–12 3 57 100 2 3 57 101 2 3 57 102 PULSE WIDTH tw (s)
SOURCE CURRENT dis/dt (–A/µs)
REVERSE RECOVERY CURRENT Irr (A)
Feb.1999
DIODE REVERSE VS. SOURCE CURRENT CHARACTERISTIC (TYPICAL) 102 103 dis/dt = –100A/µs 7 7 VGS = 0V 5 5 VDD = 150V
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