JAN06 (1/6) MITSUBISHI (OPTICAL DEVICES)
FU-48SDF-x31M4yF
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL DESCRIPTION Module type FU-48SDF-x31M4yF is a cooled butterfly packaged 1.3μm DFB-LD module with single-mode optical fiber. This module is suitable for a light source of analog applications such CATV systems.
FEATURES • High liniality multi quantum wells (MQW) DFB-LD • Emission wavelength is in 1.3μm band • Built-in optical isolator • Thermo electric cooler for laser temperature control • With photodiode for optical output monitor • RoHS (2002/95/EC) compliant
APPLICATION CATV. Analog transmission systems
ABSOLUTE MAXIMUM RATINGS (Tld=25°C) Parameter Symbol Conditions Rating Unit Laser diode Optical output power from fiber end Pf CW 20 mW Forward current If CW 150 mA Reverse voltage Vrl 2 V Photodiode Reverse voltage Vrd 20 V Forward current Ifd 2 mA Cooler Voltage Vpem 2.4 V (Note) Current Ipem 1.2 A Operating case temperature Tc -20 to 65 °C Storage temperature Tstg -40 to 70 °C Note. Even if the thermo-electric cooler (TEC) is operated within the rated conditions, uncontrolled current loading or operation without heat sink may easily damage the module by exceeding the storage temperature range. Thermistor resistance should be properly monitored by the feedback circuit during TEC operation to avoid the catastrophic damage.
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein without notice. No liability is assumed as a result of their use or application.
JAN06 (2/6) MITSUBISHI (OPTICAL DEVICES)
FU-48SDF-x31M4yF
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL ELECTRICAL/OPTICAL CHARACTERISTICS Parameter Symbol Threshold Current Operating Current Modulation Current Operating Voltage Output Power from Fiber End Input impedance Central Wavelength RF driver power Side Mode Suppression Ratio Cut-off Frequency Frequency response Ripple
Composite Second Order
Ith Iop Imod Vop Pf Zin λc RFin Sr fc(-1.5dB) ΔS21 CSO CTB CNR m Nr Er η
(Tld=25°C, Tc=25°C, unless otherwise noted) Condition Limits Min. Typ. Max. CW 10 20 CW 40 70 Imod = Iop-Ith Please see 'Type vs. CATV performance' CW, If = Iop (Note1) 1.3 1.8 CW, If = Iop Please see 'Type vs. CATV performance' If=Iop 25 CW, If = Iop 1300 1310 1320 terminate with 50ohm -20 -17 -12 by adding 25ohm serial resistor CW, If = Iop 30 35 If = Iop If = Iop f = 47~870MHz 112channel loading 55.25MHz~745.25MHz (6MHz spacing) If = Iop (Note2) 2 -0.5 3.5 -60 -70 0.5 -57 -65
Units mA mA mA V mW Ω nm dBm dB GHz dB dBc dBc
Composite Triple Order Carrier to Noise Ratio
Optical Modulation Depth
RIN (Note 3) Tracking Error(Note 4) Differential Efficiency
CW, If = Iop, f =40~870MHz Tc = -20~65°C, APC, ATC If(average) = Iop
Monitor Current Imon CW, If = Iop, Vrd = 5V Dark current( PD ) Id Vrd = 5V Capacitance ( PD ) Ct Vrd = 5V, f = 1MHz Isolation Iso Tc = 0 to 65°C Note1. If : LD forwad current Note2. Detailed test condition: Total loss includes the fiber loss. (Please see 'Type vs. performance'.) Receiver responsively = 0.9A/W 1/2 Input equivalent noise current = 7pA(Hz) Optical return loss of the connector should be greater than 40dB in order to get the specification performance. Note3. Relative intensity noise does not include shot noise of receiver. Note4. Er = MAX | 10*log(Pf/Pf(25°C))|
Please see dB 'Type vs. CATV performance' 2.9 3.0 3.3 % -160 -155 dB/Hz 0.3 0.5 dB Please see mW/mA 'Type vs. CATV performance' 0.1 2.5 mA 0.1 1 μA 10 20 pF 25 37 dB
TYPE VS. CATV PERFORMANCE (Tld=25°C, Tc=25°C Unless otherwise noted) Type Pf[mW] Imod[mA] CNR[dB] η[mW/mA] Min. Typ. Max Typ. Max Min. Typ. Max Min. Typ. -x31M40F 1.5 2 2.5 25 35 0.05 0.08 0.13 50 51 -x31M41F 2.5 3 4 25 35 0.07 0.12 0.16 52 53 -x31M42F 4 5 6 25 35 0.11 0.20 0.30 49.5 50.5 -x31M43F 6 6.5 8 30 40 0.15 0.23 0.40 50.5 51.5 -x31M44F 8 8.5 10 32 40 0.20 0.27 0.40 48 49 -x31M45F 10 10.5 13 35 45 0.22 0.30 0.40 49 50
Total loss[dB] Fiber length 5 5km 5 5km 8.5 15km 8.5 15km 12 26.5km 12 26.5km
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein without notice. No liability is assumed as a result of their use or application.
JAN06 (3/6) MITSUBISHI (OPTICAL DEVICES)
FU-48SDF-x31M4yF
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL THERMAL CHARACTERISTICS (Tld=25°C,Tc=-20~+65°C) Parameter Symbol Conditions Thermistor resistance B constant of thermistor resistance Cooling capacity Cooler current Cooler voltage Rth B ΔT Ipe Vpe Tld=25°C Tc=65°C ΔT=40K ΔT=40K Min. 9.5 40 Limits Typ. 10 3950 0.6 1.2 Units Max. 10.5 1 2 KΩ K K A V
OPTICAL FIBER SPECIFICATION Parameter Type Mode filed diameter Cladding diameter Jacket diameter Connector type Fiber pintail length Optical return loss to connector
Limits SM 9.5±1 125±2 900 typ. Pigtail without fiber, SC/PC, SC/APC, FC/APC Please see ' FC/APC connector specification' Lfiber = 1000+200/-0 (Lfiber is defined in the outline drawing.) SC/PC : 50dB min SC/APC and FC/APC : 60dB min
Unit μm μm μm mm -
FC/APC CONNECTOR SPECIFICATION (1) FC/APC CONNECTOR PARTS Part FC connector Ferrule Maker SEIKOH GIKEN Part No. PF11A FF3A
(2) FERRULE ENDFACE GEOMETRY Reference EB EO rEP EQ Dimensions 8° 50μmMAX 5~12mm ±0.1μm
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein without notice. No liability is assumed as a result of their use or application.
JAN06 (4/6) MITSUBISHI (OPTICAL DEVICES)
FU-48SDF-x31M4yF
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL DOCUMENTATION Threshold current(Ith) at Tc=25°C Operating current(Iop) at Tc=25°C Optical output power form fiber end(Pf) at Tc=25°C Central wavelength(λc) at Tc=25°C Monitor current(Imon) at Tc=25°C Differential efficiency(η) at Tc=25°C Side mode suppression ratio(Sr) at Tc=25°C Optical modulation(m) at Tc=25°C RF input power(RFin) at Tc=25°C Composite second order(CSOL2, CSOH41, CSOH78, CSOH123) at Tc=25°C Composite triple order(CTB2, CTB41, CTB78, CTB123) at Tc=25°C Carrier to noise ratio(CNR2, CNR41, CNR78, CNR123) at Tc=25°C Relative intensity noise(Nr2, Nr123) at Tc=25°C Pf - If graph at Tc=-20, 25, 65°C If - Vf graph at Tc=25°C dPf/dIf - If graph at Tc=25°C If - Imon graph at Tc=25°C
ORDERING INFORMATION
FU - 48SDF – _ 31M4 _ F
0 1 2 3 4 5 Output Power Range 1.5~2.5mW 2.5~4mW 4~6mW 6~8mW 8~10mW 10~13mW
W L Y
Connector SC/PC SC/APC FC/APC
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein without notice. No liability is assumed as a result of their use or application.
JAN06 (5/6) MITSUBISHI (OPTICAL DEVICES)
FU-48SDF-x31M4yF
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL OUTLINE DIAGRAM Unless otherwise noted +/-0.5mm (Unit : mm)
FU-48SDF-x31M4yF
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein without notice. No liability is assumed as a result of their use or application.
JAN06 (6/6) MITSUBISHI (OPTICAL DEVICES)
FU-48SDF-x31M4yF
1.3 μm DFB-LD MODULE WITH SINGLEMODE FIBER PIGTAIL Safety Cautions for Use of Optoelectronic Devices General:
Although the manufacturer is always striving to improve the reliability of its product, problems and errors may occur with semiconductor products. Therefore, the user's products are required to be designed with full safety regard to prevent any accidents that results in injury, death, fire or environmental damage even when semiconductor products happen to error. Especially it is recommended to take in consideration about redundancy, fire prevention, error prevention safeguards. And the following requirements must be strictly observed.
Warning! 1. Eye safety : Seminductor laser radiates laser light during operation. Laser light is very dangerous when shot directly into human
eyes. Don't look at laser light directly, or through optics such as a lens. The laser light should be observed using the ITV camera, IRviewer, or other appropriate instruments. 2. Product handling : The product contains GaAs (gallium arsenide). It is safe for regular use, but harmful to the human body if made into powder or steam. Be sure to avoid dangerous process like smashing, burning, chemical etching. Never put this product in one's mouth or swallow it. 3. Product disposal : This product must be disposed of as special industrial waste. It is necessary to separate it from general industrial waste and general garbage.
Handling Cautions for Optoelectronic Devices 1. General:
(1) The products described in this specification are designed and manufactured for use in general communication systems or electronic devices, unless their applications or reliability are otherwise specified. Therefore, they are not designed or manufactured for installation in devices or systems that may affect human life or that are used in social infrastructure requiring high reliability. (2) When the customer is considering to use the products in special applications, such as transportation systems (automobiles, trains, vessels), medical equipments, aerospace, nuclear power control, and submarine repeaters or systems, please contact Mitsubishi Electric or an authorized distributor.
2. Shipping Conditions:
(1) During shipment, place the packing boxes in the correct direction, and fix them firmly to keep them immovable. Placing the boxes upside down, tilting, or applying abnormal pressure onto them may cause deformation in the electrode terminals, breaking of optical fiber, or other problems. (2) Never throw or drop the packing boxes. Hard impact on the boxes may cause break of the devices. (3) Take strict precautions to keep the devices dry when shipping under rain or snow.
3. Storage Conditions:
When storing the products, it is recommended to store them following the conditions described below without opening the packing. Not taking enough care in storing may result in defects in electrical characteristics, soldering quality, visual appearance, and so on. The main points are described below (if special storage conditions are given to the product in the specification sheet, they have priority over the following general cautions): (1) Appropriate temperature and humidity conditions, i.e., temperature range between 5~30°C, and humidity between 40~60 percent RH, should be maintained in storage locations. Controlling the temperature and humidity within this range is particularly important in case of long-term storage for six months or more. (2) The atmosphere should be particularly free from toxic gases and dust. (3) Do not apply any load on the product. (4) Do not cut or bend the leads of the devices which are to be stored. This is to prevent corrosion in the cut or bent part of the lead causing soldering problems in the customer’s assembling process. (5) Sudden change in temperature may cause condensation in the product or packing, therefore, such locations should be avoided for storing. Temperature in storage locations should be stable. (6) When storing ceramic package products for extended periods of time, the leads may turn reddish due to reaction with sulfur in the atmosphere. (7) Storage conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products require stricter controls than package sealed products.
4. Design Conditions and Environment under Use:
(1) Avoid use in locations where water or organic solvents adhere directly to the product, or where there is any possibility of the generation of corrosive gas, explosive gas, dust, salinity, or other troublesome conditions. Such environments will not only significantly lower the reliability, but also may lead to serious accidents. (2) Operation in excess of the absolute maximum ratings can cause permanent damage to the device. The customers are requested to design not to exceed those ratings even for a short time.
5. ESD Safety Cautions:
The optoelectronic devices are sensitive to static electricity (ESD, electro-static discharge). The product can be broken by ESD. When handling this product, please observe the following countermeasures: To prevent break of devices by static electricity or surge, please adopt the following countermeasures in the assembly line: (1) Ground all equipments, machinery jigs, and tools in the process line with earth wires installed in them. Take particular care with hot plates, solder irons and other items for which the commercial power supplies are prone to leakage. (2) Workers should always use earth bands. Use of antistatic clothing, electric conductive shoes, and other safety equipment while at work is highly recommended. (3) Use conductive materials for this product’s container, etc. (4) It is recommended that grounding mats be placed on the surfaces of assembly line workbench and the surrounding floor in work area, etc. (5) When mounting this product in parts or materials which can be electrically charged (printed wiring boards, plastic products, etc.), pay close attention to the static electricity in those parts. ESD may damage the product. (6) Humidity in working environment should be controlled to be 40 percent RH or higher. These countermeasures are most general, and there is a need to carefully confirm the line before starting mass production using this product (in the trial production, etc.). It is extremely important to prevent surge, eliminate it rapidly, and prevent it from spreading.
Mitsubishi Electric Corporation reserves the right to make changes to the products or information contained herein without notice. No liability is assumed as a result of their use or application.
