FX50SMJ-06

P ion. hange. icat ecif ct to c l sp je fina re sub a not sa is is ric limit t : Th tice arame No e p Som IM REL Y NAR I MITSUBISHI Pch POWER MOSFET FX50SMJ-06 HIGH-SPEED SWITCHING USE FX50SMJ-06 OUTLINE DRAWING 15.9 max Dimensions in mm 4.5 1.5 4 2 2 4 20.0 φ 3.2 5.0 19.5 min 4.4 G 0.6 2.8 1.0 1 2 3 5.45 5.45 4 3 • 4V DRIVE • VDSS ............................................................... –60V • rDS (ON) (MAX) ............................................. 18.9mΩ • ID .................................................................... –50A • Integrated Fast Recovery Diode (TYP.) ...........70ns APPLICATION Motor control, Lamp control, Solenoid control DC-DC converter, etc. 1 1 2 3 4 24 GATE DRAIN SOURCE DRAIN TO-3P MAXIMUM RATINGS Symbol VDSS VGSS ID IDM IDA IS ISM PD Tch Tstg — (Tc = 25°C) Parameter Drain-source voltage Gate-source voltage VGS = 0V VDS = 0V Conditions Ratings –60 ±20 –50 –200 –50 –50 –200 150 –55 ~ +150 –55 ~ +150 Unit V V A A A A A W °C °C g Jan.1999 Drain current Drain current (Pulsed) Avalanche drain current (Pulsed) L = 50µH Source current Source current (Pulsed) Maximum power dissipation Channel temperature Storage temperature Weight Typical value 4.8 P ion. hange. icat ecif ct to c l sp je fina re sub a not sa is is ric limit t : Th tice arame No e p Som IM REL Y NAR I MITSUBISHI Pch POWER MOSFET FX50SMJ-06 HIGH-SPEED SWITCHING USE ELECTRICAL CHARACTERISTICS Symbol V (BR) DSS IGSS IDSS VGS (th) rDS (ON) rDS (ON) VDS (ON) yfs Ciss Coss Crss td (on) tr td (off) tf VSD Rth (ch-c) trr Parameter (Tch = 25°C) Test conditions ID = –1mA, VGS = 0V VGS = ±20V, VDS = 0V VDS = –60V, VGS = 0V ID = –1mA, VDS = –10V ID = –25A, VGS = –10V ID = –25A, VGS = –4V ID = –25A, VGS = –10V ID = –25A, VDS = –10V VDS = –10V, VGS = 0V, f = 1MHz Limits Min. –60 — — –1.3 — — — — — — — — — — — — — — Typ. — — — –1.8 15.0 23 –0.38 49.1 11610 1355 687 73 137 822 320 –1.0 — 70 Max. — ±0.1 –0.1 –2.3 18.9 32 –0.47 — — — — — — — — –1.5 0.83 — Unit V µA mA V mΩ mΩ V S pF pF pF ns ns ns ns V °C/W ns Drain-source breakdown voltage Gate-source leakage current Drain-source leakage current Gate-source threshold voltage Drain-source on-state resistance Drain-source on-state resistance Drain-source on-state voltage Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Source-drain voltage Thermal resistance Reverse recovery time VDD = –30V, ID = –25A, VGS = –10V, RGEN = RGS = 50Ω IS = –25A, VGS = 0V Channel to case IS = –50A, dis/dt = 100A/µs PERFORMANCE CURVES POWER DISSIPATION DERATING CURVE 250 POWER DISSIPATION PD (W) DRAIN CURRENT ID (A) MAXIMUM SAFE OPERATING AREA –3 –2 tw = 10µs 100µs 1ms 200 –102 –7 –5 –3 –2 150 –101 –7 –5 –3 –2 TC = 25°C Single Pulse 10ms DC 100 50 –100 –7 –5 –3 –2 –3 –5–7–100 –2 –3 –5–7–101 –2 –3 –5–7–102 –2 0 0 50 100 150 200 CASE TEMPERATURE TC (°C) DRAIN-SOURCE VOLTAGE VDS (V) OUTPUT CHARACTERISTICS (TYPICAL) –100 VGS = –10V –6V –8V –5V OUTPUT CHARACTERISTICS (TYPICAL) –50 VGS = –10V –4V DRAIN CURRENT ID (A) DRAIN CURRENT ID (A) –80 –40 –8V –6V –60 –4V –40 Tc = 25°C Pulse Test –20 PD = 150W –3V –30 –5V –20 –3V –10 Tc = 25°C Pulse Test 0 0 –1.0 –2.0 –3.0 –4.0 –5.0 0 0 –0.4 –0.8 –1.2 –1.6 –2.0 DRAIN-SOURCE VOLTAGE VDS (V) DRAIN-SOURCE VOLTAGE VDS (V) Jan.1999 P ion. hange. icat ecif ct to c l sp je fina re sub a not sa is is ric limit t : Th tice arame No e p Som IM REL Y NAR I MITSUBISHI Pch POWER MOSFET FX50SMJ-06 HIGH-SPEED SWITCHING USE ON-STATE RESISTANCE VS. DRAIN CURRENT (TYPICAL) 40 Tc = 25°C Pulse Test ON-STATE VOLTAGE VS. GATE-SOURCE VOLTAGE (TYPICAL) –5.0 Tc = 25°C Pulse Test DRAIN-SOURCE ON-STATE RESISTANCE rDS (ON) (mΩ) DRAIN-SOURCE ON-STATE VOLTAGE VDS (ON) (V) –4.0 32 VGS = –4V –3.0 24 –10V –2.0 ID = –100A –50A –25A 16 –1.0 8 0 0 –2 –4 –6 –8 –10 00 –10 –2 –3 –5 –7 –101 –2 –3 –5 –7 –102 GATE-SOURCE VOLTAGE VGS (V) DRAIN CURRENT ID (A) TRANSFER CHARACTERISTICS (TYPICAL) –100 Tc = 25°C VDS = –10V Pulse Test FORWARD TRANSFER ADMITTANCE VS.DRAIN CURRENT (TYPICAL) 102 7 5 4 3 2 TC = 25°C 75°C 125°C DRAIN CURRENT ID (A) –60 FORWARD TRANSFER ADMITTANCE yfs (S) –80 101 7 5 4 3 2 VDS = –10V Pulse Test –40 –20 0 0 –2 –4 –6 –8 –10 100 0 –10 –2 –3 –4 –5 –7–101 –2 –3 –4–5 –7–102 GATE-SOURCE VOLTAGE VGS (V) DRAIN CURRENT ID (A) CAPACITANCE VS. DRAIN-SOURCE VOLTAGE (TYPICAL) 2 SWITCHING CHARACTERISTICS (TYPICAL) 103 7 5 4 3 2 tr td(off) tf 105 7 5 3 2 Ciss 104 7 5 3 2 SWITCHING TIME (ns) Tch = 25°C f = 1MHZ VGS = 0V CAPACITANCE Ciss, Coss, Crss (pF) 102 7 5 4 3 2 td(on) Tch = 25°C VGS = –10V VDD = –30V RGEN = RGS = 50Ω –2 –3 –4 –5 –7 –101 –2 –3 –4 –5 –7 103 7 5 Coss Crss 3 2 –3 –5–7–100 –2 –3 –5–7–101 –2 –3 –5–7–102 –2 –3 101 –7 –100 DRAIN-SOURCE VOLTAGE VDS (V) DRAIN CURRENT ID (A) Jan.1999 P ion. hange. icat ecif ct to c l sp je fina re sub a not sa is is ric limit t : Th tice arame No e p Som IM REL Y NAR I MITSUBISHI Pch POWER MOSFET FX50SMJ-06 HIGH-SPEED SWITCHING USE SOURCE-DRAIN DIODE FORWARD CHARACTERISTICS (TYPICAL) –100 VGS = 0V Pulse Test GATE-SOURCE VOLTAGE VS.GATE CHARGE (TYPICAL) GATE-SOURCE VOLTAGE VGS (V) –10 Tch = 25°C ID = –50A SOURCE CURRENT IS (A) –8 VDS = –10V –20V –40V –80 TC = 125°C 75°C –6 –60 25°C –4 –40 –2 –20 0 0 40 80 120 160 200 0 0 –0.4 –0.8 –1.2 –1.6 –2.0 GATE CHARGE Qg (nC) SOURCE-DRAIN VOLTAGE VSD (V) DRAIN-SOURCE ON-STATE RESISTANCE rDS (ON) (25°C) DRAIN-SOURCE ON-STATE RESISTANCE rDS (ON) (t°C) ON-STATE RESISTANCE VS. CHANNEL TEMPERATURE (TYPICAL) 101 –4.0 7 5 4 3 2 VGS = –10V ID = 1/2ID Pulse Test THRESHOLD VOLTAGE VS. CHANNEL TEMPERATURE (TYPICAL) VDS = –10V ID = –1mA GATE-SOURCE THRESHOLD VOLTAGE VGS (th) (V) –3.2 –2.4 100 7 5 4 3 2 –1.6 –0.8 10–1 –50 0 50 100 150 0 –50 0 50 100 150 CHANNEL TEMPERATURE Tch (°C) CHANNEL TEMPERATURE Tch (°C) DRAIN-SOURCE BREAKDOWN VOLTAGE V (BR) DSS (25°C) TRANSIENT THERMAL IMPEDANCE Zth (ch–c) (°C/W) DRAIN-SOURCE BREAKDOWN VOLTAGE V (BR) DSS (t°C) BREAKDOWN VOLTAGE VS. CHANNEL TEMPERATURE (TYPICAL) 1.4 VGS = 0V ID = –1mA TRANSIENT THERMAL IMPEDANCE CHARACTERISTICS 101 7 5 3 2 1.2 100 D = 1.0 7 5 3 2 0.5 0.2 0.1 0.05 0.02 0.01 Single Pulse PDM tw T D= tw T 1.0 0.8 10–1 7 5 3 2 0.6 0.4 –50 0 50 100 150 10–2 –4 10 2 3 5 710–3 2 3 5 710–2 2 3 5 710–1 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102 PULSE WIDTH tw (s) Jan.1999 CHANNEL TEMPERATURE Tch (°C)