DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
M2S56D20/ 30/ 40AKT
MITSUBISHI LSIs
256M Double Data Rate Synchronous DRAM
PRELIMINARY
Some of contents are subject to change without notice.
DESCRIPTION
M2S56D20AKT is a 4-bank x 16,777,216-word x 4-bit, M2S56D30AKT is a 4-bank x 8,388,608-word x 8-bit, M2S56D40AKT is a 4-bank x 4,194,304-word x 16-bit, double data rate synchronous DRAM, with SSTL_2 interface. All control and address signals are referenced to the rising edge of CLK. Input data is registered on both edges of data strobe, and output data and data strobe are referenced on both edges of CLK. The M2S56D20/30/40AKT achieves very high speed data rate up to 133MHz, and are suitable for main memory in computer systems.
FEATURES
- Vdd=Vddq=2.5V+0.2V - Double data rate architecture; two data transfers per clock cycle - Bidirectional, data strobe (DQS) is transmitted/received with data - Differential clock inputs (CLK and /CLK) - DLL aligns DQ and DQS transitions with CLK transitions edges of DQS - Commands entered on each positive CLK edge; - data and data mask referenced to both edges of DQS - 4 bank operation controlled by BA0, BA1 (Bank Address) - /CAS latency- 2.0/2.5 (programmable) - Burst length- 2/4/8 (programmable) - Burst type- sequential / interleave (programmable) - Auto precharge / All bank precharge controlled by A10 - 8192 refresh cycles /64ms (4 banks concurrent refresh) - Auto refresh and Self refresh - Row address A0-12 / Column address A0-9,11(x4)/ A0-9(x8)/ A0-8(x16) - SSTL_2 Interface - 400-mil, 66-pin Thin Small Outline Package (TSOP II) - JEDEC standard
Operating Frequencies
Speed Grade -75A -75 -10 Clock Rate CL=2 * 133MHz 100MHz 100MHz CL=2.5 * 133MHz 133MHz 125MHz * CL = CAS(Read) Latency
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
M2S56D20/ 30/ 40AKT
PIN CONFIGURATION(TOP VIEW) X4 X8 X 16
MITSUBISHI LSIs
256M Double Data Rate Synchronous DRAM
VDD NC VDDQ NC DQ0 VSSQ NC NC VDDQ NC DQ1 VSSQ NC VDDQ NC NC VDD NC NC /WE /CAS /RAS /CS NC BA0 BA1 A10/AP A0 A1 A2 A3 VDD
VDD DQ0 VDDQ NC DQ1 VSSQ NC DQ2 VDDQ NC DQ3 VSSQ NC VDDQ NC NC VDD NC NC /WE /CAS /RAS /CS NC BA0 BA1 A10/AP A0 A1 A2 A3 VDD
VDD DQ0 VDDQ DQ1 DQ2 VSSQ DQ3 DQ4 VDDQ DQ5 DQ6 VSSQ DQ7 VDDQ LDQS NC VDD NC LDM /WE /CAS /RAS /CS NC BA0 BA1 A10/AP A0 A1 A2 A3 VDD
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
VSS DQ15 VSSQ DQ14 DQ13 VDDQ DQ12 DQ11 VSSQ DQ10 DQ9 VDDQ DQ8 VSSQ UDQS NC VREF VSS UDM /CLK CLK CKE NC A12 A11 A9 A8 A7 A6 A5 A4 VSS
VSS VSS DQ7 NC VSSQ VSSQ NC NC DQ6 DQ3 VDDQ VDDQ NC NC DQ5 NC VSSQ VSSQ NC NC DQ4 DQ2 VDDQ VDDQ NC NC VSSQ VSSQ DQS DQS NC NC VREF VREF VSS VSS DM DM /CLK /CLK CLK CLK CKE CKE NC NC A12 A12 A11 A11 A9 A9 A8 A8 A7 A7 A6 A6 A5 A5 A4 A4 VSS VSS
64pin STSOP
PIN PITCH 0.4 mm
CLK,/CLK CKE /CS /RAS /CAS /WE DQ0-7 DQS DM Vref
: Master Clock : Clock Enable : Chip Select : Row Address Strobe : Column Address Strobe : Write Enable : Data I/O : Data Strobe : Write Mask : Reference Voltage
A0-12 BA0,1 Vdd VddQ Vss VssQ
: Address Input : Bank Address Input : Power Supply : Power Supply for Output : Ground : Ground for Output
MITSUBISHI ELECTRIC
2
DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
M2S56D20/ 30/ 40AKT
MITSUBISHI LSIs
256M Double Data Rate Synchronous DRAM
PIN FUNCTION
SYMBOL TYPE DESCRIPTION
CLK, /CLK
Input
Clock: CLK and /CLK are differential clock inputs. All address and control input signals are sampled on the crossing of the positive edge of CLK and negative edge of /CLK. Output (read) data is referenced to the crossings of
CLK and /CLK (both directions of crossing). Clock Enable: CKE controls internal clock. When CKE is low, internal clock for the following cycle is ceased. CKE is also used to select auto / self refresh. After self refresh mode is started, CKE becomes asynchronous input. Self refresh is maintained as long as CKE is low. Chip Select: When /CS is high, any command means No Operation. Combination of /RAS, /CAS, /WE defines basic commands. A0-11 specify the Row / Column Address in conjunction with BA0,1. The Row Address is specified by A0-12. The Column Address is specified by A0-9,11(x4), A0-9(x8) and A0-8(x16). A10 is also used to indicate precharge option. When A10 is high at a read / write command, an auto precharge is performed. When A10 is high at a precharge command, all banks are precharged. Bank Address: BA0,1 specifies one of four banks to which a command is applied. BA0,1 must be set with ACT, PRE, READ, WRITE commands. Data Input/Output: Data bus
CKE
Input
/CS /RAS, /CAS, /WE
Input Input
A0-12
Input
BA0,1 DQ0-15(x16), DQ0-7(x8), DQ0-3(x4),
Input
Input / Output
DQS
Input / Output
Data Strobe: Output with read data, input with write data. Edge-aligned with read data, centered in write data. Used to capture write data. For the x16, LDQS corresponds to the data on DQ0-DQ7; UDQS correspond to the data on DQ8-DQ15 Input Data Mask: DM is an input mask signal for write data. Input data is masked when DM is sampled HIGH along with that input data during a WRITE access. DM is sampled on both edges of DQS. Although DM pins are input only, the DM loading matches the DQ and DQS loading. For the x16, LDM corresponds to the data on DQ0-DQ7; UDM corresponds to the data on DQ8-DQ15. Power Supply for the memory array and peripheral circuitry. VddQ and VssQ are supplied to the Output Buffers only. SSTL_2 reference voltage.
DM
Input
Vdd, Vss VddQ, VssQ Vref
Power Supply Power Supply Input
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
BLOCK DIAGRAM
DLL
DQ0 - 15
UDQS,LDQS
I/O Buffer
QS Buffer
Memory Array Bank #0
Memory Array Bank #1
Memory Array Bank #2
Memory Array Bank #3
Mode Register Control Circuitry
Address Buffer Clock Buffer A 0-12 BA0,1 C L K /C L K C K E /CS
Control Signal Buffer
/RAS /CAS
/ WE
UDM, LDM
Type Designation Code
This rule is applied to only Synchronous DRAM family.
M 2 S 56 D 3 0 A TP –75A
Speed Grade 10: 125 MHz@CL=2.5,100MHz@CL=2.0 75: 133 MHz@CL=2.5,100MHz@CL=2.0 75 A: 133MHz@CL=2.5,133MHz@CL=2.0 Package Type TP: TSOP(II) Process Generation Function Reserved for Future Use n Organization 2 2: x4, 3: x8, 4: x16 D DR Synchronous DRAM Density 56: 256M bits Interface V:LVTTL, S:SSTL_3, _2
Memory Style (DRAM) Mitsubishi Main Designation
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
BASIC FUNCTIONS
The M2S56D20/30/40AKT provides basic functions, bank (row) activate, burst read / write, bank (row) precharge, and auto / self refresh. Each command is defined by control signals of /RAS, /CAS and /WE at CLK rising edge. In addition to 3 signals, /CS ,CKE and A10 are used as chip select, refresh option, and precharge option, respectively. To know the detailed definition of commands, please see the command truth table.
/CLK CLK /CS /RAS /CAS /WE CKE A10
Chip Select : L=select, H=deselect Command Command Command Refresh Option @refresh command Precharge Option @precharge or read/write command define basic commands
Activate (ACT) [/RAS =L, /CAS =/WE =H] ACT command activates a row in an idle bank indicated by BA. Read (READ) [/RAS =H, /CAS =L, /WE =H] READ command starts burst read from the active bank indicated by BA. First output data appears after /CAS latency. When A10 =H at this command, the bank is deactivated after the burst read (autoprecharge, R EADA )
Write (WRITE) [/RAS =H, /CAS =/WE =L] WRITE command starts burst write to the active bank indicated by BA. Total data length to be written is set by burst length. When A10 =H at this command, the bank is deactivated after the burst write (auto-precharge, W RITEA )
Precharge (PRE) [/RAS =L, /CAS =H, /WE =L] PRE command deactivates the active bank indicated by BA. This co mmand also terminates burst read /write operation. When A10 =H at this command, all banks are deactivated (precharge all, P REA ). A uto-Refresh (REFA) [/RAS =/CAS =L, /WE =CKE =H] REFA command starts auto-refresh cycle. Refresh address including bank address are generated internally. After this command, the banks are precharged automatically.
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
COMMAND TRUTH TABLE
COMMAND Deselect No Operation Row Address Entry & Bank Activate Single Bank Precharge Precharge All Banks Column Address Entry & Write Column Address Entry & Write with Auto-Precharge Column Address Entry & Read Column Address Entry & Read with Auto-Precharge Auto-Refresh Self-Refresh Entry Self-Refresh Exit Burst Terminate Mode Register Set REFA REFS REFSX TERM MRS H H L L H H H L H H H H L L H L L L L L X H H L L L X H H L H H X H L L X X X X X L X X X X X L X X X X X V 1 2 READA H H L H L H V H V READ H H L H L H V L V MNEMONIC DESEL NOP ACT PRE PREA WRITE WRITEA CKE n-1 H H H H H H H CKE n X X H H H H H /CS H L L L L L L /RAS X H L L L H H /CAS X H H H H L L /WE X H H L L L L BA0,1 X X V V X V V A10 /AP X X V L H L H A0-9, 11-12 X X V X X V V note
H=High Level, L=Low Level, V=Valid, X=Don't Care, n=CLK cycle number NOTE: 1. Applies only to read bursts with autoprecharge disabled; this command is undefined (and should not be used) for read bursts with autoprecharge enabled, and for write bursts. 2. BA0-BA1 select either the Base or the Extended Mode Register (BA0 = 0, BA1 = 0 selects Mode Register;BA0=1 , BA1 = 0 selects Extended Mode Register; other combinations of BA0-BA1 are reserved; A0-A12 provide the op-code to be written to the selected Mode Register.
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
FUNCTION TRUTH TABLE
Current State IDLE / C S /RAS H L L L L L L L ROW ACTIVE H L L L L L L L L READ(AutoPrecharge Disabled) H L L L L L L L L X H H H L L L L X H H H H L L L L X H H H H L L L L / C A S / W E Address X H H L H H L L X H H L L H H L L X H H L L H H L L X H L X H L H L X H L H L H L H L X H L H L H L H L X X BA BA, CA, A10 BA, RA BA, A10 X Op-Code, ModeAdd X X BA BA, CA, A10 BA, CA, A10 BA, RA BA, A10 X Op-Code, ModeAdd X X BA BA, CA, A10 BA, CA, A10 BA, RA BA, A10 X Op-Code, ModeAdd Command DESEL NOP TERM READ / WRITE ACT PRE / PREA REFA MRS DESEL NOP TERM READ / READA WRITE / WRITEA ACT PRE / PREA REFA MRS DESEL NOP TERM READ / READA WRITE / WRITEA ACT PRE / PREA REFA MRS Action NOP NOP ILLEGAL ILLEGAL Bank Active, Latch RA NOP Auto-Refresh Mode Register Set NOP NOP NOP Begin Read, Latch CA, Determine Auto-Precharge Begin Write, Latch CA, Determine Auto-Precharge Bank Active / ILLEGAL Precharge / Precharge All ILLEGAL ILLEGAL NOP (Continue Burst to END) NOP (Continue Burst to END) Terminate Burst Terminate Burst, Latch CA, Begin New Read, Determine AutoPrecharge ILLEGAL Bank Active / ILLEGAL Terminate Burst, Precharge ILLEGAL ILLEGAL 2 3 2 4 5 5 2 2 Notes
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
FUNCTION TRUTH TABLE (continued)
Current State WRITE(AutoPrecharge Disabled) /CS /RAS /CAS /WE Address H L L L L L L L L H READ with Auto-Precharge L L L L L L L L WRITE with Auto-Precharge H L L L L L L L L X H H H H L L L L X H H H H L L L L X H H H H L L L L X H H L L H H L L X H H L L H H L L X H H L L H H L L X H L H L H L H L X H L H L H L H L X H L H L H L H L X X BA BA, CA, A10 BA, CA, A10 BA, RA BA, A10 X Command DESEL NOP TERM READ / READA WRITE / WRITEA ACT PRE / PREA REFA Action NOP (Continue Burst to END) NOP (Continue Burst to END) ILLEGAL Terminate Burst, Latch CA, Begin Read, Determine Auto-Precharge Terminate Burst, Latch CA, Begin Write, Determine Auto-Precharge Bank Active / ILLEGAL Terminate Burst, Precharge ILLEGAL ILLEGAL NOP (Continue Burst to END) NOP (Continue Burst to END) ILLEGAL ILLEGAL for Same Bank ILLEGAL for Same Bank Bank Active / ILLEGAL Precharge / ILLEGAL ILLEGAL ILLEGAL NOP (Continue Burst to END) NOP (Continue Burst to END) ILLEGAL ILLEGAL for Same Bank ILLEGAL for Same Bank Bank Active / ILLEGAL Precharge / ILLEGAL ILLEGAL ILLEGAL 7 7 2 2 6 6 2 2 3 3 2 Notes
Op-Code, ModeMRS Add X DESEL X BA BA, CA, A10 BA, CA, A10 BA, RA BA, A10 X NOP TERM READ / READA WRITE / WRITEA ACT PRE / PREA REFA
Op-Code, ModeMRS Add X X BA BA, CA, A10 BA, CA, A10 BA, RA BA, A10 X DESEL NOP TERM READ / READA WRITE / WRITEA ACT PRE / PREA REFA
Op-Code, ModeMRS Add
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
FUNCTION TRUTH TABLE (continued)
Current State PRECHARGING /CS /RAS /CAS /WE Address H L L L L L L L ROW ACTIVATING H L L L L L L L WRITE RECOVERING H L L L L L L L X H H H L L L L X H H H L L L L X H H H L L L L X H H L H H L L X H H L H H L L X H H L H H L L X H L X H L H L X H L X H L H L X H L X H L H L X X BA BA, CA, A10 BA, RA BA, A10 X Command DESEL NOP TERM READ / WRITE ACT PRE / PREA REFA Action NOP (Idle after tRP) NOP (Idle after tRP) ILLEGAL ILLEGAL ILLEGAL NOP (Idle after tRP) ILLEGAL ILLEGAL NOP (Row Active after tRCD) NOP (Row Active after tRCD) ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL NOP NOP ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL 2 2 2 2 2 2 2 2 2 2 2 4 Notes
Op-Code, ModeMRS Add X X BA BA, CA, A10 BA, RA BA, A10 X DESEL NOP TERM READ / WRITE ACT PRE / PREA REFA
Op-Code, ModeMRS Add X DESEL X BA BA, CA, A10 BA, RA BA, A10 X NOP TERM READ / WRITE ACT PRE / PREA REFA
Op-Code, ModeMRS Add
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
FUNCTION TRUTH TABLE (continued)
Current State REFRESHING / C S /RAS /CAS / W E Address H L L L L L L L MODE REGISTER SETTING H L L L L L L L X H H H L L L L X H H H L L L L X H H L H H L L X H H L H H L L X H L X H L H L X H L X H L H L X X BA BA, CA, A10 BA, RA BA, A10 X Command DESEL NOP TERM READ / WRITE ACT PRE / PREA REFA Action NOP (Idle after tRC) NOP (Idle after tRC) ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL NOP (Row Active after tRSC) NOP (Row Active after tRSC) ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL Notes
Op-Code, ModeMRS Add X X BA BA, CA, A10 BA, RA BA, A10 X DESEL NOP TERM READ / WRITE ACT PRE / PREA REFA
Op-Code, ModeMRS Add
A BBREVIATIONS: H=High Level, L=Low Level, X=Don't Care BA=Bank Address, RA=Row Address, CA=Column Address, NOP=No Operation
NOTES: 1. All entries assume that CKE was High during the preceding clock cycle and the current clock cycle. 2. ILLEGAL to bank in specified state; function may be legal in the bank indicated by BA, depending on the state of that bank. 3. Must satisfy bus contention, bus turn around, write recovery requirements. 4. NOP to bank precharging or in idle state. May precharge bank indicated by BA. 5. ILLEGAL if any bank is not idle. 6. Refer to Read with Auto -Precharge in page 24. 7. Refer to Write with Auto-Precharge in page 26. ILLEGAL = Device operation and/or data-integrity are not guaranteed.
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
FUNCTION TRUTH TABLE for CKE
Current State CKE n-1 H L L L L L L H L L H H H H H H H L H ANY STATE other than listed above L L H L X X X X X X X X X X Exit CLK Suspend at Next Cycle Maintain CLK Suspend 3 H L X X X X X Begin CLK Suspend at Next Cycle 3 CKE n X H H H H H L X H L H L L L L L L X H /CS X H L L L L X X X X X L H L L L L X X /RAS X X H H H L X X X X X L X H H H L X X /CAS X X H H L X X X X X X L X H H L X X X /WE X X H L X X X X X X X H X H L X X X X Address X X X X X X X X X X X X X X X X X X X INVALID Exit Self-Refresh (Idle after tRC) Exit Self-Refresh (Idle after tRC) ILLEGAL ILLEGAL ILLEGAL NOP (Maintain Self-Refresh) INVALID Exit Power Down to Idle NOP (Maintain Self-Refresh) Refer to Function Truth Table Enter Self-Refresh Enter Power Down Enter Power Down ILLEGAL ILLEGAL ILLEGAL Refer to Current State =Power Down Refer to Function Truth Table 2 2 2 2 2 2 2 2 Action Notes 1 1 1 1 1 1 1
SELFREFRESHING
POWER DOWN
ALL BANKS IDLE
ABBREVIATIONS: H=High Level, L=Low Level, X=Don't Care
NOTES: 1. CKE Low to High transition will re-enable CLK and other inputs asynchronously. A minimum setup time must be satisfied before any command other than EXIT. 2. Power-Down and Self-Refresh can be entered only from the All Banks Idle State. 3. Must be legal command.
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
SIMPLIFIED STATE DIAGRAM
POWER APPLIED
POWER ON
PRE
PREA
CHARGE ALL
SELF REFRESH
REFS MRS REFSX
MODE REGISTER SET
MRS
IDLE
REFA
AUTO REFRESH
CKEL CKEH
Active Power Down
CKEL CKEH ACT
POWER DOWN
ROW ACTIVE
WRITE WRITE WRITEA READA READ READ READ
BURST STOP
WRITE
READ
TERM
WRITEA READA
READA
WRITEA
PRE
PRE PRE
READA
PRE CHARGE Automatic Sequence Command Sequence
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
POWER ON SEQUENCE
Before starting normal operation, the following power on sequence is necessary to prevent a SDRAM from damaged or multifunctioning. 1. Apply VDD before or the same time as VDDQ 2. Apply VDDQ before or at the same time as VTT & Vref 3. Maintain stable condition for 200us after stable power and CLK, apply NOP or DSEL 4. Issue precharge command for all banks of the device 5. Issue EMRS 6. Issue MRS for the Mode Register and to reset the DLL 7. Issue 2 or more Auto Refresh commands 8. Maintain stable condition for 200 cycle After these sequence, the DDR SDRAM is idle state and ready for normal operation.
MODE REGISTER
Burst Length, Burst Type and /CAS Latency can be programmed by setting the mode register (MRS). The mode register stores these data until the next MRS command, which may be issued when both banks are in idle state. After tMRD from a MRS command, the DDR SDRAM is ready for new command.
BA1 BA0 A12 A11 A10 A 9 0 0 0 0 0 0 A8 DR A7 0 A6 A5 A4 A3 BT A2 A1 BL A0
CLK /CLK /CS /RAS /CAS /WE BA0 BA1 LTMODE A11-A0
V
CL 000 001 010 Latency Mode 011 100 101 110 111 0 1
/CAS Latency R R 2 R R R 2.5 R Burst Type NO YES Burst Length
BL 000 001 010 011 100 101 110 111 0 1
BT=0 R 2 4 8 R R R R
BT=1 R 2 4 8 R R R R
Sequential Interleaved
DLL Reset
R: Reserved for Future Use
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
EXTENDED MODE REGISTER
DLL disable / enable mode can be programmed by setting the extended mode register (EMRS). The extended mode register stores these data until the next EMRS command, which may be issued when all banks are in idle state. After tMRD from a EMRS command, the DDR SDRAM is ready for new command.
CLK /CLK / CS /RAS /CAS
BA1 BA0 A12 A11 A10 A9 0 1 0 0 0 0
A8 0
A7 0
A6 0
A5 0
A4 0
A3 0
A2 0
A1
DS
A0
DD
/WE BA0 BA1 A11-A0
V
DLL Disable
0 1 0 1
DLL Enable DLL Disable Normal Weak
Drive Strength
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
/CLK CLK Command Address DQS DQ CL= 2 BL= 4 /CAS Latency
Q0 Q1 Q2 Q3 D0 D1 D2 D3 Read Y Write Y
Burst Length
Burst Length
Initial Address A2 0 0 0 0 1 1 1 1 A1 0 0 1 1 0 0 1 1 0 0 1 1 A0 0 1 0 1
BL Sequential 0 1 2 3 8 4 5 6 7 0 1 4 2 3 0 2 1 1 2 3 4 5 6 7 0 1 2 3 0 1 0 2 3 4 5 6 7 0 1 2 3 0 1 3 4 5 6 7 0 1 2 3 0 1 2 4 5 6 7 0 1 2 3 5 6 7 0 1 2 3 4
Column Addressing Interleaved 6 7 0 1 2 3 4 5 7 0 1 2 3 4 5 6 0 1 2 3 4 5 6 7 0 1 2 3 0 1 1 0 3 2 5 4 7 6 1 0 3 2 1 0 2 3 0 1 6 7 4 5 2 3 0 1 3 2 1 0 7 6 5 4 3 2 1 0 4 5 6 7 0 1 2 3 5 4 7 6 1 0 3 2 6 7 4 5 2 3 0 1 7 6 5 4 3 2 1 0
0 1 0 1 0 1 0 1 0 1
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
ABSOLUTE MAXIMUM RATINGS
Symbol Vdd VddQ VI VO IO Pd Topr Tstg Parameter Supply Voltage Supply Voltage for Output Input Voltage Output Voltage Output Current Power Dissipation Operating Temperature Storage Temperature Ta = 25 C
o
Conditions with respect to Vss with respect to VssQ with respect to Vss with respect to VssQ
Ratings -0.5 ~ 3.7 -0.5 ~ 3.7 -0.5 ~ Vdd+0.5 -0.5 ~ VddQ+0.5 50 1000 0 ~ 70 -65 ~ 150
Unit V V V V mA mW
o o
C
C
DC OPERATING CONDITIONS
(Ta=0 ~ 70 o C, unless otherwise noted)
Symbol Vdd VddQ Vref VIH(DC) VIL(DC) VIN(DC) VTT
Parameter Supply Voltage Supply Voltage for Output Input Reference Voltage High-Level Input Voltage Low-Level Input Voltage Input Voltage Level, CLK and /CLK I/O Termination Voltage
Limits Min. 2.3 2.3 0.49*VddQ Vref + 0.15 -0.3 -0.3 0.36 Vref - 0.04 Typ. 2.5 2.5 0.50*VddQ Max. 2.7 2.7 0.51*VddQ VddQ+0.3 Vref - 0.15 VddQ + 0.3 VddQ + 0.6 Vref + 0.04
Unit V V V V V V V V
Notes
5
VID(DC) Input Differential Voltage, CLK and /CLK
7 6
CAPACITANCE
(Ta=0 ~ 70 o C, Vdd = VddQ = 2.5V + 0.2V, Vss = VssQ = 0V, unless otherwise noted)
Symbol CI(A) CI(C) CI(K) CI/O
Parameter Input Capacitance, address pin Input Capacitance, control pin Input Capacitance, CLK pin I/O Capacitance, I/O, DQS, DM pin
Test Condition VI=1.25v f=100MHz VI=25mVrms
Delta Unit Min. Max. Cap.(Max.) 2.0 2.0 2.0 4.0 3.0 3.0 3.0 5.0 0.25 0.50 0.50 pF pF pF pF
Limits
Notes 11 11 11 11
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
AVERAGE SUPPLY CURRENT from Vdd
(Ta=0 ~ 70 o C, Vdd = VddQ = 2.5V + 0.2V, Vss = VssQ = 0V, Output Open, unless otherwise noted)
Symbol Parameter/Test Conditions OPERATING CURRENT: One Bank; Active-Precharge; t RC = t RC MIN; t CK IDD0 = t CK MIN; DQ, DM and DQS inputs changing twice per clock cycle; address and control inputs changing once per clock cycle OPERATING CURRENT: One Bank; Active-Read-Precharge; IDD1 Burst = 2; t RC = t RC MIN; CL = 2.5; t CK = t CK MIN; IOUT= 0mA; Address and control inputs changing once per clock cycle PRECHARGE POWER-DOWN STANDBY CURRENT: All banks idle; powerdown mode; CKE < VIL (MAX); t CK = t CK MIN Organization x4 x8 x16 x4 x8 x16 x4/x8/x16 Limits(Max.) -75A 105 110 120 110 115 135 20 -75 105 110 120 110 115 135 20 -10 100 105 115 105 110 130 20 Unit Notes
IDD2P
IDLE STANDBY CURRENT: /CS > V IH (MIN); All banks idle; IDD2F CKE > V IH (MIN); t CK = t CK MIN; Address and other control inputs changing once per clock cycle IDD3P ACTIVE POWER-DOWN STANDBY CURRENT: One bank active; powerdown mode; CKE < V IL (MAX); t CK = t CK MIN ACTIVE STANDBY CURRENT: /CS > V IH (MIN); CKE > V IH (MIN); One IDD3N bank; Active-Precharge; t RC = t RAS MAX; t CK = t CK MIN; DQ,DM and DQS inputs changing twice per clock cycle; address and other control inputs changing once per clock cycle
x4/x8/x16
40
40
40
x4/x8/x16
30 60
30 60 65 75 150 170 210 145 165 200 185 3 250 260 290
30 55 mA 60 70 140 160 200 135 155 180 175 3 230 240 280 20 20 20
x4/x8/x16
65 75
OPERATING CURRENT: Burst = 2; Reads; Continuous burst;One bank active; IDD4R Address and control inputs changing once per clock cycle;CL=2.5; t CK = t CK MIN; IOUT = 0 mA OPERATING CURRENT: Burst = 2; Writes; Continuous burst; One bank active; IDD4W Address and control inputs changing once per clock cycle; CL=2.5; t CK = t CK MIN;DQ, DM and DQS inputs changing twice per clock cycle IDD5 IDD6 AUTO REFRESH CURRENT: t RC = t RFC (MIN) SELF REFRESH CURRENT: CKE < 0 .2V
x4 x8 x16 x4 x8 x16 x4/x8/x16 x4/x8/x16 x4
150 170 210 145 165 200 185 3 250 260 290
IDD7
OPERATING CURRENT-Four bank Operation: Four bank interleaving with BL=4 -Refer to the Notes 20
x8 x16
AC OPERATING CONDITIONS AND CHARACTERISTICS
(Ta=0 ~ 70 o C, Vdd = VddQ = 2.5V + 0.2V, Vss = VssQ = 0V, Output Open, unless otherwise noted)
Limits Min. Vref + 0.31 Vref - 0.31 0.7 -5 -2 -16.8 16.8 VddQ + 0.6 5 2 0.5*VddQ - 0.2 0.5*VddQ + 0.2 Max.
Symbol
Parameter / Test Conditions
Unit V V V V
µA µA
Notes
VIH(AC) High-Level Input Voltage (AC) VIL(AC) Low-Level Input Voltage (AC) VID(AC) Input Differential Voltage, CLK and /CLK VIX(AC) Input Crossing Point Voltage, CLK and /CLK IOZ II IOH IOL Off-state Output Current /Q floating Vo=0~VddQ Input Current / VIN=0 ~ VddQ Output High Current (VOUT = VTT+0.84V) Output High Current (VOUT = VTT-0.84V)
7 8
mA mA
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
AC TIMING REQUIREMENTS
(Ta=0 ~ 70 o C, Vdd = VddQ = 2.5V +0.2V, Vss = VssQ = 0V, unless otherwise noted)
Symbol tAC AC Characteristics Parameter DQ Output Valid data delay time from CLK//CLK -75A Min. -0.75 -0.75 0.45 0.45 CL=2.5 tCK tDS tDH tDIPW tHZ tLZ tDQSQ tHP tQH tDQSS tDQSH tDQSL tDSS tDSH tMRD CLK cycle time CL=2 Input Setup time (DQ,DM) Input Hold time(DQ,DM) DQ and DM input pulse width (for each input) Data-out-high impedance time from CLK//CLK Data-out-low impedance time from CLK//CLK DQ Valid data delay time from DQS Clock half period Output DQS valid window Write command to first DQS latching transition DQS input High level width DQS input Low level width DQS falling edge to CLK setup time DQS falling edge hold time from CLK Mode Register Set command cycle time tCLmin or tCHmin tHP-0.75 0.75 0.35 0.35 0.2 0.2 15 0 0.4 0.25 0.9 0.9 0.4 0.9 0.6 1.1 0.6 1.25 7.5 0.5 0.5 1.75 -0.75 -0.75 0.75 0.75 0.5 tCLmin or tCHmin tHP-0.75 0.75 0.35 0.35 0.2 0.2 15 0 0.4 0.25 0.9 0.9 0.4 0.9 0.6 1.1 0.6 1.25 15 10 0.5 0.5 1.75 -0.75 -0.75 0.75 0.75 0.5 tCLmin or tCHmin tHP-1.0 0.75 0.35 0.35 0.2 0.2 15 0 0.4 0.25 1.1 1.1 0.4 0.9 0.6 1.1 0.6 1.25 15 10 0.6 0.6 2 -0.8 -0.8 0.8 0.8 0.6 15 ns ns ns ns ns ns ns ns ns tCK tCK tCK tCK tCK ns ns tCK tCK ns ns tCK tCK 19 19 16 15 14 14 7.5 Max 0.75 0.75 0.55 0.55 15 Min. -0.75 -0.75 0.45 0.45 7.5 -75 Max 0.75 0.75 0.55 0.55 15 Min. -0.8 -0.8 0.45 0.45 8 -10 Max 0.8 0.8 0.55 0.55 15 Unit ns ns tCK tCK ns Notes
tDQSCK DQ Output Valid data delay time from CLK//CLK tCH tCL CLK High level width CLK Low level width
tWPRES Write preamble setup time tWPST tWPRE tIS tIH tRPST tRPRE Write postamble Write preamble Input Setup time (address and control) Input Hold time (address and control) Read postamble Read preamble
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
AC TIMING REQUIREMENTS(Continues)
(Ta=0 ~ 70 o C, Vdd = VddQ = 2.5V +0.2V, Vss = VssQ = 0V, unless otherwise noted)
-75A Min. 45 65 75 20 20 15 15 35 1 75 200 1 1 7.8 Max 120,000 Min. 45 65 75 20 20 15 15 35 1 75 200 1 1 7.8 -75 Max 120,000 Min. 50 70 80 20 20 15 15 35 1 80 200 1 1 7.8 -10 Max 120,000
Symbol tRAS tRC tRFC tRCD tRP tRRD tWR tDAL tWTR tXSNR tXSRD tXPNR tXPRD tREFI
AC Characteristics Parameter Row Active time Row Cycle time(operation) Auto Ref. to Active/Auto Ref. command period Row to Column Delay Row Precharge time Act to Act Delay time Write Recovery time Auto Precharge write recovery + precharge time Internal Write to Read Command Delay Exit Self Ref. to non-Read command Exit Self Ref. to -Read command Exit Power down to command Exit Power down to -Read command Average Periodic Refresh interval
Unit ns ns ns ns ns ns ns ns tCK ns tCK tCK tCK
µs
Notes
18 17
Output Load Condition
DQS
V TT = V REF 50 Ω VOUT Zo=50 Ω 30pF V REF
V REF
DQ
V REF
Output Timing Measurement Reference Point
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
Notes 1. All voltages referenced to Vss. 2. Tests for AC timing, IDD, and electrical, AC and DC characteristics, may be conducted at nominal reference/supply voltage levels, but the related specifications and device operation are guaranteed for the full voltage range specified. 3. AC timing and IDD tests may use a VIL to VIH swing of up to 1.5V in the test environment, but input timing is still referenced to VREF (or to the crossing point for CK//CK), and parameter specifications are guaranteed for the specified AC input levels under normal use conditions. The minimum slew rate for the input signals is 1V/ns in the range between VIL(AC) and VIH(AC). 4. The AC and DC input level specifications are as defined in th e SSTL_2 Standard (i.e. the receiver will effectively switch as a result of the signal crossing the AC input level, and will remain in that state as long as the signal does not ring back above (below) the DC input LOW (HIGH) level. 5. VREF is expected to be equal to 0.5*VddQ of the transmitting device, and to track variations in the DC level of the same. Peak-to-peak noise on VREF may not exceed +2% of the DC value. 6. VTT is not applied directly to the device. VTT is a system su pply for signal termination resistors, is expected to be set equal to VREF, and must track variations in the DC level of VREF. 7. VID is the magnitude of the difference between the input level on CLK and the input level on /CLK. 8. The value of VIX is expected to equal 0.5*VddQ of the transmitting device and must track variations in the DC level of the same. 9. Enables on-chip refresh and address counters. 10. IDD specifications are tested after the device is properly initialized. 11. This parameter is sampled. VddQ = 2.5V+ 0.2V, Vdd = 2.5V + 0.2V , f = 100 MHz, Ta = 25 o C, VOUT(DC) = VddQ/2, VOUT(PEAK TO PEAK) = 25mV. DM inputs are grouped with I/O pins - reflecting the fact that they are matched in loading (to facilitate trace matching at the board level). 12. The CLK//CLK input reference level (for timing referenced to CLK//CLK) is the point at which CLK and /CLK cross; the input reference level for signals other than CLK//CLK, is VREF. 13. Inputs are not recognized as valid until VREF stabilizes. Exception: during the period before VREF stabilizes, CKE< 0.3VddQ is recognized as LOW. 14. t HZ and tLZ transitions occur in the same access time windows as valid data transitions. These parameters are not referenced to a specific voltage level, but specify when the device output is no longer driving (HZ), or begins driving (LZ). 15. The maximum limit for this parameter is not a device limit. The device will operate with a greater value for this parameter, but system performance (bus turnaround) will degrade accordingly. 16. The specific requirement is that DQS be valid (HIGH, LOW, or at some point on a valid transition) on or before this CLK edge. A valid transition is defined as monotonic, and meeting the input slew rate specifications of the device. When no writes were previously in progress on the bus, DQS will be transitioning from High-Z to logic LOW. If a previous write was in progress, DQS could be HIGH, LOW, or transitioning from HIGH to LOW at this time, depending on tDQSS. 17. A maximum of eight AUTO REFRESH commands can be posted to any given DDR SDRAM device. 18. tXPRD should be 200 tCLK in the condition of the unstable CLK operation during the power down mode. 19. For command/address and CK & /CK slew rate > 1.0V/ns. 20. IDD7 : Operating current:Four Bank For Bank are being interleaved with tRC(min),Burst Mode,Address and Control inputs on NOP edge are not changing.Iout = 0mA Timing patterns: tCK=min,tRRD=2*tCK,BL=4,tRCD=3*tCK,Read with Autoprecharge Read:A0 N A1 R0 A2 R1 N R3 A0 N A1 R0 – repeat the same timing with random address changing *100% of data changing at every burst Legend: A=Activate,R=Read,P=Precharge,N=NOP
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
Read Operation
tCK tCH tCL
/CLK CLK Cmd & Add.
tDQSCK tRPRE tRPST Valid Data VREF tIS tIH
DQS
tQH tDQSQ
DQ
tAC
Write Operation / tDQSS=max.
/CLK CLK DQS
tDQSS tWPRES tDSS tWPST
tWPRE
tDQSL tDS
tDQSH tDH
DQ
Write Operation / tDQSS=min.
/CLK CLK DQS
tDQSS tWPRES tWPRE tDQSL tDS tDQSH tDH tDSH tWPST
DQ
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
OPERATIONAL DESCRIPTION B ANK ACTIVATE The DDR SDRAM has four independent banks. Each bank is activate d by the ACT command with the bank addresses (BA0,1). A row is indicated by the row address A12-0. The minimum activation interval between one bank and the other bank is tRRD.
PRECHARGE The PRE command deactivates the bank indicated by BA0,1. When multiple banks are active, the precharge all command (PREA,PRE+A10=H) is available to deactivate them at the same time. After tRP from the precharge, an ACT command to the same bank can be issued.
Bank Activation and Precharge All (BL=8, CL=2)
/CLK CLK
2 ACT command / tRCmin tRCmin
Command
ACT tRRD
ACT
READ tRAS
PRE tRP
ACT
A0-9,11
Xa
Xb tRCD
Y BL/2 0 1
Xb
A10
Xa
Xb
Xb
BA0,1
00
01
00
01
DQS
DQ
Qa0
Qa1
Qa2
Qa3
Qa4
Qa5
Qa6
Qa7
Precharge all
A precharge command can be issued at BL/2 from a read command without data loss.
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
READ After tRCD from the bank activation, a READ command can be issued. 1st Output data is available after the /CAS Latency from the READ, followed by (BL-1) consecutive data when the Burst Length is BL. The start address is specified by A11,A9-A0(x4)/A9 -A0(x8)/A8-A0(x16), and the address sequence of burst data is defined by the Burst Type. A READ command may be applied to any active bank, so the row precharge time (tRP) can be hidden behind continuous output data by interleaving the multiple banks. When A10 is high at a READ command, the auto-precharge (READA) is performed. Any command(READ,WRITE,PRE,ACT) to the same bank is inhibited till the internal precharge is complete. The internal precharge starts at BL/2 after READA. The next ACT command can be issued after (BL/2+tRP) from the previous REA DA.
Multi Bank Interleaving READ (BL=8, CL=2)
/CLK CLK Command A0-9,11 A10 BA0,1 DQS DQ
Qa0 Qa1 Qa2 Qa3 Qa4 Qa5 Qa6 Qa7 Qb0 Qb1 Qb2 Qb3 Qb4 Qb5 Qb7 Qb8
ACT tRCD Xa
R E A D ACT
READ
PRE
Y
Xb
Y
Xa
0
Xb
0
0
00
00
10
10
00
Burst Length /CAS latency
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
READ with Auto-Precharge (BL=8, CL=2,2.5)
0 /CLK CLK
BL/2 + tRP
1
2
3
4
5
6
7
8
9
10
11
12
Command
ACT tRCD Xa
READA BL/2 Y tRP
A0-9,11 A10 BA0,1 DQS CL=2 DQ DQS CL=2.5 DQ
Xa
1
00
00
Qa0
Qa1
Qa2
Qa3
Qa4
Qa5
Qa6
Qa7
Qa0
Qa1
Qa2
Qa3
Qa4
Qa5
Qa6
Qa7
Internal Precharge Start Timing
Asserted Command READ READA WRITE(CL=2) WRITE(CL=2.5) WRITEA(CL=2) WRITEA(CL=2.5) ACT PCG 3 Legal Legal Illegal Illegal Illegal Illegal Legal Legal 4 Legal Legal Illegal Illegal Illegal Illegal Legal Legal 5 Legal Legal Illegal Illegal Illegal Illegal Legal Legal For Different Bank 6 Legal Legal Illegal Illegal Illegal Illegal Legal Legal 7 Legal Legal Illegal Illegal Illegal Illegal Legal Legal 8 Legal Legal Legal Illegal Legal Illegal Legal Legal 9 Legal Legal Legal Legal Legal Legal Legal Legal 10 Legal Legal Legal Legal Legal Legal Legal Legal
Operating description when new command asserted.
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
WRITE After tRCD from the bank activation, a WRITE command can be issued. 1st input data is set from the WRITE command with data strobe input, following (BL-1) data are written into RAM, when the Burst Length is BL. The start address is specified by A11,A9-A0(x4)/A9-A0(x8)/A8-A0(x16), and the address sequence of burst data is defined by the Burst Type. A WRITE command may be applied to any active bank, so the row precharge time (tRP) can be hidden behind continuous input data by interleaving the multiple banks. From the last data to the PRE command, the write recovery time (tWRP) is required. When A10 is high at a WRITE command, the auto-precharge(WRITEA) is performed. Any command(READ,WRITE,PRE,ACT) to the same bank is inhibited till the internal precharge is complete. The next ACT command can be issued after tDAL from the last input data cycle. Multi Bank Interleaving WRITE (BL=8)
/CLK CLK Command A0-9,11
ACT tRCD Xa D Ya Xb WRITE ACT tRCD D Yb WRITE PRE PRE
A10 BA0,1 DQS DQ
Xa Xa 00
0
Xb
0
0
0
00
10
10
00
10
Da0
Da1
Da2
Da3
Da4
Da5
Da6
Da7
Db0
Db1
Db2
Db3
Db4
Db5
Db6
Db7
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
WRITE with Auto -Precharge (BL=8)
0 /CLK CLK Command A0-9,11 A10 BA0,1 DQS DQ
Da0 Da1 Da2 Da3 Da4 Da5 Da6 Da7
1
2
3
4
5
6
7
8
9
10
11
12
ACT tRC Xa D
WRITEA tDAL Y
ACT
Xb
Xa
1
Xb
00
00
00
Asserted Command READ READA WRITE WRITEA ACT PCG 3 Illegal Illegal Legal Legal Legal Legal 4 Illegal Illegal Legal Legal Legal Legal 5 Illegal Illegal Legal Legal Legal Legal
For Different Bank 6 Illegal Illegal Legal Legal Legal Legal 7 Illegal Illegal Legal Legal Legal Legal 8 Legal Legal Legal Legal Legal Legal 9 Legal Legal Legal Legal Legal Legal 10 Legal Legal Legal Legal Legal Legal
Operating description when new command asserted.
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
BURST INTERRUPTION
[Read Interrupted by Read] Burst read operation can be interrupted by new read of any bank. Random column access is allowed. READ to READ interval is minimum 1CLK. Read Interrupted by Read (BL=8, CL=2)
/CLK CLK Command A0-9,11 A10 BA0,1 DQS DQ
Qai0 Qai1 Qaj0 Qaj1 Qaj2 Qaj3 Qak0 Qak1 Qak2 Qak3 Qak4 Qak5 Qal0 Qal1 Qal2 Qal3 Qal4 Qal5 Qal6 Qal7
READ READ
READ
READ
Yi
Yj
Yk
Yl
0
0
0
0
00
00
10
01
[Read Interrupted by precharge] Burst read operation can be interrupted by precharge of the same bank. READ to PRE interval is minimum 1 CLK. A PRE command to output disable latency is equivalent to the /CAS Latency. As a result, READ to PRE interval determines valid data length to be output. The figure below shows examples of BL=8. Read Interrupted by Precharge (BL=8)
/CLK CLK Command DQS DQ Command
READ PRE
Q0 Q1 Q2 Q3 Q4 Q5
READ
PRE
CL=2.5
DQS DQ Command DQS DQ
Q0 Q1 Q0 Q1 Q2 Q3
READ
PRE
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
Read Interrupted by Precharge (BL=8)
/CLK CLK Command DQS DQ Command
READ
Q0 Q1 Q2 Q3 Q4 Q5
READ
PRE
PRE
CL=2.0
DQS DQ Command DQS DQ
Q0 Q1 Q0 Q1 Q2 Q3
READ
PRE
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
[Read Interrupted by Burst Stop] Burst read operation can be interrupted by a burst stop command( TERM). READ to TERM interval is minimum 1 CLK. A TERM command to output disable latency is equivalent to the /CAS Latency. As a result, READ to TERM interval determines valid data length to be output. The figure below shows examples of BL=8.
Read Interrupted by TERM (BL=8)
/CLK CLK Command DQS DQ Command
READ
TERM
Q0 Q1 Q2 Q3 Q4 Q5
READ
TERM
CL=2.5
DQS DQ Command DQS DQ Command DQS DQ Command
READ
Q0 Q1 Q2 Q3 Q4 Q5 Q0 Q1 Q0 Q1 Q2 Q3
R E A D TERM
READ
TERM
TERM
CL=2.0
DQS DQ Command DQS DQ
Q0 Q1 Q0 Q1 Q2 Q3
R E A D TERM
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
[Read Interrupted by Write with TERM] Read Interrupted by TERM (BL=8)
/CLK CLK Command
READ TERM WRITE
CL=2.5
DQS DQ Command DQS DQ
Q0 Q1 Q2 Q3 D0 D1 D2 D3 D4 D5 D6 D7 Q0 Q1 Q2 Q3 D0 D1 D2 D3 D4 D5
READ
TERM
WRITE
CL=2.0
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
[Write interrupted by Write] Burst write operation can be interrupted by write of any bank. Random column access is allowed. WRITE to WRITE interval is minimum 1 CLK. Write Interrupted by Write (BL=8)
/CLK CLK Command A0-9,11
WRITE WRITE WRITE WRITE
Yi
Yj
Yk
Yl
A10 BA0,1
0
0
0
0
00
00
10
00
DQS DQ
Dai0 Dai1 Daj0 Daj1 Daj2 Daj3 Dak0 Dak1 Dak2 Dak3 Dak4 Dak5 Dal0 Dal1 Dal2 Dal3 Dal4 Dal5 Dal6 Dal7
[Write interrupted by Read] Burst write operation can be interrupted by read of the same or the other bank. Random column access is allowed. Internal WRITE to READ command interval(tWTR) is minimum 1 CLK. The input data on DQ at the interrupting READ cycle is "don't care". tWTR is referenced from the first positive edge after the last data input. Write Interrupted by Read (BL=8, CL=2.5)
/CLK CLK Command A0-9,11 A10 BA0,1 DM tWTR QS DQ
Dai0 Dai1 Qaj0 Qaj1 Qaj2 Qaj3 Qaj4 Qaj5 Qaj6 Qaj7
WRITE
READ
Yi
Yj
0
0
00
00
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
[Write interrupted by Precharge] Burst write operation can be interrupted by precharge of the same or all bank. Random column access is allowed. tWR is referenced from the first positive CLK edge after the last data input. Write Interrupted by Precharge (BL=8, CL=2.5)
/CLK CLK Command A0-9,11 A10 BA0,1 DM QS DQ
WRITE PRE
Yi
0
00
00
tWR
Dai0
Dai1
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
[Initialize and Mode Register sets] Initialize and MRS
/CLK CLK CKE Command A0-9,11 A10 BA0,1 DQS DQ tMRD
Extended Mode Register Set 1 NOP PRE EMRS MRS PRE AR AR MRS ACT
Code
Code
Xa
Code
Code
1
Code
Xa
10
00
00
Xa
tMRD
Reset DLL
tRP
tRFC
tRFC
tMRD
Mode Register Set,
[AUTO REFRESH] Single cycle of auto-refresh is initiated with a REFA(/CS=/RAS=/CAS=L,/WE=CKE=H) command. The refresh address is generated internally. 8192 REFA cycles within 64ms refresh 256Mbits memory cells. The auto-refresh is performed on 4 banks concurrently. Before performing an auto refresh, all banks must be in the idle state. Auto-refresh to auto-refresh interval is minimum tRFC . Any command must not be supplied to the device before tRFC from the REFA command. Auto-Refresh
/CLK CLK /CS /RAS /CAS /WE CKE A0-11 BA0,1
tRFC NOP or DESELECT
Auto Refresh on All Banks
Auto Refresh on All Banks
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
[SELF REFRESH] Self -refresh mode is entered by issuing a REFS command (/CS=/RAS=/CAS=L,/WE=H,CKE=L). Once the self-refresh is initiated, it is maintained as long as CKE is kept low. During the selfrefresh mode, CKE is asynchronous and the only enable input, all other inputs including CLK are disabled and ignored, so that power consumption due to synchronous inputs is saved. To exit the self-refresh, supplying stable CLK inputs, asserting DESEL or NOP command and then asserting CKE for longer than tXSNR/tXSRD.
S elf-Refresh
/CLK CLK /CS /RAS /CAS /WE CKE A0-11 BA0,1
X X tXSNR Self Refresh Exit tXSRD
Y Y
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
[Power DOWN] The purpose of CLK suspend is power down. CKE is synchronous inp ut except during the selfrefresh mode. A command at cycle is ignored. From CKE=H to normal function, DLL recovery time is NOT required in the condition of the stable CLK operation during the power down mode. Power Down by CKE
/CLK CLK CKE Standby Power Down
Command
PRE
NOP
NOP
Valid
tXPNR/tXPRD CKE Active Power Down
Command
ACT
NOP
NOP
Valid
[ DM CONTROL] DM is defined as the data mask for writes. During writes,DM masks input data word by word. DM to write mask latency is 0. DM Function(BL=8,CL=2)
/CLK CLK Command DM
WRITE READ
Don't Care
DQS DQ
D0 D1 D3 D4 D5 D6 D7 Q0 Q1 Q2 Q3 Q4 Q5 Q6
masked by DM=H
MITSUBISHI ELECTRIC
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DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
Keep safety first in your circuit designs! Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer’s application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party. Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party’s rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Mitsubishi Electric Corporation by various means, including the Mitsubishi Semiconductor home page (http://www.mitsubishichips.com). When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein.
MITSUBISHI ELECTRIC
36
DDR SDRAM (Rev.1.0) Jul. '01 Preliminary
MITSUBISHI LSIs
M2S56D20/ 30/ 40AKT
256 M D o u b l e D a t a R a t e S y n c h r o n o u s D R A M
Revision History
Rev.
1.0
Date
Jul. ’01 -New registration (Jul. ‘01)
Description
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