CIM-H33N

MITSUMI microSD card connectors CIM-H33N Connectors FEATURES 1. Hinge machanism type 2. Small and tin design 3. Prevents from losing card by attaching a card to the plate at card attachment and removal. 4. Card attachment and removal is easy by plate opening with spring force. 5. Contact slide on card pad at card setting with self-cleaning mechanism. 6. ESD countermeasure is possible at card attachment. HOW TO ORDER H33N-008-21 0 - A G G E 1 1 2 3 4 5 6 7 8 2 3 4 5 6 78 Series No. (H33N : Nomal type) No. of contacts (008 : 8pins) Housing material (21 : LCP resin) Housing UL grade (0 : UL94V-0) Contact plating (A : Gold) Contact plating thickness (G : 3µm) Contact read style (G : Angle SMT) Package (E : Taping) SPECIFICATIONS ELECTRICAL CHARACTERISTICS Rated Voltage Rated Current Withstanding Voltage Insulation Resistance Contact Resistance MECHANICAL CHARACTERISTICS Life (Matching Cycle) Using Temperature Range 10,000times -25~+85°C AC 50V (rms) 0.5A 500V AC (rms) 1minute 1000MΩ min. (Initial value) 100mΩ max. (Initial value) MITSUMI microSD card connectors MATERIAL & FINISH Component Parts Housing Contact Plate Lock Spring Wing Shaft Torsion Spring Material LCP resin Copper Alloy SUS Copper Alloy Copper Alloy SUS SUS Finish (Black) Gold plating - Gold plating Gold plating - DIMENSIONS 14 0.55 0.25 2.2 2.15 0.4 0.4 (1.5) Slide stroke 2.5 16.9 0.4 8.3 Slide 12.1 12.1 #1 #8 (13) 2.7 5.7 0.6 0.6 1.9 0.3 1.1 7.7 Slide unlock 0.4 0.4 2.15 0.55 13.75 0.55 Slide lock Recommended PWB layout 1.7 10.1 9.625 0.5 Note [For GND] 1 1.65 OPE.1 Card insert 1 1.4 8.35 1.7 11.5 9.4 0.9 0.9 OPE.2 Plate close 1 12.1 2.7 1 1.7 1.1 1.3 7.7 10.76 1.7 1 4.8 5 5.4 0.9 OPE.3 Plate slide OPE.4 Slide lock position 5.9 6.3