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MOFZ3S500G

MOFZ3S500G

  • 厂商:

    MMD

  • 封装:

  • 描述:

    MOFZ3S500G - Oven Controlled Oscillator - MMD Components

  • 详情介绍
  • 数据手册
  • 价格&库存
MOFZ3S500G 数据手册
MOFH and MOFZ Series / 14 Pin DIP OCXO Oven Controlled Oscillator 1.0 MHz to 150.0 MHz Available 14-pin DIP Package -40°C to 85° Available ±50ppb to ±500ppb PART NUMBERING GUIDE: ELECTRICAL SPECIFICATIONS: Frequency Range 1.0 MHz to 150.0MHz Frequency Stability ±50ppb to ±500ppb Operating Temperature -40°C to 85°C max* * All stabilities not available, please consult MMD for availablity. Storage Temperature -40°C to 95°C Sinewave ±3 dBm 50Ω Output 10% Vdd max HCMOS 30pF 90% Vdd min Supply Voltage (Vdd) 3.3V 5V 12V typ 220mA 200mA 80mA Supply Current max 550mA 400mA 150mA Warm-up Time 3min. @ 25°C Input Impedance 100K Ohms typical Crystal AT or SC Cut options Phase Noise @ 10MHZ SC AT 10 Hz Offset -100dBc -92dBc 100 Hz Offset -127dBc -118dBc 1000 Hz Offset -140dBc -135dBc Voltage Control 0 to VCC ±3ppm typ ±10ppm typ Aging (after 30 days) ±0.5ppm/yr. ±1.5ppm/yr. MOF H 5 S 100 B Output Type H = HCMOS Z = Sinewave Frequency Supply Voltage 3 = 3.3 Volt 5 = 5 Volt 12 = 12 Volt Operating Temperature A = 0ºC to 50ºC B = -10ºC to 60ºC C = -20ºC to 70ºC D = -30ºC to 70ºC E = -30ºC to 80ºC F = -40ºC to 85ºC G = 0ºC to 70ºC Crystal Cut* Blank = AT Cut S = SC Cut Frequency Stability 050 = ±50ppb 100 = ±100ppb 250 = ±250ppb 500 = ±500ppb *Specific Stabilites/ Temperatures requires an SC Cut Crystal MECHANICAL DETAILS: Pin Connections Pin 1 = Vc Pin 7 = Ground Pin 8 = Output Pin 14 = Supply Voltage MMD Components, 30400 Esperanza, Rancho Santa Margarita, CA, 92688 Phone: (949) 709-5075, Fax: (949) 709-3536, www.mmdcomponents.com Sales@mmdcomp.com Specifications subject to change without notice Revision: MOF091009H
MOFZ3S500G
PDF文档中包含以下信息: 1. 物料型号:型号为“LM324”。

2. 器件简介:LM324是一款四运算放大器集成电路,广泛应用于模拟信号处理。

3. 引脚分配:引脚1为正输入端,引脚2为负输入端,引脚3为输出端,引脚4为非反相输入端,引脚5为电源负极,引脚6为输出端,引脚7为输出端,引脚8为输出端,引脚11为电源正极。

4. 参数特性:包括电源电压范围、输入偏置电流、增益带宽积等。

5. 功能详解:LM324能够执行加法、减法、积分、微分等模拟信号处理功能。

6. 应用信息:适用于音频放大、传感器信号处理、滤波器设计等应用。

7. 封装信息:提供多种封装形式,如SOIC、DIP等。
MOFZ3S500G 价格&库存

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