0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
45280-2403

45280-2403

  • 厂商:

    MOLEX

  • 封装:

  • 描述:

    45280-2403 - 3.00mm (.118”) Pitch Micro-Fit 3.0, CPI™ Micro-Fit 3.0, BMI™ CPI Vertical Headers - Mol...

  • 详情介绍
  • 数据手册
  • 价格&库存
45280-2403 数据手册
FEATURES AND SPECIFICATIONS 3.00mm (.118”) Pitch Micro-Fit 3.0, CPI™ Micro-Fit 3.0, BMI™ CPI Vertical Headers Micro-Fit 3.0 Family Offers Press-Fit Headers For High-Density Power and Signal Applications The Micro-Fit 3.0, CPI (Compliant Pin Interface) and Micro-Fit 3.0, BMI CPI (Blind-Mate version with Compliant Pin Interface) are vertical header product extensions featuring press-fit PC tails. These headers are designed for highdensity applications where press-fit terminations are required. The CPI products are appropriate for both power and signal uses as they can carry up to 5.0A of current per circuit. The standard Micro-Fit 3.0, CPI headers incorporate a compact housing that mates with standard wire-mount housings and crimp terminals for wire-to-board applications. The Micro-Fit 3.0, BMI CPI headers feature a funnel entry to guide the mating receptacle into place. Micro-Fit 3.0, BMI headers mate exclusively with BMI components, which include panel-mount receptacles with crimp terminals and PCB receptacles for wire-to-board and board-to-board applications. Features and Benefits ■ CPI style (press-fit) pins require no soldering to the PCB ■ Designed for multiple board thicknesses of 2.36mm (.093”) or greater ■ Dual-row vertical headers available in 2-24 circuits for the standard version and 4-24 circuits for the BMI (blind-mate) version ■ Rated up to 5.0A of current for both power and signal applications in wire-toboard and board-to-board configurations ■ Fully polarized with positive locks for proper mating ■ Fully isolated contacts for electrical and mechanical integrity Reference Information Packaging:Tray UL File No.: E29179 CSA File No.: LR19980 TUV No.: R95107 Designed In: Millimeters Electrical Voltage: 250V Current: 5.0A Contact Resistance: 10 milliohms max. Dielectric Withstanding Voltage: 1500 VAC Insulation Resistance: 1000 Megohms min. Mechanical Insertion Force to PCB: 35.6N (8.0lb) per circuit max. Retention Force to PCB: 106.8N (24.0lb) per circuit min. Mating Force: 8.0N (1.8lb) per circuit max. Unmating Force: 3.6N (0.8lb) per circuit min. Durability: 30 cycles Physical Housing: High-temperature polymer, UL 94V-0 Contact: Brass alloy Plating: Contact area – 5.1µm (200µ") min. Tin, 0.38µm (15µ”) min. select Gold or 0.76µm (30µ”) min. select Gold PC tails – Tin/Lead Underplating: Nickel PCB Thickness: 2.36mm (.093”) min. Operating Temperature: -40 to +105° C Applications ■ Servers ■ Workstations ■ Personal Computers ■ Mainframe Computers ■ Notebook PCs ■ Fan Tray Assemblies ■ Power Supplies ■ Office Equipment ■ Vending and Gaming Machines 3.00mm (.118”) Pitch Micro-Fit 3.0, CPI™ Micro-Fit 3.0, BMI™ CPI Vertical Headers ORDERING INFORMATION H eader Style Circuit Size 5.1µm (200µ") min. Tin Contact Plating 0.38µm (15µ") min. Gold 0.76µm (30µ") min. Gold Micro-Fit 3.0, CPI Micro-Fit 3.0, BMI CPI 2 4 6 8 10 12 14 16 18 20 22 24 4 6 8 10 12 14 16 18 20 22 24 44914-0201 44914-0401 44914-0601 44914-0801 44914-1001 44914-1201 44914-1401 44914-1601 44914-1801 44914-2001 44914-2201 44914-2401 45280-0401 45280-0601 45280-0801 45280-1001 45280-1201 45280-1401 45280-1601 45280-1801 45280-2001 45280-2201 45280-2401 44914-0202 44914-0402 44914-0602 44914-0802 44914-1002 44914-1202 44914-1402 44914-1602 44914-1802 44914-2002 44914-2202 44914-2402 45280-0402 45280-0602 45280-0802 45280-1002 45280-1202 45280-1402 45280-1602 45280-1802 45280-2002 45280-2202 45280-2402 44914-0203 44914-0403 44914-0603 44914-0803 44914-1003 44914-1203 44914-1403 44914-1603 44914-1803 44914-2003 44914-2203 44914-2403 45280-0403 45280-0603 45280-0803 45280-1003 45280-1203 45280-1403 45280-1603 45280-1803 45280-2003 45280-2203 45280-2403 Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX amerinfo@molex.com Far East North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 feninfo@molex.com Far East South Headquarters Jurong, Singapore 65-6-268-6868 fesinfo@molex.com European Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. 630-969-4550 Fax:630-969-1352 V isit o u r W e b sit e a t h t t p : / / www.mo l e x .co m/ pro du ct / pcb/ mi cro fi t / mi cro fi t .h t ml Order No. USA-193 Printed in USA/5K/JI/JI/2006.01 © 2006, Molex
45280-2403
物料型号: - Micro-Fit 3.0, CPI™ 和 Micro-Fit 3.0, BMI™ CPI 垂直头产品,具有压接式PC尾。 - Micro-Fit 3.0, CPI产品型号从44914-0201至44914-2403。 - Micro-Fit 3.0, BMI CPI产品型号从45280-0401至45280-2403。

器件简介: - 这些产品是Micro-Fit 3.0系列的垂直头产品,设计用于高密度应用,其中需要压接式终止。 - CPI产品适用于功率和信号用途,能够承受高达5.0A的电流。 - 标准Micro-Fit 3.0, CPI头与标准的线装式外壳和压接端子配合,用于线对板应用。 - Micro-Fit 3.0, BMI CPI头具有漏斗式入口,引导配合的插座就位,仅与BMI组件配合,包括板装插座和PCB插座。

引脚分配: - 双排垂直头提供2-24路标准版本和4-24路BMI(盲配)版本。

参数特性: - CPI风格(压接式)引脚无需在PCB上焊接。 - 设计适用于2.36mm(.093英寸)或更厚的多种板厚。 - 额定电流为5.0A,适用于线对板和板对板配置中的功率和信号应用。 - 完全隔离的接触点,具有电气和机械完整性。 - 完全极化,具有正锁定,以确保正确配合。

功能详解: - 提供了压接式PC尾,无需焊接。 - 适用于多种板厚,最小为2.36mm。 - 额定电流5.0A,适用于功率和信号应用。 - 完全隔离的接触点和完全极化设计。

应用信息: - 服务器、工作站、个人电脑、大型计算机、笔记本电脑、风扇托盘组件、电源、办公设备、自动售货机和游戏机。

封装信息: - 包装:托盘装。 - 插入力至PCB:每路最大35.6N(8.0lb)。 - 保持力至PCB:每路最小106.8N(24.0lb)。 - 配合力:每路最大8.0N(1.8lb)。 - 分离力:每路最小3.6N(0.8lb)。 - 耐温:30周期。 - 电气参数包括250V电压和5.0A电流,接触材料为黄铜合金,镀层为锡/铅。 - 操作温度范围:-40至+105°C。
45280-2403 价格&库存

很抱歉,暂时无法提供与“45280-2403”相匹配的价格&库存,您可以联系我们找货

免费人工找货