46207-0104

FEATURES AND SPECIFICATIONS 4.20mm (.165”) Pitch Mini-Fit RTC™ Vertical Headers 46207 Mini-Fit RTC has same features as Mini-Fit Jr.TM plus is RoHS capable Designed with a high-temperature LCP housing, Mini-Fit RoHS Temperature Capable (RTC) Headers can withstand high SMT solder-reflow temperatures to guarantee compatibility with lead-free RoHS reflow processes. Mini-Fit RTC headers mate with standard Mini-Fit® receptacles using the standard Mini-Fit key design. Mini-Fit RTC headers share the same design features of the Mini-Fit Jr. headers, ensuring compatibility and reliability. Mini-Fit products provide a cost-effective solution for mid-range power applications that require high-density and current-carrying capability. For more information on Molex’s extensive Mini-Fit product offering, visit www.molex.com/product/minifit.html. Features and Benefits n High-temperature LCP housing withstands RoHS lead-free processing up to 260° C peak n Press-fit PCB pegs provide polarization during placement on the PCB and increased retention during the soldering process n High-current Mini-fit Plus HCS™ male pins provide up to 12.0A per circuit (mated with Mini-Fit Plus HCS™ female crimp terminal, 16AWG) n Mini-Fit locking thumb latch assures positive locking of mating connectors n Standard Mini-Fit polarized, keyed silos prevent mismatching and provides protection for the mating terminals; compatible with existing Mini-Fit receptacles n Circuit sizes 4 to 12, and 24, offer design flexibility; other sizes planned SPECIFICATIONS Reference Information Packaging: Tray or box UL File No.: Contact Molex CSA File No.: Contact Molex Mates With: 5557 receptacle Designed In: Millimeters Process: Wave solder or SMT reflow, 260° C peak (20 seconds) Electrical Voltage: 600V Current: 12.0A Contact Resistance: 20 milliohms Dielectric Withstanding Voltage: 2200V AC Insulation Resistance: 1000 Megohms min. Mechanical Pin Retention to Housing: 6.67N (1.499 lb) min. Insertion Force to PCB: 55N (12.364 lb) max. 10.0N (2.248 lb) min. Mating Force: 14.7N (3.305 lb) max. Unmating Force: 1.0N (.225 lb) min. Durability: 30 cycles Physical Housing: LCP, black Flammability: UL 94V-0 Contact: Brass Plating: Contact Area—Tin (Sn) Solder Tail Area—Tin (Sn) Underplating—Nickel (Ni) PCB Thickness: 1.57 and 2.36mm (.062” and .093”) Operating Temperature: -40 to +105°C RoHS Capable: Yes APPLICATIONS 4.20mm (.165”) Pitch Mini-Fit RTC™ Vertical Headers 46207 n Desktop/tower computer n Power supplies n Telecommunications - Hubs - Servers n Industrial n Medical n Transportation n Marine and recreational n Military Commercial Off-the-Shelf (COTS) n Mid-range power applications Computer Tower PC Power Supply ORDERING INFORMATION Circuit Order No. 1.57mm (.062”) PCB Thickness 2.36mm (.093”) PCB Thickness 4 6 8 10 12 24 46207-0004 46207-0006 46207-0008 46207-0010 46207-0012 46207-0024 46207-0104 46207-0106 46207-0108 46207-0110 46207-0112 46207-0124 Note: For additional circuit sizes, PCB thicknesses and plating contact Molex Inside Sales for more information. Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX amerinfo@molex.com Order No. 987650-1133 Asia Pacific North Headquarters Asia Pacific South Headquarters European Headquarters Yamato, Kanagawa, Japan Jurong, Singapore Munich, Germany 81-46-265-2325 65-6268-6868 49-89-413092-0 apninfo@molex.com fesinfo@molex.com eurinfo@molex.com Visit our website at www.molex.com/product/minifitrtc.html Printed in USA/JI/2007.10 Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. 630-969-4550 Fax:630-969-1352 ©2007, Molex