46557-2345

FEATURES AND SPECIFICATIONS 1.27mm (.050”) Pitch SEARAY*Slim 4-Row Connectors 46556 Plug 46557 Receptacle SEARAY Slim offers a deceivingly narrow profile while providing a robust solution capable of speeds in excess of 12.5Gbps. SEARAY Slim is a solution armed with the benefits of the standard SEARAY family but with a width similar to 2-row mezzanine products. The design meets system needs as a highly compact solution but with speed capabilities of 12.5 Gbps, a level of performance most other 2-row products cannot achieve today. As systemlevel speeds approach 5Gbps and beyond, SEARAY stands as an enticing mezzanine architecture that provides headroom for future-generation iterations as protocol speeds continue to increase. SEARAY Slim pushes the envelope of the SEARAY product family, offering a 4-row solution that is a narrower version of the existing SEARAY housings. Because Slim features Molex’s patented solder-charge technology and can pack tighter signal density into a 1.27mm (.050”) pitch, the connector width is equivalent to that of standard 2-row SMT products. With a flexible tooling strategy, SEARAY Slim can offer circuit sizes ranging from 40 to 200 circuits and stacking heights of 7 to 15mm (.236 to .591”). SEARAY Slim’s slender profile provides design engineers with a solution complementary to system airflow and with a long body that provides ease in routing signals through minimal signal layers, as few as 2 layers if signals are routed to both sides of the connector or 4 layers if all signals route to one side of the mezzanine solution. In addition, unlike competitors products available today, SEARAY Slim offers guide posts for blind-mating capabilities. For additional information about SEARAY Slim visit: www.molex.com/link/SEARAYSlim.html. Features and Benefits ■ Narrow body width comparable to 2-row SMT products provides minimal PCB footprint for high-density board designs and effective design for airflow considerations ■ Data rates of up to 12.5 Gbps provide excellent signal clarity and large bandwidth for customer requirements in high-speed designs ■ Flexible tooling design with multiple stack heights and circuit sizes provides ease in tooling a new circuit size or stack-height version ■ Robust contact design prevents stubbing and damage in mating interface ■ Molex’s unique and patented, solder-charge technology are more cost effective and more reliable than Ball Grid Array (BGA) attach methods with less assembly processing required and a more reliable PCB adhesion SPECIFICATIONS Reference Information Product Specification: PS-45970-001 Packaging: Tray UL File No: TBD CSA File No: TBD Designed in: Inches Electrical Voltage: 250V AC per Current: 1.0A per contact Contact Resistance: 25 milliohms nominal Dielectric Withstanding Voltage: 500V DC Insulation Resistance: 5000 Ohms min. Impedance: 100 ohm differential signal pairs Mechanical Mating Force: 50g max. per contact Un-mating Force: 30g max. per contact Normal Force: 82g max. per contact Durability: 100 cycles Physical Housing: Glass-filled LCP, UL 94V-0 Contact: Copper (Cu) Alloy Plating: Contact Area – 0.75µm Gold (Au) min. Solder Tail Area – 3.80µm Tin (Sn) min. Underplating – 1.25µm Nickel (Ni) min. overall Operating Temperature: -55 to +125°C *SEARAY is a trademark of Samtec, Inc. APPLICATIONS 1.27mm (.050”) Pitch SEARAY*Slim 4-Row Connectors 46556 Plug 46557 Receptacle ■ Mezzanine add-on cards - Memory expansion - I/O expansion ■ Real estate proliferation ■ Controller cards - Motherboard personality cards - Industrial controllers - ASIC port enablers ORDERING INFORMATION Order No. 46556-2345 46557-2345 46556-4145 46557-4545 Component Plug Receptacle Plug Receptacle Circuits 80 80 160 160 Unmated Height 7.11mm (.280”) 6.55mm (.258”) 5.61mm (.221”) 8.05mm (.317”) Plating 30µ Gold 30µ Gold 30µ Gold 30µ Gold Plant No. for Samples 3109 3109 3109 3109 *SEARAY is a trademark of Samtec, Inc. www.molex.com/link/SEARAYSlim.html Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX amerinfo@molex.com Order No. 987650-2061 Asia Pacific North Headquarters Yamato, Kanagawa, Japan 81-46-265-2325 apninfo@molex.com Asia Pacific South Headquarters Jurong, Singapore 65-6268-6868 apsinfo@molex.com USA/KP/2008.07 European Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. P: 630-969-4550 F: 630-969-1352 © 2008, Molex