47213-1015

FEATURES AND SPECIFICATIONS 1.09mm (.043") by 1.17mm (.046") Pitch LGA Socket 771 47213 Vertical Surface Mount Molex offers the 771-pin LGA CPU Socket for the Intel Dempsey Platform Processor Socket 771 is the first Computer Processing Unit (CPU) socket to be used on the server/workstation industry featuring the Land Grid Array (LGA) contact design. This socket is commonly known as Socket J, Socket 771 and LGA 771. This socket mates with the 771 LGA CPU package (gold pads) to form the processing unit of the application. Previous design uses the Pin Grid Array (PGA) socket or Micro-PGA socket (such as socket 604) mated with PGA CPU package. The 771-pin LGA CPU and Socket will replace the Socket 604 in Intel®Xeon® processor line. Molex’s high density LGA sockets features our low profile design, the shepard hook actuation lever and a flat or raised pick and place cover for the assembly process. All Molex’s LGA sockets comes with lead or lead-free BGA solder balls. Features • High-temperature thermoplastic housing • Pick-&-place cover and Jedec hard packaging tray • LGA contact/BGA solder • Lead free BGA solder balls • Shepard hook actuation lever • Flat or raised pick & place cover • Visible triangle pin 1 identification on housing, pick & place cover, stiffener plate. • West alignment key. • 2 finger cutouts on north and south side Benefits • Withstands lead-free processing • Facilitates automation socket placement • Prevents CPU misalignment • Compliant with environmental needs • For easy actuation • Raised cover facilitates easy removal • Ensure correct CPU loading • Prevent Socket 775 CPU from mating to socket 771. • For easy CPU removal SPECIFICATIONS Reference Information Packaging: JEDEC Thick Handling Hard Tray UL File No.: E29179 Mates With: Intel®Xeon® Processor family(771-pin Package) Designed In: Millimeters Electrical Voltage: 30V Current: 0.8A Contact Resistance: 15.2 milliohms max. average, 28.0 milliohms max. chain Dielectric Withstanding Voltage: 360V AC Insulation Resistance: 500 Megohms min. Mechanical Insertion Force to Socket: Zero Insertion Force Durability: 20 cycles Physical Housing: LCP, UL 94V-0 Contact: Copper Alloy Plating: Contact Area — 0.38 um (15u”) Gold Solder Tail Area — Underplating — Nickel Operating Temperature: -40 to +90°C MARKETS AND APPLICATIONS • Workstation/Low End Server 1.09mm (.043") by 1.17mm (.046") Pitch LGA Socket 771 47213 Vertical Surface Mount ORDERING INFORMATION Lead-Free Order No. Tin-Lead Order No. Description 47213-0015 47213-0010 1.09mm (.043") by 1.17mm (.046") Pitch LGA Socket, 771 Circuits, 15u” Gold Plating, Shepherd Hook Lever, Flat Pick & Place Cover 47213-1015 47213-1010 1.09mm (.043") by 1.17mm (.046") Pitch LGA Socket, 771 Circuits, 15u” Gold Plating, Shepherd Hook Lever, Raised Pick & Place Cover 47213-0005 47213-0000 1.09mm (.043") by 1.17mm (.046") Pitch LGA Socket, 771 Circuits, 30u” Gold Plating, Shepherd Hook Lever, Raised Pick & Place Cover Intel®Xeon® is a registered trademark of Intel. Bringing People & Technology Together, WorldwideSM Americas Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 1-800-78MOLEX amerinfo@molex.com Far East North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 feninfo@molex.com Far East South Headquarters Jurong, Singapore 65-6-268-6868 fesinfo@molex.com European Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com Corporate Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 630-969-4550 Visit our Web site at http://www.molex.com Order No. SNG-035 ©2005, Molex