51248-4784

INTRODUCTION Molex's latest Micro PGA sockets are designed to accept Mobile Pentium* 4 and Mobile Celeron* Processor-M series for applications such as thin notebooks and blade servers. These high-density sockets feature low profiles and proven Ball Grid Array (BGA) soldering technology for stable PCB processing. The new sockets include an easy-to-use cam mechanism and stainless steel cam retainer to prevent wear-and-tear on the housing during use. The terminal includes a dual-beam chamfered contact for good electrical performance, and BGAinterface design to ensure good thermal mismatch control between components and the PCB. Molex's Micro PGA sockets are part of our growing family of innovative socketing solutions for processor, memory and test applications. FEATURES AND BENEFITS Applications: ■ Notebook PCs ■ Blade Servers Micro PGA Socket 478/479 Circuits For Mobile Pentium* 4 ZIF Type, BGA Mount Blade Server *Pentium and Celeron are registered trademarks of Intel Corporation Stainless steel cam retainer protects plastic cover from wear. Blue Color Version For Centrino* Mobile Technology Processors Dual-beam chamfered contact design provides low insertion force and good electrical performance. LCP housing and cover with profile height of 3.30mm (.130") Accepts energy-saving Pentium mobile processors For notebooks, blade servers and small desktop PCs ■ 478 circuits ■ Small pin layout difference and blue color to differentiate from standard P4-M socket ■ Same features as standard P4-M socket ■ Order No.: 500210-4784 ■ ■ Ball Grid Array (BGA) solder balls are self-centering and avoid the problem of bent tails. SPECIFICATIONS Housing Contact Solder Ball Physical CAM CAM Holder Plating—Contact Area Underplating Operating Temperature Black LCP, UL 94V-0 Copper Alloy Tin/Lead, 0.76mm (.030") dia. Stainless Steel Stainless Steel Gold Nickel -20 to +90˚C Reference Mechanical Electrical * Centrino is a trademark of Intel Corporation Voltage Current Contact Resistance Dielectric Withstanding Voltage Insulation Resistance Durability Product Specification Packaging Designed In 100V 0.5A 25 milliohms max. AC 360V 800 Megohms min. 50 cycles PS-51248-005 Hard Tray/ Embossed Tape Millimeters MICRO PGA DRAWING Micro PGA Socket 478/479 Circuits For Mobile Pentium* 4 ZIF Type, BGA Mount ORDERING INFORMATION Circuits 478 479 Order No. Hard Tray 51248-4782 51248-4792 Embossed Tape 51248-4784 51248-4794 Americas Headquarters Lisle, Illinois 60532 U.S.A. Tel: 1-800-78MOLEX amerinfo@molex.com Far East North Headquarters Yamato, Kanagawa, Japan Tel: 81-462-65-2324 feninfo@molex.com Far East South Headquarters Jurong, Singapore Tel: 65-6268-6868 fesinfo@molex.com European Headquarters Munich, Germany Tel: 49-89-413092-0 eurinfo@molex.com Corporate Headquarters 2222 Wellington Court Lisle, Illinois 60532 U.S.A. Tel: 630-969-4550 amerinfo@molex.com Visit our Web site at http: // www.molex.com Order No. JPN-034 Printed in Japan/3K/MXJ/Brain House/2003.03 ©2003, Molex Japan