74337-0070

FEATURES AND SPECIFICATIONS Electrical Voltage: 30V intermateability with conforming parts Current: 0.5A s Gold flash over Palladium Nickel plating for a high Contact Resistance: 50mΩ max. durability/reliability interface Dielectric Withstanding Voltage: 250V AC s Dual-stack, single-piece design provides space savings with Insulation Resistance: 500 MΩ min. one-step PCB processing Mechanical s Optional cover to protect from contact damage during Mating Force: 0.49N (0.11 lb) handling Unmating Force: 0.15N (0.03 lb) s Available with or without screwlock hardware Durability: 500 cycles (71433-0002) s One-piece enhanced face shield for improved EMI/RFI Physical performance and simple ground termination process Housing: Black, high-temperature thermoplastic, UL 94V-0 Contact: Phosphor Bronze Reference Information Plating: Gold flash over Palladium Nickel Product Specification: PS-71425-9999 PCB Thickness: 1.57 and 2.36mm (.062 and .093") Packaging: Tray Operating Temperature: -55 to +85°C UL File No.: E29179 CSA File No.: LR19980-5 Mates With: Ultra+ VHDCI plug kit 71425 Designed In: Millimeters s Conforms to EIA/SFF specifications to ensure Features and Benefits 0.80mm (.031") Pitch Ultra+™ VHDCI Wire-to-Board Receptacle 74337 Stacked, Right Angle CATALOG DRAWING (FOR REFERENCE ONLY) Version 1 footprint shown. Version 4 footprint features two board lock holes for the upper connector and two board lock holes for the lower connector (refer to Sales Drawing for details). ORDERING INFORMATION AND DIMENSIONS Circuits With Screwlocks 74337-0040 74337-0064 74337-0039 74337-0073 With Cover 74337-0012 74337-0051* 74337-0011 74337-0070 Order No. With Screwlocks and Cover Without Screwlocks or Cover 74337-0038 74337-0016 74337-0054 74337-0061 74337-0037 74337-0015 74337-0072 74337-0071 Footprint Version 1 4 1 1 Dimension P 2.08 (.082) 2.08 (.082) 2.30 (.090) 3.44 (.135) 1 36 * W ithout enhanced shield and ground tabs Americas Headquarters Lisle, Illinois 60532 U.S.A. Tel:1-800-78MOLEX Fax:630-969-1352 Far East North Headquarters Yamato, Kanagawa, Japan Tel:81-462-65-2324 Fax:81-462-65-2366 Far East South Headquarters Jurong, Singapore Tel:65-6-268-6868 Fax:65-6-265-2985 European Headquarters Munich, Germany Tel:49-89-413092-0 Fax:49-89-401527 Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. Tel:630-969-4550 V i si t o u r W e b si t e at h t t p:/ / www.mo l e x .co m/ pro du ct / v h dci .h t ml Order No. USA-172 Printed in USA/2.5K/JI/JI/2002.05 © 2002, Molex The new 0.80mm (.031") Pitch Dual Stack Ultra+ VHDCI (Very High Density Cable Interface) connectors from Molex are ideal for demanding next generation SCSI applications. They have been designed to meet ANSI/SFF-8441 and SPI-4 requirements while supporting HBA applications and other equipment requiring high port densities. These space-saving dual-stacked receptacles have 136 circuits in a two-row configuration, providing the most features for maximum performance and reliability. An optional cover is available, eliminating risk of electrical shorts to panels or adjacent printed circuit boards in densely packaged equipment. Panel grounding tabs provide a superior ground path to a panel or bracket for maximum EMI protection. High performance terminals with lead-ins that have a large radius minimize stubbing while improving plug insertion. 0.80mm (.031") Pitch Ultra+™ VHDCI Wire-to-Board Dual Stack Receptacle APPLICATIONS s File and Network Servers s RAIDs (Redundant Arrays of Independent Disks) s Network Attached Storage (NAS) devices s PCI Add-In cards s Host Bus Adapter (HBA) cards s Workstations s Other data transfer applications RAID Data Storage Device PCI Add-In Card