74650-2502

FEATURES AND SPECIFICATIONS Features and Benefits s s s s s s Up to 5.0 Gbps bandwidth per signal pair enables state-of-the-art system design and performance 2.00 by 2.25mm (.079 by .089”) pitch provides real signal density of 10 differential pairs for 5-row and 6-row and 15 differential pairs for 8-row per centimeter (25 and 38 pairs respectively per inch) Minimum distance between daughtercards: – 5-row system offers 15.00mm (.591") – 6-row system offers 18.00mm (.709") – 8-row system offers 22.00mm (.866") Ground planes between signal columns provide tightly controlled impedance for rise times down to 50 picoseconds (10-90%). This ensures very low cross talk between signals within and between columns Ground pins are in the same grid as signal pins, allowing wider channels for PCB routing and traces up to 0.25mm (.010”) wide 6-row or 8-row VHDM-HSD wafers can be applied to the same stiffener as standard VHDM® 6-row or 8row wafers. The combination of VHDM and VHDMHSD wafers, grouped together in the same stiffener, provides cost effective solutions to different performance parameters 2.00 by 2.25mm (.079 by .089") Pitch 5-Row, 6-Row and 8-Row VHDM-HSD™ Module-to-Backplane Connector System The daughtercard connector consists of a metal stiffener just as with the VHDM system. The system combines the signal wafers, power modules and guidance modules into one continuous connector that can be ordered as a single specific part number. The card pitch of the VHDMHSD 8-row system is the same as the standard VHDM 8row system, allowing both signal wafer types for single ended and differential pair to be used together. This The same great modularity features and components of modularity and design flexibility allow engineers to VHDM are provided in the VHDM-HSD. The 5-row and 6incorporate both connector systems on the same row systems feature 2 signal pairs per column and the platforms. The system is based on a 2.00mm (.079") 8-row system features 3 signal pairs per column in pitch and includes vertical and right angle products that increments of 10 and 25 columns. All circuits are can be configured up to 2000 circuits. The maximum utilized as signal circuits without the need to use some as length of a daughtercard connector on a single stiffener ground circuits. is 300mm (12"). The Very High Density Metric High Speed Differential (VHDM-HSD) connector system has been expanded to include 5-row, 6-row and 8-row daughtercard and backplane modules. VHDM-HSD is designed for differential-pair architecture applications that require very high interconnect density and signal integrity in a single-ended configuration. The backplane connectors feature headers with open ends for continuous side-to-side stacking and headers with guide pins and polarizing keys on either end to aid in proper alignment of the mating daughtercard. The power modules occupy just a small width and hold sequentially matable pins that each manage 10.0 amps of current. Molex offers application tooling for pressing VHDM-HSD connectors into PCBs as separate modules or as complete assemblies. VHDM-HSD cable assemblies are also available for connecting backplane headers to highperformance cables. N ote: VHDM and VHDM-HSD are trademarks or registered trademarks of Teradyne,Inc. FEATURES AND SPECIFICATIONS Applications The VHDM-HSD products are used in very high speed, short rise-time, high circuit count applications connecting daughtercards to the backplane: s s s s s Network Switches Routers Computer Servers Telecommunication Equipment Internetworking Devices 8 row Version 2.00 by 2.25mm (.079 by .089") Pitch 5-Row, 6-Row and 8-Row VHDM-HSD™ Module-to-Backplane Connector System Modular Construction Internal Ground Planes 10 amp Power Blades Press Fit Right Angle Receptacle ORDERING INFORMATION D aughtercard Assembly S ignal wafers, power modules and guide modules sequentially assigned by application B ackplane Header Pin Height Signal Module Standard Loaded 0.76µm (30µ”) Gold 4.25mm (.167”) 4.75mm (.187”) O pen Ended 5.15mm (.203”) 6.25mm (.266”) 4.25mm (.167”) 4.75mm (.187”) Left Guide Pin No Polarizing Key 5.15mm (.203”) 6.25mm (.266”) 4.25mm (.167”) 4.75mm (.187”) Left Guide Pin “A” Polarizing Key 5.15mm (.203”) 6.25mm (.266”) 4.25mm (.167”) 4.75mm (.187”) Right Guide Pin No Polarizing Key 5.15mm (.203”) 6.25mm (.266”) 4.25mm (.167”) 4.75mm (.187”) Right Guide Pin “A” Polarizing Key 5.15mm (.203”) 6.25mm (.266”) Backplane Power and Guide Components P ower Module Keying Post Guide Pin N ote: VHDM and VHDM-HSD are trademarks or registered trademarks of Teradyne,Inc. Configuration VHDM-HSD wafers Combination of VHDM and VHDM-HSD wafers 5-Row 10-Column 74695-1003 74695-1001 74695-1004 74695-1002 74696-1003 74696-1001 74696-1004 74696-1002 74696-1013 74696-1011 74696-1014 74696-1012 74697-1003 74697-1001 74697-1004 74697-1002 74697-1013 74697-1011 74697-1014 74697-1012 25-Column 74695-2503 74695-2501 74695-2504 74695-2502 74696-2503 74696-2501 74696-2504 74696-2502 74696-2513 74696-2511 74696-2514 74696-2512 74697-2503 74697-2501 74697-2504 74697-2502 74697-2513 74697-2511 74697-2514 74697-2512 5-Row and 6-Row 74029-6000 74069-0010 74076-0001/0002 10-Column 74979-1003 74979-1001 74979-1004 74979-1002 – – – – – – – – – – – – – – – – 5-Row 74670-XXXX 74686-XXXX 6-Row 25-Column 74979-2503 74979-2501 74979-2504 74979-2502 – – – – – – – – – – – – – – – – 6-Row 74880-XXXX 74886-XXXX 8-Row 10-Column 74649-1003 74649-1001 74649-1004 74649-1002 74650-1003 74650-1001 74650-1004 74650-1002 74650-1013 74650-1011 74650-1014 74650-1012 74651-1003 74651-1001 74651-1004 74651-1002 74651-1013 74651-1011 74651-1014 74651-1012 8-Row 74029-8000 74069-0010 74076-0001/0002 8-Row 74680-XXXX 74686-XXXX 25-Column 74649-2503 74649-2501 74649-2504 74649-2502 74650-2503 74650-2501 74650-2504 74650-2502 74650-2513 74650-2511 74650-2514 74650-2512 74651-2503 74651-2501 74651-2504 74651-2502 74651-2513 74651-2511 74651-2514 74651-2512 Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX amerinfo@molex.com Far East North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 feninfo@molex.com Far East South Headquarters Jurong, Singapore 65-6-268-6868 fesinfo@molex.com European Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. 630-969-4550 V isit o u r W e b sit e a t h t t p:/ / www.mo l e x .co m/ pro du ct / back pl an / h sd.h t ml Order No. USA-158 Rev. 2 Printed in USA/2.5K/JI/JI/2003.03 © 2003, Molex