75005-0X04

FEATURES AND SPECIFICATIONS Combination High Speed Mezzanine 1.20mm (.047") Pitch Plateau HS Mezz™ High Speed Mezzanine 0.635mm (.025") Pitch SlimStack™ SMT Stacking Board-to-Board Combining Plateau HS Mezz and SlimStack stacking connectors optimizes performance and cost for high circuit count applications Molex offers a significant cost reduction over Combinations of mated heights from 10.00 to competing products for high-circuit count board-to15.00mm (.354 to .591”) and packaging styles are board applications with the Combination High Speed also available, including tubes and embossed tape with Mezzanine solutions. Achieve superior electrical or without pick-and-place covers. performance and signal speeds up to 10Gbps and beyond utilizing the differential-pair design of the Plateau HS Mezz system. At the same time, double up on circuit density and cost savings with the SlimStack family of mezzanine-style connectors for single-ended speeds up to 3Gbps. Plateau HS Mezz and SlimStack are well suited to work in tandem for a range of mezzanine applications. Connector designs provide generous lead-ins, allowing for maximum processing and mismating tolerances. Features and Benefits Plateau HS Mezz ■ Advanced gold-plated plastic housings with integrated shielding system support high-speed differential signaling in excess of 10Gbps ■ Contacts on 1.20mm (.047”) centerline pitch arranged in isolated differential pairs on 3.50mm (.138”) pitch for controlled impedance ■ Multiple stack heights from 10.00 to 25.00mm (.394 to .984”) with circuit size ranging from 6 to 36 pairs (12 to 72 circuits) SlimStack ■ Contacts on 0.635mm (.025”) centerline pitch support single-ended signal speeds up to 3Gbps ■ Gold plated contacts with wide-angled mating surfaces to minimize risk of damage during mating ■ Multiple stack heights from 6.00 to 16.00mm (.236” to .630”) with circuit sizes ranging from 20 to 240 circuits for high-density design flexibility Mezzanine card with HS Mezz and SlimStack for a cost effective solution using high-speed and lower-speed requirements. SlimStack Plateau HS Mezz Combination High Speed Mezzanine arrangement absorbs up to 0.1mm in mis-alignment in X and Y axis when 2 mating pairs are used. APPLICATIONS ■ Switches and Hubs ■ Routers ■ Servers and Blade Servers ■ Workstations ■ Storage Devices SPECIFICATIONS Combination High Speed Mezzanine SlimStack Plateau HS Mezz 1.20mm (.047") Pitch Plateau HS Mezz™ High Speed Mezzanine 0.635mm (.025") Pitch SlimStack™ SMT Stacking Board-to-Board Electrical Upper-End Speed: 10.0Gbps (6.8GHz) No special S:G pattern needed Impedance: 100 ± 10 ohms at 50 psec risetime (10/90%) for all stack heights Crosstalk: Less than 2% @ 50 psec Current Rating: 1.5A per circuit Electrical Upper-End Speed: 3Gbps (2GHz) Single-ended 1:1 S:G pattern Impedance: 64 ohms - 16.00mm (.630”) stack height Crosstalk: Less than 8% @ 50 psec Current Rating: 0.5A per circuit ORDERING INFORMATION Circuit Size Plateau HS Mezz SlimStack Plug Plateau HS Mezz Receptacle Plug 53553 10.00mm (.394“) 12, 24, 48, 72 20, 40, 60, 80, 100, 120, 140, 160, 180, 200 75003-0X05 75005-0X04 53627* 12.00mm (.472“) 12, 24 20 to 180 40 to 80 75003-0X05 75005-0X06 55091 53481 13.00mm (.512“) 12, 24 20 to 180 75003-0X08 75005-0X04 53625* 53552 15.00mm (.591“) 12, 24, 48, 72 40 to 140 75003-0X08 75003-0X10 75005-0X06 75005-0X04 53649* *Embossed tape and reel packaging Plateau HS Mezz Circuit Sizes Mated Stack Height SlimStack Receptacle. 52760 52885* 52760 52885* 52837 52901* 52837 52901* 52837 52901* 52837 52901* 52837 52901* X=3 X=0 X=1 X=2 12 circuit (6 pair) 24 circuit (12 pair) 48 circuit (24 pair) 72 circuit (36 pair) Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX amerinfo@molex.com Order No. USA-330 Far East North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 feninfo@molex.com Far East South Headquarters Jurong, Singapore 65-6-268-6868 fesinfo@molex.com Visit our Web site at http://www.molex.com Printed in USA/10K/JI/JI/2006.02 European Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. 630-969-4550 Fax:630-969-1352 ©2006, Molex