78028-0118

FEATURES AND SPECIFICATIONS Molex’s PCI Express* connector offers greater signaling bandwidths for today’s workstation and server applications PCI Express is a third generation I/O architecture. PCI-SIG* recently updated PCI Express specifications to greater signaling bandwidth. Unlike the previous version in which the PCI bus is implemented via a multi-drop parallel architecture, PCI Express now incorporates a point-to-point signaling using differential pairs operating at 2.5 Gbps. PCI Express provides adequate bandwidth to support developing I/O such as Infiniband and 10G fiber channel. Molex’s press fit version of PCI Express provides an alternative for customers who require solderless termination on PCBs which have a high layer count. All Molex PCI Express connectors are compliant with PCI-SIG* specifications. For more information on these specifications please see www.pcisig.com PCI Express* Connectors 78028 Vertical Press fit Features and Benefits High-temperature thermoplastic housing for lead-free processing Keying design ensures correct mating of card module to edge card connector Press fit termination allows solderless termination on high layer count PCBs Complies with PCI-SIG industry specifications ensure connectors support all PCI Express module cards available in the market Ridge design will be compatible with module cards that require a retention clip for secure retention SPECIFICATIONS Reference Information Packaging: Tray UL File No.: Pending CSA File No.: Pending Mates With : PCI Express®* module card Designed In: mm Electrical Voltage: 50 Volts AC (RMS)/DC Current: 1.1 Amps/pin Contact Resistance: 30 milliohms max Dielectric Withstanding Voltage: 500V AC Insulation Resistance: 1000 Megohms min Mechanical Max Terminal Retention Force: 2.94 N min/Terminal Mating Force: 1.15 N max/contact pair Un-Mating Force: 0.15 N min/contact pair Durability: 50 Cycles Physical Housing: High Temperature Nylon, Black, UL 94V-0 Contact: Copper Alloy Plating: Contact Area —0.76 µm Gold or 0.38 µm Gold Solder Tail Area — Tin Underplating — Nickel PCB Thickness: See Ordering Tables Operating Temperature: - 55 ºC to +85 ºC *PCI Express, ExpressModule, and PCI-SIG are trademarks of PIC-SIG Markets and Applications Servers Desktop Mobile Networking and Communications PCI Express EdgeCard Connector 78028 Vertical Press fit Ordering Information Lead Free Order Number 78028-0008 78028-0108 78028-1108 78028-0018 78028-0118 78028-1118 78028-0016 78028-0116 78028-1116 78028-0026 78028-0126 78028-1126 Circuits Plating Thickness PC Tail Length 2.54mm (.100”) Recommended PCB Thickness 2.3mm (.090”) 2.6mm (.100”) 3.2mm (.125”) 2.3mm (.090”) 2.6mm (.100”) 3.2mm (.125”) 2.3mm (.090”) 2.6mm (.100”) 3.2mm (.125”) 2.3mm (.090”) 2.6mm (.100”) 3.2mm (.125”) 0.76µm (30µ") 98 2.79mm (.110”) 3.43mm (135”) 2.54mm (.100”) 0.38µm (15µ") 2.79mm (.110”) 3.43mm (135”) 2.54mm (.100”) 0.76µm (30µ") 164 0.38µm (15µ") 2.79mm (.110”) 3.43mm (135”) 2.54mm (.100”) 2.79mm (.110”) 3.43mm (135”) Americas Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 1-800-78MOLEX amerinfo@molex.com Far East North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 feninfo@molex.com Far East South Headquarters Jurong, Singapore 65-6-268-6868 fesinfo@molex.com European Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com Corporate Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 630-969-4550 Order No. SNG-041 Visit our Web site at http://molex.com