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86401

86401

  • 厂商:

    MOLEX

  • 封装:

  • 描述:

    86401 - FlexPlane™ Optical Circuitry - Molex Electronics Ltd.

  • 数据手册
  • 价格&库存
86401 数据手册
FEATURES AND SPECIFICATIONS Features and Benefits ■ Diverse substrate size, shape and packaging provides efficient and manageable solution to high fiber count systems ■ Compatible with mass and discrete fiber terminations ensuring a customized solution ■ Available in virtually any routing scheme provides a variety of design alternatives ■ Direct or fusion splice terminations eliminate additional insertion loss ■ Singlemode, multimode or hybrid versions provide variety of options Applications ■ Computing Equipment ■ Telecommunication Equipment - Transmission - Switching - Multiplexing ■ Broadband Equipment - Amplifiers Reference Information Telecordia GR-20 compliant Use with: MT, MTP*, MPO, MT-RJ, SMC, LC, FC, ST†, SC, MU, BMTP and HBMTTM connector families FlexPlane™ Optical Circuitry 86401 *MTP is a registered trademark of US Conec Ltd. †ST is a trademark of Lucent Technologies Molex’s FlexPlane optical flex circuit provides one of the highest density and versatile interconnect systems on the market toda y. For high fiber count interconnects in backplanes and cross-connect systems, the FlexPlane’s high density routing on a flexible, flame-retardant subs trate provides a manageable means of fiber routing from card-to-card or shelf to shelf. A variety of interconnects including blind mating MT and MTP based connectors can be used to connect the optical flex circuits to individual cards in a shelf. Available in any routing scheme, fiber can be routed point-to-point, in a shuffle, or in a logical pattern. Direct or fusion-spliced terminations are available. Non-fusion splice lead lengths are available up to two meters. Molex provides a variety of FlexPlane interconnect options including: MT, MTP, MPO, MT-RJ, SMC, LC, FC, ST, SC, MU, up to 12 fiber Backplane MTP (BMTP) and up to 96 fiber High Density Backplane MT (HBMT). Packaging alternatives include standard bare flexible substrate sandwiched in FR-4 or custom laminating. Each FlexPlane circuit can be fully tested down to the per port insertion loss and return loss. ORDERING INFORMATION Order Number 86401-XXXX Description Contact Inside Sales for Ordering Information Americas Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 1-800-78MOLEX amerinfo@molex.com Order No. USA-186 Rev. 4 Far East North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 feninfo@molex.com Far East South Headquarters Jurong, Singapore 65-6-268-6868 fesinfo@molex.com European Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com Corporate Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 630-969-4550 Visit our Web site at http://www.molex.com/fiber Printed in USA/0K/EL/2003.02 ©2003, Molex
86401 价格&库存

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