87715-9X08

FEATURES AND SPECIFICATIONS Molex offers the new PCI Express* revision 2 specs connectors in a through hole configuration for high-bandwidth workstation and server applications PCI Express is a third generation I/O architecture. PCI-SIG* recently revised the PCI Express specifications from version 1.1 to version 2.0. This revision doubles the PCI Express interconnect bit rate from 2.5 GT/s (gigatransfer per second) to 5 GT/s per lane. Unlike the previous version in which the PCI bus was implemented via multi-drop parallel architecture, the PCI Express incorporates a point-to-point signaling using differential pairs. A 16-lane link now could provide approximately 16Gbps of data-transfer. With this increase in signaling speed, the PCI Express now provides better support to high-bandwidth applications. It is also backward compatible with current PCI Express 1.1 version products. Molex’s through hole connector version of the PCI Express version 2.0 specs provides customers design flexibility for a narrower interconnect links. This would improve data-transfer at a lower cost. All Molex PCI Express connectors are compliant with PCI-SIG* specifications. For more information on these specifications please see www.pcisig.com *PCI Express, ExpressModule, and PCI-SIG are trademarks of PCI-SIG 1.00mm (.039”) Pitch PCI Express* connector 87715 Vertical, Through Hole Features • High-temperature thermoplastic housing • Complies with PCI-SIG industry specifications • Keying design allows only one mating orientation • Hot Plugging Benefits • Withstands lead-free processing • Allows connectors to support all PCI Express module cards available in the market. • Ensures correct mating of card module to edge card connector • Allows for insertion and removal of card without system shut down, facilitates connection in cramped spaces SPECIFICATIONS Reference Information Packaging: Tray UL File No.: TBD CSA File No.: TBD Mates With: PCI Express Card Designed In: mm Electrical Voltage: 50 Volts AC (RMS)/DC Current: 1.1A Contact Resistance: 30 milliohms max Dielectric Withstanding Voltage: 500V AC Insulation Resistance: 1000 Megohms min Mechanical Max Terminal Retention Force: 5 N min/Terminal Mating Force: 1.15 N max/contact pair Unmating Force: 0.15 N min/contact pair Durability: 50 Cycles Physical Housing: High Temperature Nylon, UL 94V-0 Contact: Copper Alloy Plating: Contact Area —0.76 µm Gold or 0.38 µm Gold Solder Tail Area — Tin Underplating — Nickel Operating Temperature: - 55 ºC to +85 ºC Markets and Applications • PCI Express 87715 Servers Desktop Networking and Communications 1.00mm (.039”) Pitch PCI Express* connector 87715 Vertical, Through Hole II/O Legacy Riser PCI Express Connector PCI Express Add-in Card I/O Server Board PCI Express Riser Ordering Information Order No. (Lead-free) 87715-9X00 87715-9X01 87715-9X02 87715-9X03 PCI Express connector, version 2, Vertical, Through hole Black color 87715-9X04 87715-9X05 87715-9X06 87715-9X07 87715-9X08 87715-9X09 Circuit size Replace X with: 0= 36 1= 64 2 = 98 3= 164 PC Tail Descriptions Plating Gold Flash 0.254µm (10µ”) Gold (Au) 0.38µm (15µ”) Gold (Au) Gold Flash 0.254µm (10µ”) Gold (Au) 0.38µm (15µ”) Gold (Au) 0.76µm (30µ") Gold (Au) Gold Flash 2.54mm (0.100”) 3.00mm (0.118”) 2.54mm (0.100”) 2.30mm (0.091”) 0.38µm (15µ”) Gold (Au) 0.76µm (30µ") Gold (Au) 3.00mm (0.118”) Americas Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 1-800-78MOLEX amerinfo@molex.com Asia Pacific North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 feninfo@molex.com Asia Pacific South Headquarters Jurong, Singapore 65-6-268-6868 fesinfo@molex.com Visit our Web site at http://molex.com European Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com Corporate Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 630-969-4550 Order No. 9876501962 ©2008, Molex