010-89-7760

厂商：
MOLEX1
封装：
描述：
010-89-7760 - 2.54mm (.100") Pitch C-GridÂ® Breakaway Header, Dual Row, Vertical, High Temperature, ...

数据手册：

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010-89-7760 数据手册

This document was generated on 03/29/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0010897760 Active 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 76 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail Documents: 3D Model Drawing (PDF) Product Specification PS-70280 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Product Name PCB Headers 70280 Board-to-Board, Wire-to-Board C-Grid® Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Temperature Range - Operating Yes 76 76 Black 50 No 94V-0 No No None None Copper Alloy Gold Tin High Temperature Thermoplastic 2 Vertical 0.110 In 2.79 mm No None 0.062 In 1.60 mm Bag 0.100 In 2.54 mm 30 0.75 75 1.875 No No No Yes -40°C to +105°C Search Parts in this Series 70280Series Termination Interface: Style Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 3A 250V Solder Process Data Lead-free Process Capability Process Temperature max. C SMC & Wave Capable (TH only) 260 Material Info Reference - Drawing Numbers Product Specification Sales Drawing PS-70280 SDA-70280-0001-4000 This document was generated on 03/29/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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010-89-7760

1. 物料型号： - 型号：0010897760 - 状态：Active（活跃）

2. 器件简介： - 描述：2.54mm (.100") 间距 C-Grid® 断路式排母，双排，垂直，高温，76 路，0.76µm (30µ") 金 (Au) 选择性电镀，锡 (Sn) PC尾电镀，2.72mm (.107") PC尾。 - 产品家族：PCB Headers（PCB排母） - 系列：70280 - 应用：Board-to-Board, Wire-to-Board（板对板，线对板）

3. 引脚分配： - 引脚数量：76路（最大和已加载）

4. 参数特性： - 颜色 - 树脂：黑色 - 耐久性（最大插拔次数）：50次 - 阻燃等级：94V-0 - 引脚间距：2.54mm - 金属材质：Copper Alloy（铜合金） - 电镀材质 - 接触：Gold（金） - 电镀材质 - 终止：Tin（锡） - 行数：2 - 垂直方向：垂直 - PC尾长度：2.79mm - 推荐PCB厚度：1.60mm - 电镀最小厚度 - 接触：0.75um（30uin） - 电镀最小厚度 - 终止：1.875um（75uin）

5. 功能详解： - 断路式设计：是 - 极化到连接部件：否 - 堆叠：是 - 温度范围 - 操作：-40°C至+105°C

6. 应用信息： - 应用于板对板和线对板的连接。

7. 封装信息： - 封装类型：垂直 - 包装类型：袋装 - 引脚间距：2.54mm（0.100In） - 电镀最小厚度：接触部位0.75um，终止部位1.875um

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