0347360027

12 11 10 9 7 8 5 6 4 3 2 1 H H B D A 86 B 80 D (AF) (AG) B SECTION C-C SECTION B-B G G ISO VIEWS SCALE 3:1 �16.01� �7.04� �5.97� 54 S �2.87� E C F 2.26 ±0.05 59 NOTES: (UNLESS OTHERWISE SPECIFIED) 1.88 ±0.07 74 F 1. MATERIALS: SEE TABLE 2. PACKAGING SPECIFICATION: PK-31300-516 AND PK-30907-759 3. CRIMPING PER APPLICATION SPECIFICATION AS-33468-002 4. CRIMPED LEAD MEETS THE FOLLOWING: 4.1. SAE/USCAR-21, MAY 2002 4.2. SAE/USCAR-2, REV. 3, APRIL 2001 4.3. SAE/USCAR-12, REV. 2 4.4. GMW #3191 AUGUST 22, 2000 (DRAFT) TEMPERATURE CLASS 3, APPLIES ONLY TO Au PARTS C TRADEMARK, DATE CODE, GRIP CODE 5. PLATING NOTES: 5.1 TIN PLATING (ENTIRE TERMINAL) E E 5.1.1 ELECTRO REFLOW 1.90 - 3.30 MICROMETERS TIN OVER 0.25 - 0.76 　　　 MICROMETERS NICKEL 　　　 5.2 GOLD PLATING 5.2.1 UNDERPLATE OVERALL 1.25-2.25 MICROMETERS DUCTILE 　　　 SULPHAMATE NICKEL 　　　 5.2.2 ELECTRODEPOSITED GOLD 0.76 - 1.5 MICROMETERS IN 　　　 CONTACT AREAS 　　　 5.2.3 ELECTRODEPOSITED TIN MATTE FINISH 2.5 - 4.0 MICROMETERS 　　　 IN CRIMP AREA CUTOFF 5.3 SILVER PLATING T 54A D �3.65� PLATING ID SEE TABLE SECTION D-D C WIRE SIZE GRIP CODE 0.35 mm² 0.5-0.75 mm² A B PROGRESSION SYMBOLS = 0 = 0 = 0 A DOCUMENT STATUS 12 P1 RELEASE DATE 11 2018/08/13 10 12:08:32 C 9 8 7 6 SCALE mm 5:1 = 0 4 PLACES ± = 0 3 PLACES ± = 0 2 PLACES ± = 0 DIM DIM DIM A B S DIM T 7.15 0.26 DIM DIM BASE PLATING AF AG MATERIAL ID 2.3 2.8 (2.1) (2.5) COPPER ALLOY 2.3 6.97- 0.26 2.8 (2.1) (2.5) 7.27 ±0.07 COPPER ALLOY 2.7 3.1 (2.5) (2.7) COPPER ALLOY 2.7 6.97- 0.26 3.1 (2.5) (2.7) 7.27 ±0.07 COPPER ALLOY ±0.10 ±0.07 7.15 0.26 ±0.10 ±0.07 C Sn Lead Free Au Lead Free Ag Lead Free Sn Lead Free Au Lead Free Ag Lead Free B CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) ± = 0 REEL PAYOFF DIRECTION D B D B D B D B D B D B THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS ANGULAR TOL = 0 PART NUMBER 33468-0021 33468-0022 33467-0021 33467-0022 34736-0025 34736-0026 33468-0023 33468-0024 33467-0023 33467-0024 34736-0027 34736-0028 �8.89� B FORMAT: master-tb-prod-C REVISION: H DATE: 2018/01/18 D 5.3.1 UNDERPLATE OVERALL 1.25-2.25 MICROMETERS DUCTILE 　　　 SULPHAMATE NICKEL 　　　 5.3.2 ELECTRODEPOSITED PURE SILVER 99.5% PURITY SEMI-BRIGHT 　　　 FINISH WITH NO BRIGHTENERS OR CHROMATES 1.9 - 3.3 　　　 MICROMETERS IN CONTACT AREAS 　　　 5.3.3 ANTI-TARNISH TREATMENT FOR SILVER PLATED AREA: SYNTHETIC HYDROCARBON CONTACT SURFACE FINISH OR EQUIVALENT 　　　 5.3.4 ELECTRODEPOSITED TIN MATTE FINISH 2.5 - 4.0 MICROMETERS 　　　 IN CRIMP AREA 1 PLACE ± 0 PLACES ± 3 0.10 0.3 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 5 EC NO: 601885 DRWN: NVENKATESHSH CHK'D: JPRUNEAU APPR: TOMSMITH INITIAL REVISION: DRWN: KFERGUSON APPR: BMOSER THIRD ANGLE PROJECTION 4 2018/06/01 2018/08/09 2018/08/13 MX64 ISO RECEPTACLE TERMINAL PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2011/10/04 2011/11/01 DRAWING SERIES C-SIZE 33468 3 SD-33468-002 MATERIAL NUMBER PSD 001 CUSTOMER GENERAL MARKET SEE TABLE 2 B1 SHEET NUMBER 1 OF 1 1 A