12
H
11
10
9
7
8
4
B 80
D
D
5
6
3
2
1
A 86
H
(AF)
(AG)
SECTION C-C
SECTION B-B
G
�15.98�
�7.08�
TRADEMARK,
DATE CODE,
GRIP CODE
F
54
S
�5.98�
NOTES: (UNLESS OTHERWISE SPECIFIED)
1. MATERIALS: SEE TABLE
2. PACKAGING SPECIFICATION: PK-31300-516
AND PK-30907-759
�3.38�
2.26 ±0.05 59
C
B
3. CRIMPING PER APPLICATION SPECIFICATION AS-33468-001
1.88 ±0.07 74
E
F
4. CRIMPED LEAD MEETS THE FOLLOWING:
4.1. SAE/USCAR-21, MAY 2002
4.2. SAE/USCAR-2, REV. 3, APRIL 2001
4.3. SAE/USCAR-12, REV. 2
4.4. GMW #3191 AUGUST 22, 2000 (DRAFT)
TEMPERATURE CLASS 3, APPLIES ONLY TO Au PARTS
4.5 GMW #3191 JANUARY, 2005
TEMPERATURE CLASS 3, APPLIES ONLY TO Ag PARTS
C
B
G
ISO VIEWS
SCALE 3:1
5. PLATING NOTES:
5.1 TIN PLATING (ENTIRE TERMINAL)
5.1.1 ELECTRO REFLOW 1.90 - 3.30 MICROMETERS TIN OVER 0.25 - 0.76
MICROMETERS NICKEL
5.2 GOLD PLATING
E
E
5.2.1 UNDERPLATE OVERALL 1.25-2.25 MICROMETERS DUCTILE
SULPHAMATE NICKEL
5.2.2 ELECTRODEPOSITED GOLD 0.76 - 1.5 MICROMETERS IN
CONTACT AREAS
5.2.3 ELECTRODEPOSITED TIN MATTE FINISH 2.5 - 4.0 MICROMETERS
IN CRIMP AREA
5.3 SILVER PLATING
CUTOFF
D
5.3.1 UNDERPLATE OVERALL 1.25-2.25 MICROMETERS DUCTILE
SULPHAMATE NICKEL
5.3.2 ELECTRODEPOSITED PURE SILVER 99.5% PURITY SEMI-BRIGHT
FINISH WITH NO BRIGHTENERS OR CHROMATES 1.9 - 3.3
MICROMETERS IN CONTACT AREAS
5.3.3 ANTI-TARNISH TREATMENT FOR SILVER PLATED AREA:
SYNTHETIC HYDROCARBON CONTACT SURFACE FINISH OR
EQUIVALENT
5.3.4 ELECTRODEPOSITED TIN MATTE FINISH 2.5 - 4.0 MICROMETERS
IN CRIMP AREA
T 54A
�3.65�
PLATING ID
SEE TABLE
D
SECTION D-D
C
WIRE GRIP
SIZE CODE
22
AWG
18/20
AWG
�8.89�
B
A
B
PROGRESSION
PART
NUMBER
33468-0002
33468-0001
33467-0004
33467-0003
34736-1001
34736-2001
33468-0004
33468-0003
33467-0006
33467-0005
34736-1002
34736-2002
REEL
PAYOFF
DIRECTION
D
B
D
B
D
B
D
B
D
B
D
B
DIM DIM DIM
A
B
S
DIM
T
7.15
0.26
DIM DIM
BASE
PLATING
AF AG MATERIAL
ID
(2.1) (2.1)
COPPER
ALLOY
Sn
Lead Free
2.3
6.97- 0.26
(2.1) (2.1)
7.27 ±0.07
COPPER
ALLOY
Au
Lead Free
2.3
2.3
6.97- 0.26
(2.1) (2.1)
7.27 ±0.07
COPPER
ALLOY
Ag
Lead Free
3.0
2.9
7.15
(2.8) (2.6)
COPPER
ALLOY
Sn
Lead Free
3.0
2.9
6.97- 0.26
(2.8) (2.6)
7.27 ±0.07
COPPER
ALLOY
Au
Lead Free
3.0
2.9
6.97- 0.26
(2.8) (2.6)
7.27 ±0.07
COPPER
ALLOY
Ag
Lead Free
2.3
2.3
2.3
±0.10 ±0.07
0.26
±0.10 ±0.07
C
B
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
mm
5:1
CURRENT REV DESC:
GENERAL TOLERANCES
(UNLESS SPECIFIED)
A
DOCUMENT STATUS
12
FORMAT: master-tb-prod-C
REVISION: H
DATE: 2018/01/18
P1
RELEASE DATE
11
2018/08/13
10
ANGULAR TOL
±
4 PLACES
±
3 PLACES
±
2 PLACES
±
1 PLACE
±
0 PLACES
±
3
0.10
0.3
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
12:08:30
9
8
7
6
5
EC NO: 601885
DRWN: NVENKATESHSH
CHK'D: JPRUNEAU
APPR: TOMSMITH
INITIAL REVISION:
DRWN: DHEMNANI
APPR: BMOSER
THIRD ANGLE PROJECTION
4
2018/05/31
2018/08/09
2018/08/13
MX64 SAE
RECEPTACLE TERMINAL
PRODUCT CUSTOMER DRAWING
DOC TYPE DOC PART REVISION
DOCUMENT NUMBER
2007/04/12
2007/04/13
DRAWING
SERIES
C-SIZE
33468
3
SD-33468-001
MATERIAL NUMBER
PSD 001
CUSTOMER
GENERAL MARKET
SEE TABLE
2
G3
SHEET NUMBER
1 OF 1
1
A
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