0459856932

PRODUCT SPECIFICATION LOW PROFILE HYBRID (LPH)® TM INTERCONNECT SYSTEMS LPH Receptacle Assembly LPH Plug Assembly Series: 45984 Series: 45985 LPH Interconnect System Web Page REVISION: H ECM INFORMATION: EC No: 624413 DATE: 2019/09/25 DOCUMENT NUMBER: PS-45984-001 TABLE OF CONTENTS TITLE: SHEET No. PRODUCT SPECIFICATION FOR LOW PROFILE 1 of 17 HYBRID (LPH)® TM INTERCONNECT SYSTEMS DOC DOC CREATEDHYBRID / REVISED BY: BY: APPROVED BY: LOWPART: PROFILE (LPH)CHECKED INTERCONNECT TYPE: SYSTEMS MBELLE PS 001 MBN02 HTHYAGARAJ Molex is a registered trademark of Molex, LLC in the Unites States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION Table of Contents ITEMS PAGE 1.0 SCOPE ....................................................................................................................... 3 2.0 PRODUCT DESCRIPTION ........................................................................................ 3 2.1 DESCRIPTION, SERIES NUMBER, AND LINKS ................................... 3 2.2 DIMENSIONS, MATERIALS, PLATINGS ................................................ 3 2.3 ENVIRONMENTAL CONFORMANCE .................................................... 3 2.4 SAFETY AGENCY LISTINGS ................................................................. 3 3.0 APPLICABLE DOCUMENTS AND SPECIFICATION ................................................ 4 3.1 MOLEX DOCUMENTS ............................................................................ 4 3.2 INDUSTRY DOCUMENTS ...................................................................... 4 4.0 ELECTRICAL PERFORMANCE RATINGS ............................................................... 4 4.1 VOLTAGE ................................................................................................ 4 4.2 CURRENT**............................................................................................. 5 4.3 TEMPERATURE ...................................................................................... 8 4.4 DURABILITY ............................................................................................ 8 5.0 QUALIFICATION ........................................................................................................ 8 6.0 PERFORMANCE ........................................................................................................ 9 6.1 ELECTRICAL PERFORMANCE .............................................................. 9 6.2 MECHANICAL PERFORMANCE .......................................................... 10 6.3 ENVIRONMENTAL PERFORMANCE ................................................... 11 7.0 TEST SEQUENCE GROUPS ................................................................................... 12 8.0 MATING AND ALIGNMENT ..................................................................................... 14 8.1 Right Angle Receptacle to Edge Card ...................................................... 14 8.2 Right Angle Receptacle to Right Angle Plug ............................................ 14 8.3 Right-Angle Plug and Right-Angle Receptacle Fully Mated Condition ..... 15 9.0 SOLDER INFORMATION ......................................................................................... 16 9.1 SOLDER PROCESS TEMPERATURES ............................................... 16 9.2 REFLOW SOLDERING PROFILE ......................................................... 16 10.0 PACKAGING ............................................................................................................ 17 LPH Interconnect System Web Page REVISION: H ECM INFORMATION: EC No: 624413 DATE: 2019/09/25 DOCUMENT NUMBER: PS-45984-001 TABLE OF CONTENTS TITLE: SHEET No. PRODUCT SPECIFICATION FOR LOW PROFILE 2 of 17 HYBRID (LPH)® TM INTERCONNECT SYSTEMS DOC DOC CREATEDHYBRID / REVISED BY: BY: APPROVED BY: LOWPART: PROFILE (LPH)CHECKED INTERCONNECT TYPE: SYSTEMS MBELLE PS 001 MBN02 HTHYAGARAJ Molex is a registered trademark of Molex, LLC in the Unites States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION 1.0 SCOPE This specification covers the performance requirements and test methods for the following products listed by series numbers: 45984-**** 45985-**** 2.0 LPH Receptacle Assembly LPH Plug Assembly PRODUCT DESCRIPTION 2.1 DESCRIPTION, SERIES NUMBER, AND LINKS The Low-Profile Header (LPH) interconnect system consists of a right-angle plug and a right-angle receptacle. Each can be configured with 2 to 10 power contacts and 12 to 40 signal contacts. Additional options include guides and board mounting pegs. Receptacle can also mate to 1.57±0.15 mm / .062” ± .006” thick card edge. Both plug and receptacle connectors are throughhole solder into printed circuit boards and provide co-planer mate-ability. DESCRIPTION LPH Right Angle Receptacle Header Assembly LPH Right Angle Plug Header Assembly 2.2 SERIES NUMBER 45984 45985 DIMENSIONS, MATERIALS, PLATINGS Dimensions: See individual sales drawings. Material: RoHS compliant materials (LCP for housings, copper alloy for terminals). Plating: Gold on mating surfaces and tin at PC tail with nickel under-plating overall. 2.3 ENVIRONMENTAL CONFORMANCE To find product compliance information: a) Go to molex.com b) Enter the part number in the search field. c) At the bottom of the page go to “Environmental” to see compliance status. 2.4 SAFETY AGENCY LISTINGS UL File Number: E29179 CSA File Number: LR19980 LPH Interconnect System Web Page REVISION: H ECM INFORMATION: EC No: 624413 DATE: 2019/09/25 DOCUMENT NUMBER: PS-45984-001 TABLE OF CONTENTS TITLE: SHEET No. PRODUCT SPECIFICATION FOR LOW PROFILE 3 of 17 HYBRID (LPH)® TM INTERCONNECT SYSTEMS DOC DOC CREATEDHYBRID / REVISED BY: BY: APPROVED BY: LOWPART: PROFILE (LPH)CHECKED INTERCONNECT TYPE: SYSTEMS MBELLE PS 001 MBN02 HTHYAGARAJ Molex is a registered trademark of Molex, LLC in the Unites States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION 3.0 APPLICABLE DOCUMENTS AND SPECIFICATION 3.1 MOLEX DOCUMENTS See sales drawings and other sections of this specifications for the necessary referenced documents and specification. Assembly Drawings: SD-45984-****, SD-45985-****,459840200, 459850200 Molex Solderability Specification SMES-152 Molex Heat Resistance Specification AS-40000-5013 Molex Package Handling Specification 454990100-PK 3.2 INDUSTRY DOCUMENTS EIA-364-1000 UL-60950-1 CSA STD C22.2 NO. 182.3-M1987 4.0 ELECTRICAL PERFORMANCE RATINGS 4.1 VOLTAGE 250 Volts AC (RMS)/DC (Power) 30 Volts DC (Signal) Connector Rating per UL-1977 Connector voltage rating meets the connector approval level defined by UL 1977, Sect. 11 for spacing per table 11.1. Example: 1.2 mm for ≤ 250 volt; 3.2 mm for ≥ 250 volt. Exception taken for spacing less than those specified are permitted, if the device complies with the requirements in the dielectric voltage withstanding test per Sect.17. Application Voltage Guideline For application voltage requirements please refer to UL-60950 or other applicable standards, the creepage & clearance also needs to be determined based upon pads/traces on the PCB. LPH Interconnect System Web Page REVISION: H ECM INFORMATION: EC No: 624413 DATE: 2019/09/25 DOCUMENT NUMBER: PS-45984-001 TABLE OF CONTENTS TITLE: SHEET No. PRODUCT SPECIFICATION FOR LOW PROFILE 4 of 17 HYBRID (LPH)® TM INTERCONNECT SYSTEMS DOC DOC CREATEDHYBRID / REVISED BY: BY: APPROVED BY: LOWPART: PROFILE (LPH)CHECKED INTERCONNECT TYPE: SYSTEMS MBELLE PS 001 MBN02 HTHYAGARAJ Molex is a registered trademark of Molex, LLC in the Unites States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION 4.2 CURRENT** When tested in accordance with EIA-364-TP70: (Tested to 30deg.C max. rise above ambient) Ckt. Size 2 4 6 8 10 Current TBD 30 Amperes 27 Amperes 23 Amperes 20 Amperes Signal Contact: 1 Ampere per contact ** Current rating is application dependent. Above rating is for reference only. Appropriate de-rating is required per ambient conditions, copper weight of PCB needed to achieve thermal balance, gross heating from adjacent components, and other factors that influence connector performance. 4.2.1 CURRENT INTERRUPTION 30 Amps @ 48 Vdc – Power 1.0 Amp @ 30 Vdc – Signal LPH Interconnect System Web Page REVISION: H ECM INFORMATION: EC No: 624413 DATE: 2019/09/25 DOCUMENT NUMBER: PS-45984-001 TABLE OF CONTENTS TITLE: SHEET No. PRODUCT SPECIFICATION FOR LOW PROFILE 5 of 17 HYBRID (LPH)® TM INTERCONNECT SYSTEMS DOC DOC CREATEDHYBRID / REVISED BY: BY: APPROVED BY: LOWPART: PROFILE (LPH)CHECKED INTERCONNECT TYPE: SYSTEMS MBELLE PS 001 MBN02 HTHYAGARAJ Molex is a registered trademark of Molex, LLC in the Unites States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION LPH Interconnect System Web Page REVISION: H ECM INFORMATION: EC No: 624413 DATE: 2019/09/25 DOCUMENT NUMBER: PS-45984-001 TABLE OF CONTENTS TITLE: SHEET No. PRODUCT SPECIFICATION FOR LOW PROFILE 6 of 17 HYBRID (LPH)® TM INTERCONNECT SYSTEMS DOC DOC CREATEDHYBRID / REVISED BY: BY: APPROVED BY: LOWPART: PROFILE (LPH)CHECKED INTERCONNECT TYPE: SYSTEMS MBELLE PS 001 MBN02 HTHYAGARAJ Molex is a registered trademark of Molex, LLC in the Unites States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION Low Profile Hybrid Voltage Drop Vs. Current 8 Circuit & 4 Circuit 10 oz. Copper PCB 0.024 0.022 0.020 Voltage Drop - Volts (w/Bulk) 0.018 0.016 0.014 4 Circuit 8 Circuit 0.012 0.010 0.008 0.006 0.004 0.002 0.000 10.0 20.0 30.0 40.0 Current (Amps) LPH Interconnect System Web Page REVISION: H ECM INFORMATION: EC No: 624413 DATE: 2019/09/25 DOCUMENT NUMBER: PS-45984-001 TABLE OF CONTENTS TITLE: SHEET No. PRODUCT SPECIFICATION FOR LOW PROFILE 7 of 17 HYBRID (LPH)® TM INTERCONNECT SYSTEMS DOC DOC CREATEDHYBRID / REVISED BY: BY: APPROVED BY: LOWPART: PROFILE (LPH)CHECKED INTERCONNECT TYPE: SYSTEMS MBELLE PS 001 MBN02 HTHYAGARAJ Molex is a registered trademark of Molex, LLC in the Unites States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION 4.3 TEMPERATURE Operating Temperature Range (includes T-Rise from applied current): Non-Operating : - 40°C to + 105°C - 40°C to + 105°C Field Temperature and Field Life: 60°C for 10 years (based EIA-364-1000, table 8) Note: Temperature life test duration (section 6.3. item 2) is based on the assumption that the contact spends its entire life at the rated field maximum temperature (based on EIA-364-1000, table 8). 4.4 DURABILITY Plating Type Number of Cycles Gold Plated 250 As tested in accordance with EIA-364-1000 test method (see sec 6.2 item 3 of this specification). Durability per EIA-364-09 5.0 QUALIFICATION Laboratory condition, sample selection and test sequences are in accordance with EIA-364-1000. LPH Interconnect System Web Page REVISION: H ECM INFORMATION: EC No: 624413 DATE: 2019/09/25 DOCUMENT NUMBER: PS-45984-001 TABLE OF CONTENTS TITLE: SHEET No. PRODUCT SPECIFICATION FOR LOW PROFILE 8 of 17 HYBRID (LPH)® TM INTERCONNECT SYSTEMS DOC DOC CREATEDHYBRID / REVISED BY: BY: APPROVED BY: LOWPART: PROFILE (LPH)CHECKED INTERCONNECT TYPE: SYSTEMS MBELLE PS 001 MBN02 HTHYAGARAJ Molex is a registered trademark of Molex, LLC in the Unites States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION 6.0 PERFORMANCE 6.1 ELECTRICAL PERFORMANCE ITEM DESCRIPTION TEST CONDITION REQUIREMENT 6.1.1 Contact Resistance (Low Level) (EIA-364-23) Mate connectors: apply a maximum voltage of 20 mV and a current of 100 mA. Maximum Change: Signal Contact: 15 milliohm Power Contact: 0.75 milliohm 6.1.2 Contact Resistance (@Rated Current) Mate connectors: apply maximum voltage of 20mV at the rated current. Maximum Change: Signal Contact: 15 milliohm Power Contact: 0.75 milliohm 6.1.3 Insulation Resistance Apply 500 VDC between adjacent (EIA-364-21) terminals or ground. 6.1.4 Dielectric Withstanding Voltage (EIA-364-20) Apply 1500 VDC for 1 minute between adjacent terminals or ground. No breakdown 6.1.5 Temperature Rise Mate connectors Measure T-Rise @ Rated Current after 96 Hours. 30° C T-Rise LPH Interconnect System Web Page REVISION: H 5,000 megaohms minimum ECM INFORMATION: EC No: 624413 DATE: 2019/09/25 DOCUMENT NUMBER: PS-45984-001 TABLE OF CONTENTS TITLE: SHEET No. PRODUCT SPECIFICATION FOR LOW PROFILE 9 of 17 HYBRID (LPH)® TM INTERCONNECT SYSTEMS DOC DOC CREATEDHYBRID / REVISED BY: BY: APPROVED BY: LOWPART: PROFILE (LPH)CHECKED INTERCONNECT TYPE: SYSTEMS MBELLE PS 001 MBN02 HTHYAGARAJ Molex is a registered trademark of Molex, LLC in the Unites States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION 6.2 MECHANICAL PERFORMANCE ITEM DESCRIPTION TEST CONDITION REQUIREMENT 6.2.1 Mating Force, Single circuit (EIA-364-37) Mate connectors at a rate of 25 +/- 6 mm per minute. 110 g per signal pin 700 g per Power Contact (Maximum Values) 6.2.2 Unmating Force, Single circuit (EIA-364-37) Unmate connectors at a rate of 25 +/- 6 mm per minute. 15 g per signal pin 150 g per Power Contact (Minimum Values) 6.2.3 Durability w/o Environment (EIA-364-09) Mate connectors 250 cycles at a maximum rate of 10 cycles per minute. Maximum Change: Signal Contact: 15 milliohm Power Contact: 0.75milliohm 6.2.4 Normal Force Apply perpendicular force to terminal at rate of 25 +/- 6 mm per minute 90 g per signal pin 300 g per Power Contact (Nominal Values) 6.2.5 Maximum connector (with pegs) mounting force into PCB Mounting connectors at a rate of 25 +/- 6 mm per minute. Both pegs should be inserted into PCB at the same time with even force instead of slanted or one-sided insertion 6.2.6 Vibration (EIA-364-28) Mate connectors and vibrate per EIA-364-28, test condition VII-D, 15 minutes each axis LPH Interconnect System Web Page REVISION: H ECM INFORMATION: EC No: 624413 DATE: 2019/09/25 DOCUMENT NUMBER: PS-45984-001 Interference peg: 11000 g. (Maximum Values) Maximum Change: Signal Contact: 15 milliohm Power Contact: 0.75 milliohm TABLE OF CONTENTS TITLE: SHEET No. PRODUCT SPECIFICATION FOR LOW PROFILE 10 of 17 HYBRID (LPH)® TM INTERCONNECT SYSTEMS DOC DOC CREATEDHYBRID / REVISED BY: BY: APPROVED BY: LOWPART: PROFILE (LPH)CHECKED INTERCONNECT TYPE: SYSTEMS MBELLE PS 001 MBN02 HTHYAGARAJ Molex is a registered trademark of Molex, LLC in the Unites States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION 6.3 ENVIRONMENTAL PERFORMANCE ITEM DESCRIPTION TEST CONDITION REQUIREMENT 6.3.1 Thermal Shock (EIA-364-32) Mate connectors, expose to 5 cycles from –55 °C to 85 °C per EIA-364-TP-32 Maximum Change: Signal Contact: 15 milliohm Power Contact: 0.75 milliohm 6.3.2 Temperature Life (EIA-364-17) Mate Connectors, expose to 120 hours at 105 °C Per EIA-364-17 Method A Maximum Change: Signal Contact: 15 milliohm Power contact: 0.75 milliohm 6.3.3 Cyclic temperature & humidity (EIA-364-31) Mate connectors: expose to 24 cycles from 25 °C / 80% RH to 65 °C / 50% RH Maximum Change: Signal Contact: 15 milliohm Power Contact: 0.75 milliohm 6.3.4 Mixed flowing Gas 168 hours unmated, 72 hours mated, per EIA-364-65 Class IIA Maximum Change: Signal Contact: 15 milliohm Power Contact: 0.75 milliohm 6.3.5 Solder resistance (Wave) Submerge terminal tails in solder. Visual: No damage to insulator Dwell: 2.0 +/- 0.5 sec. material Solder Temp: 260o C Max. LPH Interconnect System Web Page REVISION: H ECM INFORMATION: EC No: 624413 DATE: 2019/09/25 DOCUMENT NUMBER: PS-45984-001 TABLE OF CONTENTS TITLE: SHEET No. PRODUCT SPECIFICATION FOR LOW PROFILE 11 of 17 HYBRID (LPH)® TM INTERCONNECT SYSTEMS DOC DOC CREATEDHYBRID / REVISED BY: BY: APPROVED BY: LOWPART: PROFILE (LPH)CHECKED INTERCONNECT TYPE: SYSTEMS MBELLE PS 001 MBN02 HTHYAGARAJ Molex is a registered trademark of Molex, LLC in the Unites States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION 7.0 TEST SEQUENCE GROUPS Reliability Test Sequences per EIA-364-1000 Group II Group III Group IV Group V Group VII Initial Low Level Contact Resistance (LLCR) Initial Low Level Contact Resistance (LLCR) Initial Low Level Contact Resistance (LLCR) Initial Low Level Contact Resistance (LLCR) Initial Low Level Contact Resistance (LLCR) Dielectric Withstanding Voltage Durability Durability Durability Durability Durability LLCR Thermal Shock Temperature Life 72 hours @ 105° C Temperature Life 72 hours @ 105° C Temperature Life 72 hours @ 105° C Dielectric Withstanding Voltage Temperature Life 120 hours @ 105° C LLCR LLCR LLCR LLCR Durability LLCR Cyclic Temperature and Humidity Vibration Mixed Flowing Gases 7 Days Unmated 3 Days Mated Thermal Cycling 500 Cycles Dielectric Withstanding Voltage Reseating LLCR LLCR LLCR LLCR LLCR Reseating Thermal Disturbance Reseating LLCR LLCR LLCR Group I Durability Reseating LLCR LPH Interconnect System Web Page REVISION: H ECM INFORMATION: EC No: 624413 DATE: 2019/09/25 DOCUMENT NUMBER: PS-45984-001 TABLE OF CONTENTS TITLE: SHEET No. PRODUCT SPECIFICATION FOR LOW PROFILE 12 of 17 HYBRID (LPH)® TM INTERCONNECT SYSTEMS DOC DOC CREATEDHYBRID / REVISED BY: BY: APPROVED BY: LOWPART: PROFILE (LPH)CHECKED INTERCONNECT TYPE: SYSTEMS MBELLE PS 001 MBN02 HTHYAGARAJ Molex is a registered trademark of Molex, LLC in the Unites States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION Sample Preparation | Voltage Drop Test Temperature Rise Test Mating Force, single Circuit Initial Current Profiling Voltage Drop Initial Steady State Current 96 hrs Individual Tests T-Rise Profiling Unmating Force, single Circuit Normal force Steady State Voltage Drop | Steady State Temperature Rise Maximum connector (with pegs) mounting force into PCB Current Cycling 240 cycles Final Steady State Current 96 hrs LPH Interconnect System Web Page REVISION: H ECM INFORMATION: EC No: 624413 DATE: 2019/09/25 DOCUMENT NUMBER: PS-45984-001 TABLE OF CONTENTS TITLE: SHEET No. PRODUCT SPECIFICATION FOR LOW PROFILE 13 of 17 HYBRID (LPH)® TM INTERCONNECT SYSTEMS DOC DOC CREATEDHYBRID / REVISED BY: BY: APPROVED BY: LOWPART: PROFILE (LPH)CHECKED INTERCONNECT TYPE: SYSTEMS MBELLE PS 001 MBN02 HTHYAGARAJ Molex is a registered trademark of Molex, LLC in the Unites States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION 8.0 MATING AND ALIGNMENT 8.1 Right Angle Receptacle to Edge Card Final position/fully mated condition (LPH Power & Signal): 1.Power Terminal has 2.84mm nominal wipe. 2.Signal Terminal has 2.84mm nominal wipe. 8.2 Right Angle Receptacle to Right Angle Plug Final position/fully mated condition (LPH Power & Signal): 1.Long Power Terminal has 3.21mm nominal wipe. 2.Short Power Terminal has 1.70mm nominal wipe. 3.Signal Terminal has 1.27mm nominal wipe. LPH Interconnect System Web Page REVISION: H ECM INFORMATION: EC No: 624413 DATE: 2019/09/25 DOCUMENT NUMBER: PS-45984-001 TABLE OF CONTENTS TITLE: SHEET No. PRODUCT SPECIFICATION FOR LOW PROFILE 14 of 17 HYBRID (LPH)® TM INTERCONNECT SYSTEMS DOC DOC CREATEDHYBRID / REVISED BY: BY: APPROVED BY: LOWPART: PROFILE (LPH)CHECKED INTERCONNECT TYPE: SYSTEMS MBELLE PS 001 MBN02 HTHYAGARAJ Molex is a registered trademark of Molex, LLC in the Unites States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION 8.3 Right-Angle Plug and Right-Angle Receptacle Fully Mated Condition At Fully Mated Condition CL OF BACK ROW OF CL OF BACK ROW OF RECEPTACLE POWER TERMINAL PLUG POWER TERMINAL LPH Interconnect System Web Page REVISION: H ECM INFORMATION: EC No: 624413 DATE: 2019/09/25 DOCUMENT NUMBER: PS-45984-001 TABLE OF CONTENTS TITLE: SHEET No. PRODUCT SPECIFICATION FOR LOW PROFILE 15 of 17 HYBRID (LPH)® TM INTERCONNECT SYSTEMS DOC DOC CREATEDHYBRID / REVISED BY: BY: APPROVED BY: LOWPART: PROFILE (LPH)CHECKED INTERCONNECT TYPE: SYSTEMS MBELLE PS 001 MBN02 HTHYAGARAJ Molex is a registered trademark of Molex, LLC in the Unites States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION 9.0 SOLDER INFORMATION Per SMES-152 and AS-40000-5013 *These specifications establish standard solderability test methods used to evaluate a products ability to accept molten solder. Solder Process Temperatures and Reflow Solder Profiles will vary based on application, equipment, solder paste, PCB thickness, etc. 9.1 SOLDER PROCESS TEMPERATURES * Wave Solder Temperature: 260°C Maximum Reflow Solder Temperature: 260°C Maximum 9.2 Molex Solderability Specification SMES-152 (Click Here) REFLOW SOLDERING PROFILE * Molex Connector Heat Resistance Specification AS-40000-5013 (Click Here) (This profile is per JEDEC J-STD-020D.1 and it is for guideline only; please see notes for additional information) LPH Interconnect System Web Page REVISION: H ECM INFORMATION: EC No: 624413 DATE: 2019/09/25 DOCUMENT NUMBER: PS-45984-001 TABLE OF CONTENTS TITLE: SHEET No. PRODUCT SPECIFICATION FOR LOW PROFILE 16 of 17 HYBRID (LPH)® TM INTERCONNECT SYSTEMS DOC DOC CREATEDHYBRID / REVISED BY: BY: APPROVED BY: LOWPART: PROFILE (LPH)CHECKED INTERCONNECT TYPE: SYSTEMS MBELLE PS 001 MBN02 HTHYAGARAJ Molex is a registered trademark of Molex, LLC in the Unites States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION Description Requirement Average Ramp Rate 3°C/sec Max Preheat Temperature 150°C Min to 200°C Max Preheat Time 60 to 180 sec Ramp to Peak 3°C/sec Max Time over Liquidus (217°C) 60 to 150 sec Peak Temperature 260 +0/-5°C Time within 5°C of Peak 20 to 40 sec Ramp - Cool Down 6°C/sec Max Time 25°C to Peak 8 min Max Notes: 1. Temperature indicated refers to the PCB surface temperature at solder tail area. 2. Connector can withstand up to 3 reflow cycles with a cool-down to room temperature in-between. 3. Actual reflow profile also depends on equipment, solder paste, PCB thickness, and other components on the board. Please consult your solder paste & reflow equipment manufacturer for their recommendations to adopt a suitable process. 4. For wave soldering, it is recommended to use interference peg design. (Diameter is 3.30mm) or use fixture to hold the part down during soldering. When mounting the connector into PCB by manual operation, it is required to press two side of the connector with even force on the connector to ensure the connector can be inserted into PCB smoothly. 10.0 PACKAGING Parts shall be packaging to protect the parts from damage during standard shipping, storage, and handling. Refer Molex.com specific part number webpage to get the exact packaging document for that item. LPH Interconnect System Web Page REVISION: H ECM INFORMATION: EC No: 624413 DATE: 2019/09/25 DOCUMENT NUMBER: PS-45984-001 TABLE OF CONTENTS TITLE: SHEET No. PRODUCT SPECIFICATION FOR LOW PROFILE 17 of 17 HYBRID (LPH)® TM INTERCONNECT SYSTEMS DOC DOC CREATEDHYBRID / REVISED BY: BY: APPROVED BY: LOWPART: PROFILE (LPH)CHECKED INTERCONNECT TYPE: SYSTEMS MBELLE PS 001 MBN02 HTHYAGARAJ Molex is a registered trademark of Molex, LLC in the Unites States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.