PRODUCT SPECIFICATION
EXTREME TEN60POWERTM
Board-To-Board
CONNECTOR SYSTEM
RA Receptacle Assembly with Top
Guide
RA Receptacle Assembly with
Side Guide
Series: 46436
Series: 46436
RA Receptacle Assembly with
Screw down Guide
RA Plug Assembly with Top Guide
Series: 46436
Series: 46437
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PRODUCT SPECIFICATION
RA Plug Assembly with Side Guide
RA Plug Assembly with Screw
down Guide
Series: 46437
Series: 46437
Vertical Receptacle Assembly with
Top Guide
Vertical Receptacle Assembly with
Side Guide
Series: 46562
Series: 46562
Vertical Receptacle Assembly
Vertical Plug Assembly
Series: 76541
Series: 76546
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PRODUCT SPECIFICATION
RA Power Plug Modules (1-10 ckt)
RA Power Receptacle Modules (1-10 ckt)
Vertical Power Receptacle Modules (1-10 ckt)
Note: All power modules are available at 5.5 mm pitch for DC (low voltage) applications and 7.5 mm pitch AC (high
voltage) application. See pg. 16 for recommended PCB lay-outs.
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PRODUCT SPECIFICATION
RA Signal Plug Modules (6-36 ckt) or RA HDS Plug Module (10-60 ckt)
RA Signal Receptacle Modules (6-36 ckt) or RA HDS Receptacle Module (10-40 ckt)
Vertical Signal Recept. Modules (6-36 ckt) or Vertical HDS Recept. Module (10-60 ckt)
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Table of Contents
ITEMS
PAGE
1.0
SCOPE ....................................................................................................................... 6
2.0
PRODUCT DESCRIPTION ........................................................................................ 6
2.1 PRODUCT NAME AND SERIES NUMBER (S) ...................................... 6
2.2 DIMENSIONS, MATERIALS, PLATINGS ................................................ 6
2.3 ENVIRONMENTAL CONFORMANCE .................................................... 6
2.4 SAFETY AGENCY LISTINGS ................................................................. 7
3.0
APPLICABLE DOCUMENTS AND SPECIFICATION ................................................ 8
3.1 MOLEX DOCUMENTS ............................................................................ 8
3.2 INDUSTRY DOCUMENTS ...................................................................... 8
4.0
ELECTRICAL PERFORMANCE RATINGS ............................................................... 8
4.1 VOLTAGE ................................................................................................ 8
4.2 CURRENT RATING (MAXIMUM AMPERES) ......................................... 9
4.3 TEMPERATURE .................................................................................... 12
4.4 DURABILITY .......................................................................................... 12
5.0
QUALIFICATION ...................................................................................................... 12
6.0
PERFORMANCE ...................................................................................................... 13
6.1 ELECTRICAL PERFORMANCE ............................................................ 13
6.2 MECHANICAL PERFORMANCE .......................................................... 14
6.3 ENVIRONMENTAL PERFORMANCE ................................................... 16
7.0
PRINTED CIRCUIT BOARD SPECIFICATION ........................................................ 17
7.1 PCB THROUGH HOLE SPEC ............................................................... 17
7.2 TYPICAL PCB PADS LAY-OUT AND SIGNAL HOLES LAY-OUT ....... 18
7.3 WIPE LENGTH DETAILS ...................................................................... 20
7.4 TYPICAL MATING SEQUENCE: POWER & 3 ROW SIGNAL ............. 23
7.5 TYPICAL MATING SEQUENCE: POWER & 5 ROW SIGNAL .............. 24
8.0
TEST SEQUENCE GROUPS ................................................................................... 26
9.0
SOLDER INFORMATION ......................................................................................... 28
9.1 SOLDER PROCESS TEMPERATURES ............................................... 28
9.2 SOLDERING PROFILE ......................................................................... 28
10.0 PACKAGING ............................................................................................................ 29
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PRODUCT SPECIFICATION
1.0
SCOPE
The specification covers the performance requirements and test methods of Ten60Power and signal
modular board to board interconnect systems.
2.0
PRODUCT DESCRIPTION
2.1
PRODUCT NAME AND SERIES NUMBER (S)
This specification covers following board to board configuration
Right Angle (RA) Plug assembly mated to RA Receptacle assembly (Coplanar configuration)
46436-XXXX
RA Receptacle Side Assembly
46437-XXXX
RA Plug Side Assembly
Right Angle (RA) Plug assembly mated to Vertical Receptacle assembly (Backplane configuration)
46562-XXXX
Vertical Receptacle Side Assembly
46437-XXXX
RA Plug Side Assembly
Vertical Plug Assy mated to Vertical Receptacle Assy (Mezzanine configuration)
2.2
76541-XXXX
Vertical Receptacle Side Assembly
76546-XXXX
Vertical Plug Side Assembly
DIMENSIONS, MATERIALS, PLATINGS
Dimensions: See individual sales drawings.
Plating: Gold on mating surfaces and tin on PC tail with nickel under-plating overall.
2.3
ENVIRONMENTAL CONFORMANCE
To find product compliance information:
a. Go to molex.com
b. Enter the part number in the search field.
c. At the bottom of the page go to “Environmental” to see compliance status.
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PRODUCT SPECIFICATION
2.4
SAFETY AGENCY LISTINGS
2.4.1
File Number*: LR-19980_A_000 Class 6233-81
CSA approval meets following standards/test procedures:
a) CSA std. C22.2 No. 182.3-M1987
b) UL-1977
* - “C” and “US” mark adjacent to CSA signifies that the product has been evaluated to the
applicable CSA and ANSI/UL standards, for use in Canada and US respectively.
CSA
NON-current interruption
2.5 Amps @ 250V for Legacy Signal ckt
4.5 Amps @ 75V for HDS Signal ckt
60 Amps @ 600V for power ckt
CSA
Current interruption
2.5 Amp at 28V for Legacy Signal ckt
4.5 Amps @ 28V for HDS Signal ckt
50 Amps at 60V for power ckt
UL – IEC61984 EU- Certificate Number: UL-EU-01060-A1
2.4.2
UL-CB - Report – E29179 -D1-CB
IEC 61984-1
Non-current interruption
7.5 mm Pitch 600 volts AC/DC @60 amps
5.5 mm Pitch 250 volts DC @ 60 amps
Signal
Signal Legacy (3 row) 120 Volts AC/DC @ 60 amps
Signal HDS (5 row) 120 Volts AC/DC @ 1.0 amps
IEC 61984 Certification: Tested to and found in compliance with IEC 61984. Certificate
available from Molex upon request. Contact Molex safety agency team for questions
regarding certification on specific part numbers.
2.4.3
UL File Number: E29179
UL
NON-current interruption
2.5 Amps @ 250V for Legacy signal ckt
4.5 Amps @ 120V for HDS signal ckt
80 Amps @ 600V for power ckt
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3.0
APPLICABLE DOCUMENTS AND SPECIFICATION
3.1
MOLEX DOCUMENTS
Extreme Ten60Power Connector System Application summary AS-4636-100-001
Molex Solderability Specification SMES-152
Molex Heat Resistance Specification AS-40000-5013
Molex Moisture Technical Advisory AS-45499-001
Molex Package Handling Specification 454990100-PK
ATS – Application Tooling Specification*
*Application Tooling Specification for terminals is not provided in this document. ATS for terminals can be
available from respective terminal part number page in Molex.com
3.2
INDUSTRY DOCUMENTS
EIA-364-1000
UL-60950-1
CSA STD. C22.2 NO. 182.3-M1987
IEC 61984
UL-1977
4.0
ELECTRICAL PERFORMANCE RATINGS
4.1
VOLTAGE
Legacy Signal Module:
HDS Signal Module:
Power Module:
250 Volts
120 Volts
250 or 600 Volts (Ref. to pads layout in section 7.2)
Connector Rating per UL-1977
Connector voltage rating meets the connector approval level defined by UL 1977, Sect. 11 for
spacing per table 11.1. Example: 1.2 mm for ≤ 250 volt; 3.2 mm for ≥ 250 volt.
Exception taken for spacing less than those specified are permitted, if the device complies with the
requirements in the dielectric voltage withstanding test per Sect. 17
Application Voltage Guideline
For application voltage requirements please refer to UL-60950 or other applicable standards, the
creepage & clearance also needs to be determined based upon pads/traces on the PCB.
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PRODUCT SPECIFICATION
4.2
CURRENT RATING (MAXIMUM AMPERES)
Signal Contact:
HDS Signal Contact:
Power Contact:
2.5 Amps
4.5 Amps
1. Tested with PCB Copper Planes: See charts on page 10.
No. of Power Circuits
Current (Amps)
1-Ckt
94Amps
2-Ckt
85Amps
4-Ckt
76Amps
8-Ckt
65Amps
** Tested in accordance with EIA-364-70. Refer section 6.1.5
The above current ratings are based on testing connectors are mounted to a 10-Layer PCB with
2Oz per layer copper planes. Rating shown represents maximum current carrying capacity at
30oC temperature rise over ambient temperature.
2. Tested with Copper Coupons: See charts on page 11.
No. of Power Contacts
Current (Amps)
1-Ckt
62Amps
2-Ckt
59Amps
4-Ckt
57Amps
8-Ckt
53Amps
**Tested in accordance with EIA-364-70. Refer section 6.1.5
The above current ratings are based on testing connectors are mounted on a copper coupon.
Rating shown represents maximum current carrying capacity at 30oC temperature rise over
ambient temperature.
“Current rating is application dependent and should be used as a guideline. Appropriate rating is
required per ckt size, ambient conditions, copper trace size on the PCB, gross heating from
adjacent modules/components and other factors that influence connector performance”
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PRODUCT SPECIFICATION
TESTED WITH COPPER PLANES (10 Layers, 2Oz per each Layer)
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PRODUCT SPECIFICATION
Temperature Rise vs. Current per EIA-364-70
TESTED WITH COPPER COUPONS
TEMPERATURE RISE Vs. CURRENT INPUT PER STANDARD EIA-364-70
35.0
Temperature (C)
40.0
8-ckt set up
4-ckt set up
2-ckt set up
1-ckt set-up
30.0
25.0
20.0
15.0
10.0
Current (Amps)
5.0
30.0
40.0
50.0
V-drop
(max) vs. 45.0
Current per EIA-364-70
35.0
55.0
60.0
VOLTAGE DROP (MAX.) Vs. CURRENT INPUT PER STANDARD EIA-364-70
0.0180
Voltage (V)
0.0200
0.0160
0.0140
0.0120
0.0100
0.0080
0.0060
0.0040
0.0020
Current (Amps)
0.0000
30.0
35.0
40.0
45.0
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50.0
55.0
60.0
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PRODUCT SPECIFICATION
4.3
TEMPERATURE
Operating temperature (including T-rise from applied current) is -40º C to +105º C.
Temperature life tested per EIA 364-17 Method A for 240 hrs@105º per table 8 to meet field
temperature of 65º C for 10 years life. See page 22 for detail test sequence of EIA-364-1000,
Group I.
4.4
DURABILITY
Plating Type
Number of Cycles
Gold Plated
200
As tested in accordance with EIA-364-1000 test method C section 7 (see sec 6.2.3 of this specification).
Durability per EIA-364-09
5.0
QUALIFICATION
Laboratory condition, sample selection and test sequences are in accordance with EIA-364-1000.
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PRODUCT SPECIFICATION
6.0
PERFORMANCE
6.1
ELECTRICAL PERFORMANCE
ITEM
DESCRIPTION
TEST CONDITION
REQUIREMENT
6.1.1
Initial Contact
Resistance
(Low Level)
Per EIA-364-23
Signal Contact: 30 m
Power Contact: 0.3 m
6.1.2
Voltage Drop
(@ Rated Current)
Mate connectors; apply the rated current.
Per EIA-364-70
Typical Voltage Drop:
Power Contact: see chart,
Page 10 & 11
6.1.3
Insulation
Resistance
Apply 500 VDC between adjacent
terminals or ground.
Per EIA-364-21
5,000 M
minimum
6.1.4
Dielectric
Withstanding
Voltage
Apply 1500 VDC for 1 minute between
adjacent terminals or ground.
Per EIA-364-20
No breakdown
6.1.5
Temperature
Rise
Mate connectors Measure T-Rise
@ Rated Current After 96 Hours.
Per EIA-364-70
30°C T-Rise
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6.2
ITEM
MECHANICAL PERFORMANCE
DESCRIPTION
TEST CONDITION
REQUIREMENT
Legacy Signal
75 g/ckt Max
6.2.1
Power
Vert Recept to
R/A Plug
756 g/ckt Max
Mate connectors at a rate of
25.4±6 mm per minute
Per EIA-364-37
Mating Force,
Single Circuit**
Power
R/A Recept to
R/A Plug
443 g/ckt Max
HDS*
55 g/ckt Max
Legacy Signal
23 g/ckt Min
6.2.2
Unmating Force,
Single Circuit**
Power
Vert Receipt to
R/A Plug
316 g/ckt Min
Unmate connectors at a rate of
25.4±6 mm per minute
Per EIA-364-37
Power
R/A Recept to
R/A Plug
253 g/ckt Min
HDS*
25 g Min per Contact
6.2.3
Durability w/o
Environment
Maximum Change:
Signal Contact: 10 m
Power Contact: 0.30 m
Mate connectors 20 cycles at a
max rate of 10 cycles per minute
Per EIA-364-09
R/A Power
1336 g Min
6.2.4
Axial pullout force on the terminal
in the housing at a rate of 25.4±6 mm
per minute Per EIA-364-29
Contact
Retention
Vert Power
754 g Min
Vert HDS Signals
544 g Min per coupon
R/A HDS Signals
275 g Min per coupon
* HDS: High Density Signal (5 Row Signal Design)
** Mate/Unmate Data is for 1st Cycle
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6.2
ITEM
MECHANICAL PERFORMANCE CONTINUED
DESCRIPTION
TEST CONDITION
REQUIREMENT
MIN: 1.10 lbs.
(0.5 Kg/pin)
(Legacy Signal Module)
6.2.5
MIN: 1.00 lbs.
(0.45 Kg/pin)
(HDS Module)
Min Extraction
force for
Terminals with
Compliant Pins
Pull-out contacts at a rate of
25.4±6 mm per minute
MIN: 2.37 lbs./pin
(1.08 Kg/pin)
Vertical Power Receptacle
MIN: 2.4 lbs./pin
(1.09 Kg/pin)
R/A Power Plug
6.2.6
Vibration
(EIA-364-1000)
Mate connectors and vibrate per
EIA-364-28 test condition VII-D
15 minutes each axis.
Maximum Change:
Signal Contact: 10 m
Power Contact: 0.50 m
6.2.7
Mechanical
Shock
(EIA-364-1000)
Mate connectors and shock at 50 g with ½
sine wave (11 milliseconds) shocks in the
3 axes (18 shocks total) Per EIA-364-27
Maximum Change:
Signal Contact: 10 m
Power Contact: 0.50 m
MAX: 12.54 lbs/pin
(5.7 Kg/ckt)
(Legacy Signal Module)
6.2.8
Max Insertion
force into PCB for
Terminals with
Compliant Pins
Insert contact at a rate of
25.4±6 mm per minute
MAX: 10.02 lbs/pin
(4.54 kg/ckt)
(HDS module)
MAX: 18.5 lbs/pin
(8.41 kg/pin)
(Vertical Pwr Receptacle)
MAX: 17.6 lbs/pin
(7.98 kg/pin)
(R/A Pwr Plug)
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6.3
ENVIRONMENTAL PERFORMANCE
ITEM
DESCRIPTION
TEST CONDITION
REQUIREMENT
6.3.1
Thermal
Shock
(EIA-364-1000)
Mate connectors, expose to 10 cycles
from -55°C to 85°C Per EIA-364-32
Maximum Change:
Signal Contact: 10 m
Power Contact: 0.50 m
6.3.2
Temperature
Life
(EIA-364-1000)
Mate Connectors, expose to 240 hours at
105°C Per EIA-364-17
Maximum Change:
Signal Contact: 10 m
Power Contact: 0.50 m
6.3.3
Cyclic Temperature
and Humidity
(EIA-364-1000)
Mate connectors: expose to 24 cycles
from 25 °C / 80% RH to 65 °C / 50% RH
Per EIA-364-31
Maximum Change:
Signal Contact: 10 m
Power Contact: 0.50 m
6.3.4
Dust
(EIA-364-1000)
Un-mated 1-hour duration
25°C/50% RH dust mass of 9 g/ft3 at rate
of 300 m/min. Per EIA-364-91
Maximum Change:
Signal Contact: 10 m
Power Contact: 0.50 m
6.3.5
Mixed Flowing Gas
(EIA-364-1000)
168 hours un-mated,168 hours mated,
Per EIA-364-65Class II-A
Maximum Change:
Signal Contact: 10 m
Power Contact: 0.50 m
6.3.6
Solderability
Dip Test
Molex test method:
Solder area shell have Min of
95% solder coverage
6.3.7
Compliant pin
retention force from
PCB board after
soldering process
Per EIA-364-61, Test procedure 4 for
compliant pin retention force
22.5 lbs. (10.2 Kg)
Per Power contact extraction
force from PCB
6.3.8
Resistance to
soldering heat from
rework
Per EIA-364-61, Test procedure 2
(Test Condition II)
No dimensions change
No physical damage
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PRODUCT SPECIFICATION
7.0
PRINTED CIRCUIT BOARD SPECIFICATION
7.1
PCB THROUGH HOLE SPEC.
Profile for 1.02 mm (finish) holes:
Profile for 0.70mm (finish) holes – Signal segment:
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Notes:
1. The finished hole size is the critical feature for proper performance of the compliant pin terminal.
The reference drill sizes listed are recommended by Molex to achieve the finished PCB hole size.
2. Depending on the specific manufacturer’s plating process a different drill size can be used to achieve
the required finished PCB hole size.
7.2
TYPICAL PCB PADS LAY-OUT AND SIGNAL HOLES LAY-OUT
Pads lay-out for power modules
with 7.5 mm pitch for high voltage
Pads lay-out for power modules
with 5.5 mm pitch for low voltage
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PRODUCT SPECIFICATION
Typical Hole Lay-out For 5 row Signal/ HDS modules (0.70mm dia holes)
PCB lay-out for HDS modules
Vertical conf. only
PCB lay-out for HDS modules
R/A conf. only
Typical Signal Hole Lay-out for 2.54mmX2.54mm Signal modules (1.02mm dia holes)
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EC No: 660832
DATE: 2021/06/02
DOCUMENT NUMBER:
PS-46436-100
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PRODUCT SPECIFICATION
7.3
WIPE LENGTH DETAILS
RIGHT ANGLE TO RIGHT ANGLE ORIENTATION
Power
Blades
Long Blade (12mm)
Standard Blade (10mm)
Short Blade (8mm)
7.9
5.9
3.9
Minimum Wipe
(Statistical)(mm)*
7.5
5.5
3.5
HDS
Signal
Blades
Long Blade
Standard Blade
Short Blade
4.3
3.3
2.3
3.9
2.9
1.9
3-Row
Signal
Long Blade
Short Blade
3.8
2.5
3.5
2.2
Length of blade
Nominal Wipe(mm)
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PRODUCT SPECIFICATION
RIGHT ANGLE TO VERTICAL ORIENTATION
Power
Blades
Long Blade (12mm)
Standard Blade (10mm)
Short Blade (8mm)
6.8
4.8
2.8
Minimum Wipe
(Statistical)(mm)*
6.4
4.4
2.4
HDS
Signal
Blades
Long Blade
Standard Blade
Short Blade
4.2
3.2
2.2
3.9
2.9
1.9
3-Row
Signal
Long Blade
Short Blade
3.7
2.4
3.4
2.1
Length of blade
Nominal Wipe(mm)
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PRODUCT SPECIFICATION
VERTICAL TO VERTICAL (MEZZANINE CONFIGURATION)
Power
Blades
Long Blade (11.25mm)
Short Blade (9.25mm)
6.8
4.8
Minimum Wipe
(Statistical)(mm)*
6.4
4.4
Legacy
Signal
Long Blade
Short Blade
3.8
2.8
3.4
2.4
Length of blade
Nominal Wipe(mm)
*Minimum wipe is determined using RSS tolerance analysis for the connector only assuming at mated
condition as per reference mating length provided in the illustration above. Mated profile tolerances and
system tolerances are not considered into the analysis
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DATE: 2021/06/02
DOCUMENT NUMBER:
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PRODUCT SPECIFICATION
7.4
TYPICAL MATING SEQUENCE: POWER & 3 ROW SIGNAL (RA-RA & RA-VERTICAL)
SEQUENCE
NO.
SEQUENCE IMAGE
DESCRIPTION
Long/Ground power blade(s)
(typically used for FMLB)
mates first.
1
1st
Short power blade(s)
mates second.
2
2nd
3. After short power blade(s) the
long signal pins (typically the top
row) mates third.
3&4
4. After long signal pins, the rest of
other signal pins will mate.
3rd
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DOCUMENT NUMBER:
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PRODUCT SPECIFICATION
7.5 TYPICAL MATING SEQUENCE: POWER & 5 ROW SIGNAL (RA-RA & RA-VERTICAL)
SEQUENCE
NO.
SEQUENCE IMAGE
DESCRIPTION
Long/Ground power blade(s)
(typically used for FMLB)
mates first.
1st
1
2nd
Standard power blade(s)
mates second.
2
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Long/Ground signal blade(s)
(FMLB)
mates third.
3rd
3
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PRODUCT SPECIFICATION
4th
Short power blade(s)
mates fourth.
4
6th
Standard signal blade(s)
&
short signal blade(s)
mates fifth and sixth
respectively.
5th
5
(Shown mating sequence in 7.4 & 7.5 is typical, custom configurations available on request)
(Note – Power: Long Blades-12mm, Standard Blades-10mm & Short Blades-8mm.
(Extended length on the mating side).
5 Pin Signal: Long Blades-0.91mm, Standard Baldes-1.92mm & short Blades-2.92mm.
(Measured from tip of signal module housing to tip of the blade as per sales drawing).
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ECM INFORMATION:
EC No: 660832
DATE: 2021/06/02
DOCUMENT NUMBER:
PS-46436-100
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PRODUCT SPECIFICATION
8.0
TEST SEQUENCE GROUPS
Reliability Test Sequences per EIA-364-1000
Group I
Group II
Group III
Group IV
Group V
|
Initial Contact
Resistance
EIA-364-23
|
Durability
20 cycles
EIA-364-09
|
Contact
Resistance
|
Temperature Life
105C, 240 hours
10 Yrs @ 65C
EIA-364-17
|
|
Initial Contact
Resistance
EIA-364-23
|
Durability
20 cycles
EIA-364-09
|
Contact
Resistance
|
Thermal Shock
10 cycles
-55C and +85C
EIA-364-32
|
|
Initial Contact
Resistance
EIA-364-23
|
Durability
20 cycles
EIA-364-09
|
Contact
Resistance
|
Temperature Life
Preconditioning
10 Yrs @ 65C
EIA-364-17
|
|
Initial Contact
Resistance
EIA-364-23
|
Durability
20 cycles
EIA-364-09
|
Contact
Resistance
|
Temperature Life
Preconditioning
10 Yrs @ 65C
EIA-364-17
|
|
Initial Contact
Resistance
EIA-364-23
|
Durability
20 cycles
EIA-364-09
|
Contact
Resistance
|
Temperature Life
Preconditioning
10 Yrs @ 65C
EIA-364-17
|
Contact
Resistance
Contact
Resistance
Contact
Resistance
Contact
Resistance
Contact
Resistance
|
|
Random Vibration
EIA-364-28
Condition VIID
Thermal Cycling
EIA-364-1000
|
|
Flowing Mixed
Gas
7 days unmated
EIA-364-65
|
|
|
|
Cyclic
Temperature
and Humidity
EIA-364-31
|
Contact
Resistance
Contact
Resistance
Contact
Resistance
Contact
Resistance
Contact
Resistance
Reseating
3 cycles
EIA-364-1000
|
|
Flowing Mixed
Gas
7 days mated
EIA-364-65
|
Contact
Resistance
|
Thermal
Disturbance
EIA-364-1000
|
Contact
Resistance
|
Reseating
3 cycles
EIA-364-1000
|
Contact
Resistance
Reseating
3 cycles
EIA-364-1000
|
Contact
Resistance
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DATE: 2021/06/02
DOCUMENT NUMBER:
PS-46436-100
TEMPLATE FILENAME: 1703070003 REV A
Group VI
Initial Contact
Resistance
EIA-364-23
Durability
20 cycles
EIA-364-09
Contact
Resistance
Dust
EIA-364-91
Benign
Composition
Thermal
Disturbance
EIA-364-1000
Contact
Resistance
|
Reseating
3 cycles
EIA-364-1000
|
Reseating
3 cycles
EIA-364-1000
Contact
Resistance
|
Contact
Resistance
TABLE OF CONTENTS
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PRODUCT SPECIFICATION
Voltage Drop
Test
|
Individual Tests
Temperature
Rise Test
Connector Mate / Un-mate
Force
Voltage Drop
|
Contact Retention
T-Rise Profiling
Steady State
Voltage Drop
Max Insertion force into PCB
for terminals with Compliant
Pins
Steady State
Temperature
Rise
Min Extraction force for
terminals with Compliant Pins
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ECM INFORMATION:
EC No: 660832
DATE: 2021/06/02
DOCUMENT NUMBER:
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PRODUCT SPECIFICATION
9.0
SOLDER INFORMATION
Per SMES-152 and AS-40000-5013
*These specifications establish standard solderability test methods used to evaluate a products ability to
accept molten solder. Solder Process Temperatures and Reflow Solder Profiles will vary based on
application, equipment, solder paste, PCB thickness, etc.
9.1
SOLDER PROCESS TEMPERATURES *
Molex Solderability Specification
SMES-152
Reflow Solder Temperature: 260°C Maximum
9.2
(Click Here)
SOLDERING PROFILE
(This profile is per JEDEC J-STD-020D.1 and it is
for guideline only; please see notes for additional
information)
Molex Connector Heat Resistance
Specification AS-40000-5013
(Click Here)
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ECM INFORMATION:
EC No: 660832
DATE: 2021/06/02
DOCUMENT NUMBER:
PS-46436-100
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PRODUCT SPECIFICATION
Description
Requirement
Average Ramp Rate
3°C/sec Max
Preheat Temperature
150°C Min to 200°C Max
Preheat Time
60 to 180 sec
Ramp to Peak
3°C/sec Max
Time over Liquids (217°C)
60 to 150 sec
Peak Temperature
260 +0/-5°C
Time within 5°C of Peak
20 to 40 sec
Ramp - Cool Down
6°C/sec Max
Time 25°C to Peak
8 min Max
Notes:
1. Temperature indicated refers to the PCB surface temperature at solder tail area.
2. Connector can withstand up to 3 reflow cycles with a cool-down to room temperature in-between.
3. Actual reflow profile also depends on equipment, solder paste, PCB thickness, and other components
on the board. Please consult your solder paste & reflow equipment manufacturer for their
recommendations to adopt a suitable process.
10.0
PACKAGING
Parts shall be packaging to protect the parts from damage during standard shipping, storage, and handling.
Refer Molex.com specific part number webpage to get the exact packaging document for that item.
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DATE: 2021/06/02
DOCUMENT NUMBER:
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