PRODUCT SPECIFICATION
TITLE
SERIAL ATA BACKPLANE CONNECTOR / 1.27mm PITCH
1.0 SCOPE
This Product Specification covers the mechanical, electrical and environmental performances
requirements and test methods for Serial-ATA connector series products.
2.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS
The following documents form a part of this specification to the extent specified herewith. In
the event of conflict between the requirements of the specification and the product drawing, the
product drawing shall take precedence. In the event of conflict between the requirements of the
specification and the referenced documents, this specification shall take precedence.
2.1 EIA 364 Test Methods for Electronic and Electrical Component Parts
2.2 SERIAL ATA / High Speed Serialized at Attachment Specification
2.3 The product is compliant to RoHS directive 2002/95/EC and 2000/95/EC.
3.0 MATERIAL SPECIFICATIONS
3.1 DESIGN AND CONSTRUCTION
Connector shall be of the design, construction and physical dimensions specified on the
applicable sales drawing.
3.2 MATERIALS
Contacts:
Refer to respective Molex sales & engineering drawings
Housing:
Refer to respective Molex sales & engineering drawings
Plating: Refer to respective Molex sales & engineering drawings
4.0 PERFORMANCE AND TEST DESCRIPTION
4.1 PERFORMANCE REQUIREMENT:
Connector shall be designed to meet the electrical, mechanical and environmental performances
requirements specified in 5.0
4.2 VOLTAGE:
15V DC
4.3 CURRENT:
1.5A DC @25˚C
4.4 TEMPERATURE
Operating Temperature Range:
-40˚C to +85˚C (Without loss function)
Storage Temperature Range:
-40˚C to +100˚C (Without loss function)
4.5 SAMPLE SELECTION
Samples shall be prepared in accordance with applicable manufacturers’ instructions and shall be
selected at random from current production. Each test group shall provide 100 data points for a good
statistical representation of the test result. For a connector with greater than 20 pins, a test group
shall consist of a minimum of five connector pairs. From these connector pairs, a minimum of 20
contact pairs per mated connector shall be selected and identified. For connectors with less than 20
pins, choose the number of connectors sufficient to provide 100 data points.
REVISION:
H
ECR/ECN INFORMATION:
EC No:
SH2016-0297
DATE:
2016/04/28
DOCUMENT NUMBER:
PS-67492-001
TITLE:
SHEET No.
SERIAL ATA BACKPLANE CONNECTOR
1.27mm PITCH
1 of 7
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
Dixon Li
Anson Yin
Anson Yin
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1). DOC
PRODUCT SPECIFICATION
5.0 TEST REQUIREMENTS AND PROCEDURES.
5.1 ELECTRICAL REQUIREMENTS
DESCRIPTION
5.1.1
Insulation
Resistance
5.1.2
Dielectric
Withstanding
Voltage
5.1.3
Contact
Resistance
(LLCR)
5.1.4
Mated connector
impedance
(Signal Port)
TEST CONDITION
REQUIREMENT
EIA 364-21
After 500 VDC for 1 minute, measure the
insulation resistance between the adjacent
contacts of mated and unmated connector
assemblies.
1000 Mega ohms MINIMUM
EIA 364-20 Method B
Test between adjacent contacts of mated
and unmated connector assemblies.
The dielectric shall withstand
500 VAC for 1 minute sea level
EIA 364-23
Subject mated contacts assembled in
housing to 20 mV maximum open circuit at
100 mA maximum.
1). Set the Time Domain Reflectometer
(TDR) pulsers in differential mode with a
positive going (V+) and a negative going
pulse (V-). Define a reflected differential
trace: Vdiff = V+ - V2). With the TDR connected to the risetime
reference trace, verify an input risetime
of 70 ps (measured 20% - 80% Vp).
Filting may be used to slow the system
down (see NOTE 2)
3). Connect the TDR to the sample
measurement traces. Calibrate the
instrument and system (see NOTE 3).
4). Measure and record the maximum and
minimum values of the near end
connector impedance.
1. Initially 30 milliohms Max.
2. Resistance increased 15
milliohms Max. after stress
100 ohm +/- 15%
1. Mount the connector to a test PCB
2. Wire power pins P1, P2, P8 and P9 in
parallel for power
5.1.5
Contact current
rating
(Power segment)
1.5A per pin MINIMUM.
The temperature rise above
3. Wire ground pins P4, P5, P6, P10 and P12 ambient shall not exceed 30 °C
in parallel for return
at any point in the connector
4. Supply 6A total DC current to the power
when contact positions are
pins in parallel, returning from the parallel
powered. The ambient
ground pins (P4, P5, P6, P10 and P12)
5. Record temperature rise when thermal condition is still air at 25 °C.
equilibrium is reached
REVISION:
H
ECR/ECN INFORMATION:
EC No:
SH2016-0297
DATE:
2016/04/28
DOCUMENT NUMBER:
PS-67492-001
TITLE:
SHEET No.
SERIAL ATA BACKPLANE CONNECTOR
1.27mm PITCH
2 of 7
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
Dixon Li
Anson Yin
Anson Yin
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1). DOC
PRODUCT SPECIFICATION
NOTES1. Time domain measurement equipment allows for delay adjustment of the pulses so launch
times can be synchronized. Frequency domain equipment will require the use of phase matched
fixturing .The fixturing skew should be verified to be
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