0512966033

0512966033

  • 厂商:

    MOLEX10(莫仕)

  • 封装:

    SMD,P=0.5mm,卧贴

  • 描述:

    FPC/FFC连接器 间距:0.50mm 60Pin 翻盖式 卧贴

  • 数据手册
  • 价格&库存
0512966033 数据手册
10 9 7 8 5 6 4 (3.15) F (1.5) A C ±0.2 Z ±0.2 3 2 INSERTION DEPTH OF FPC F LENGTH TO CONTACT POINT HOUSING ACTUATOR TERMINAL SECT. X-X (B) 0.5 0.25 (PITCH) 0.18 (0.2) E ±0.05 ±0.2 0.2 ±0.15 0.4 ±0.15 SECT. X-X -29極以下- 29 Ckt. OR LESS SECT. X-X 7 7 (2.5) (3.8) 0.5 2.6 ±0.2 ±0.2 3.5 ±0.2 3.7 E 0.2 Z CL CONTACT POINT (BOTTOM SIDE) D -30極以上- 30 Ckt. OR MORE 1.3 ±0.2 4 7 E 1 ±0.2 外観形状 APPEARANCE FORM D (WHEN ACTUATOR IS OPENED) (4.3) (4) ±0.2 D C CL (3.7) X X 1.125 0.935 B 30.3 27.3 25.3 22.8 20.3 17.3 9.3 7.3 6.3 4.3 ±0.2 ±0.2 0.22 ±0.2 ±0.15 1.1 5 FITTING NAIL E 30.5 27.5 25.5 23.0 20.5 17.5 9.5 7.5 6.5 4.5 32.6 29.6 27.6 25.1 22.6 19.6 11.6 9.6 8.6 6.6 D C 29.5 26.5 24.5 22.0 19.5 16.5 8.5 6.5 5.5 3.5 B 33.7 30.7 28.7 26.2 23.7 20.7 12.7 10.7 9.7 7.7 51296-6033 51296-5433 51296-5033 51296-4533 51296-4033 51296-3433 51296-1833 51296-1433 51296-1233 51296-0833 A EMBOSSED TAPE 60 54 50 45 40 34 18 14 12 8 C B Ckt ORDER No. オーダー番号 CONNECTOR SERIES NO. : 51296-**22 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm 5:1 GENERAL TOLERANCES (UNLESS SPECIFIED) A DOCUMENT STATUS 10 FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 P1 RELEASE DATE 9 2020/02/17 ± 4 PLACES ± 3 PLACES ± 2 PLACES ± 1 PLACE ± 0 PLACES ± ° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 05:22:33 8 ANGULAR TOL 7 6 5 4 CURRENT REV DESC: REVISED EC NO: 632178 DRWN: SKITAZAWA CHK'D: HSHIMOYAMA APPR: SHOSHIKAWA INITIAL REVISION: DRWN: AISHII APPR: KMORIKAWA THIRD ANGLE PROJECTION 2020/02/14 2020/02/17 2020/02/17 2012/09/19 2013/03/15 DRAWING SERIES A3-SIZE 51296 3 0.5MM FPC CONN F/F E/O HOUSING ASSY PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER SD-51296-017 MATERIAL NUMBER PSD 001 CUSTOMER SEE CHART 2 GENERAL MARKET C SHEET NUMBER 1 OF 2 1 A 10 9 7 8 5 6 4 F 0.85 (1.4) 0.5 2.25 0.5(N-1) 0.85 0.5 (1.4) 0.5(N+1) 0.5(N-1) 0.5 0.35 0.5 0.3 (PITCH) 2 1 0.3±0.05 0.5(N+1) 2.25 3 (PITCH) 0.5 +0.04 -0.03 2-R0.3 ±0.2 仕上がり厚さ THICKNESS 0.5 6 F 0.5 0.5(N-1) 0.3 (PITCH) PLATING: TIN(0.5-1.2µm) NICKEL UNDER (1-5µm) めっき:錫めっき(0.5-1.2µm) 下地ニッケル (1-5µm) MATERIAL 1. : HOUSING LIQUID CRYSTAL POLYMER, BEIGE, GLASS FILLED, UL94V-0 : ポリアミド(PA)、黒、ガラス充填、UL94V-0 POLYAMIDE, BLACK, GLASS FILLED, UL94V-0 ACTUATOR : TERMINAL C 液晶ポリマー(LCP)、ベージュ、ガラス充填、UL94V-0 : FITTING NAIL PHOSPOR BRONZE PHOSPOR BRONZE  打抜き方向は導体側から補強板側を推奨致します。 ABOUT FPC: FITTING NAIL 錫メッキ (1.0μm以上) TIN PLATING (1.0 MICROMETER MINIMUM) 下地:ニッケルめっき(1.0μm以上) UNDER PLATING:NICKEL PLATING (1.0 MICROMETER MINIMUM) RECOMMENDED PUNCHER DIRECTION: C FROM CONDUCTOR SIDE TO STIFFENER FILM SIDE.  RECOMMENDED CONDUCTOR SPECIFICATION: THICKNESS OF SOFT COPPER FOIL: 35MICROMETER OR 50 MICROMETER FROM CONDUCTOR SIDE TO STIFFNER SIDE RECOMMENDED MATERIAL : STIFFENER FILM POLYIMIDE BONDING AGENT : THERMOSETTING AGENT PLEASE PUT APPROPRIATE AMOUNT OF ADHESIVE ON ADHEREND BECAUSE THERE IS A POSSIBILITY THAT THE EXTRA ADHESIVE   CAUSES THE DEFECT IN ELECTRICAL CONTINUITY. B APPLY FOR EVEN CIRCUIT. 5 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FITTING NAIL FOR PREVENTION OF PEELING OF PCB PATTERN. 6 R0.3は、FPC導体部にかからないこと。 7 極数によりハウジング形状が異なるので注意のこと。 8. テール及び金具の平坦度は、0.1ミリメートル以下とする。 TAIL AND FITTING NAIL COPLANARITY TO BE 0.1 MILLMETERS. 9. ELV及びRoHS適合品   ELV AND RoHS COMPLIANT DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 P1 RELEASE DATE 9 2020/02/17 SCALE mm 5:1 ANGULAR TOL ± 4 PLACES ± 3 PLACES ± 2 PLACES ± 1 PLACE ± 0 PLACES ± ° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 05:22:33 8 DIMENSION UNITS GENERAL TOLERANCES (UNLESS SPECIFIED) R0.3 MUST NOT BE OVERLAPPED TO PATTERN OF FPC. THE HOUSING SHAPE IS DIFFERENT ACCORDING TO THE CIRCUIT. 10 STRUCTURE OF FPC IN THE PACKAGE,ACTUATOR SHOULD BE CLOSED. 4 A FPC構成推奨仕様  導体部については軟銅箔35μmまたは50μmを推奨致します。   染み出しが無い様お願い致します。 錫銀ビスマスメッキ (1.0μm以上) TIN SILVER BISMUTH PLATING (1.0 MICROMETER MINIMUM) 下地:ニッケルめっき(1.0μm以上) UNDER PLATING:NICKEL PLATING (1.0 MICROMETER MINIMUM) 3.   補強フィルム材質は、ポリイミドを推奨致します。 FFC/FPCについて: ABOUT FFC/FPC:   尚、接着剤の接点部への付着は導通不良の原因になりますので、RECOMMENDED PUNCHER DIRECTION: TERMINAL B   抜き方向は、導体側から補強板側を推奨致します。   接着剤は熱硬化接着剤を推奨します。 PLATING 2. FPCについて: D 熱硬化接着剤 NOTES THERMOSETTING ADHESIVE カバ-レイ:ポリイミド(25µm) COVER FILM: POLYIMIDE(25µm) ) THERMOSETTING ADHESIVE 導体部:銅箔 (35µm) COPPER FOIL (35µm) SCREEN THICKNESS :100 MICROMETER SCREEN OPEN RATIO :100% BASE FILM: POLYIMIDE(25µm) 0.3 (THICKNESS:0.3 熱硬化接着剤 ) THERMOSETTING ADHESIVE マスク厚  :100μm マスク開口率:100% APPLICABLE FFC RECOMMENDED DIMENSION 熱硬化接着剤 0.3 (THICKNESS:0.3 (25µm) ベ-スフィルム:ポリイミド APPLICABLE FPC RECOMMENDED DIMENSION (MOUNTING SIDE) D E CONNECTOR POSITION 補強板:ポリイミド P.C.BOARD PATTERN DIMENSION (REF.) REINFORCE BOARD: POLYIMIDE 推奨基板レイアウト (STIFFENER BOARD) 5 MIN. 3 MIN. (STIFFENER BOARD) 5 MIN. 3 MIN. 1.5 E 0.8 1.9 (0.1) (NON-ACCUMULATIVE) 7 6 5 4 CURRENT REV DESC: REVISED EC NO: 632178 DRWN: SKITAZAWA CHK'D: HSHIMOYAMA APPR: SHOSHIKAWA INITIAL REVISION: DRWN: AISHII APPR: KMORIKAWA THIRD ANGLE PROJECTION 2020/02/14 2020/02/17 2020/02/17 2012/09/19 2013/03/15 DRAWING SERIES A3-SIZE 51296 3 0.5MM FPC CONN F/F E/O HOUSING ASSY PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER SD-51296-017 MATERIAL NUMBER PSD 001 CUSTOMER SEE CHART 2 GENERAL MARKET C SHEET NUMBER 2 OF 2 1 A
0512966033 价格&库存

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