0524352371

7 8 C ターミナル E D (A) 4 0.5 0.25 (ピッチ) (3) 0.2 (PITCH) 0.5±0.05 0.2 0.7 (FPC挿入深さ) (INSERTION DEPTH OF FPC) D (1.7) (接点位置) (LENGTH TO CONTACT POINT) ACTUATOR ハウジング 接点部(上面) H CONTACT POINT (UPPER SIDE) HOUSING SECT.J-J 1 (1) (1) (5.9) (アクチュエータが開口した状態) (WHEN ACTUATOR IS OPENED) D 0.7 4.5 B±0.1 回路番号1用マーク (アクチュエータがロックした状態) (WHEN ACTUATOR IS LOCKED) J 3.5 0.5±0.05 5 H 接点部(上面) CONTACT POINT (UPPER SIDE) 金具 1.65 FITTING NAIL 　 3 0.82 K FITTING NAIL 0.18 B J 金具 5 2 1.9 CKT. NO.1 MARK 2 1 1. 使用材料 : MATERIAL ハウジング : 46ナイロン UL94V-0 HOUSING 46NYLON アクチュエータ : PPS UL94V-0 ACTUATOR ターミナル : リン青銅 金メッキ(t=0.2) TERMINAL PHOS-BRONZE GOLD-PLATED 金具 : リン青銅 錫メッキ(t=0.2) FITTING NAIL PHOS-BRONZE TIN-PLATED 2. エンボステープ梱包時は、アクチュエータがロックした状態とする。 IN THE PACKAGE, ACTUATOR OF PART NO. 52435-**29 SHOULD BE LOCKED. 3 ソルダーテール半田付け面のズレ量、および金具半田付け面のズレ量は、基準面 Hに対し上方向 0.1MAXIMUM、下方向 0.15MAXIMUM とし、相互のばらつきは 0.1MAXIMUMとする。 MISALIGNMENT OF SOLDER TAILS AND FITTING NAILS FROM DATUM-H UPPER DIRECTION : 0.1MAXIMUM, LOWER DIRECTION : 0.15MAXIMUM OFFSET BETWEEN UPPER AND LOWER : 0.1MAXIMUM. 4 偶数極に適用。 APPLY FOR EVEN CIRCUIT. パターンはく離止め金具。 5 FITTING NAIL FOR PREVENTION OF PEELING OF P.W.B PATTERN. 6 R0.3はFPCの導体部にかからないこと。 R0.3 MUST NOT BE OVERLAPPED TO PATTERN OF FPC. 7. ELV および RoHS 適合品。 ELV AND RoHS COMPLIANT. アクチュエータ D C 3 注記 NOTES 0.2 0.5±0.1 TERMINAL 4 0.5 (2.55) 5 6 0.7 9 21.6 21.1 20.6 20.1 19.6 19.1 18.6 18.1 17.6 17.1 14.6 19.6 19.1 18.6 18.1 17.6 17.1 16.6 16.1 15.6 15.1 12.6 15.65 15.15 14.65 14.15 13.65 13.15 12.65 12.15 11.65 11.15 8.65 14.5 14.0 13.5 13.0 12.5 12.0 11.5 11.0 10.5 10.0 7.5 D C B (A) 52435-3071 52435-2971 52435-2871 52435-2771 52435-2671 52435-2571 52435-2471 52435-2371 52435-2271 52435-2171 52435-1671 30 29 28 27 26 25 24 23 22 21 16 E D C B 極数 EMBOSSED PACKAGE CKT. ORDER No. オーダー番号 CONNECTOR SERIES NO. : 52435-**29 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION VIEW K 0.63 0.7 0.65 A 0.9 (金具部投影図) (DETAIL OF FITTING NAIL) 2.605 DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 2018/03/14 8 07:58:46 7 6 5 GENERAL TOLERANCES (UNLESS SPECIFIED) 10 UNDER ±　0.2 10 OVER 30 UNDER ±　0.25 ±　0.3 30 OVER ANGULAR 　　±　3　° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 DIMENSION UNITS SCALE mm 10:1 GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.25 2 PLACES ± 0.3 1 PLACE ± 0 PLACES ± DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS CURRENT REV DESC: EC NO: 600082 DRWN: YCHEN128 CHK'D: KTAKAHASHI APPR: NUKITA INITIAL REVISION: DRWN: MUMEDA APPR: NUKITA THIRD ANGLE PROJECTION 3 2018/02/27 2018/03/14 2018/03/14 2005/02/04 2005/02/17 PRODUCT CUSTOMER DRAWING SERIES A3-SIZE 52435 2 DOC TYPE DOC PART REVISION DOCUMENT NUMBER SD-52435-016 MATERIAL NUMBER DRAWING A 0.5 FPC CONN. ZIF FOR SMT R/A(TOP CONTACT) SEE TABLE PSD 001 E SHEET NUMBER CUSTOMER GENERAL MARKET 1 1 OF 2 7 8 0.5±0.05 (ピッチ) (PITCH) 0.5±0.08 0.35+0.04 -0.03 0.5±0.05 ±0.05 0.5(N-1) 仕上がり厚さ THICKNESS 適合FFC推奨寸法 APPLICABLE FPC RECOMMENDED DIMENSION APPLICABLE FFC RECOMMENDED DIMENSION (仕上がり厚さ : 0.3±0.05) (仕上がり厚さ : 0.3±0.05) (THICKNESS : 0.3±0.05) 1 F 0.3±0.03 4±0.5 (STIFFENER BOARD) 6±0.5 (補強板) 適合FPC推奨寸法 仕上がり厚さ THICKNESS 0.5±0.08 (ピッチ) (PITCH) 2-R0.3 6 4±0.5 E 0.5±0.1 2 0.3 ±0.05 (STIFFENER BOARD) 0.5(N-1) 3 0.3 ±0.05 0.5(N+1)±0.07 ±0.05 0.5±0.1 4 めっき：金めっき(0.２μm)　 　下地ニッケル(1-5μm) PLATING: GOLD(0.2μm)　 　　　 NICKEL UNDER(1-5μm) 0.5(N+1)±0.07 F 5 6 めっき：金めっき(0.２μm)　 　下地ニッケル(1-5μm) PLATING: GOLD(0.2μm)　 　　　 NICKEL UNDER(1-5μm) 9 6±0.5 (補強板) 10 (THICKNESS : 0.3±0.05) E M SOLDERING AREA OF FITTING NAIL L 1.1 1.25 1.25 DETAIL L コネクタ位置 CONNECTOR POSITION 接着剤(難燃ポリエステル系) ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 絶縁テープ：ポリエステル系(25μm) INSULATING FILM: PET(25μm) 接着剤(難燃ポリエステル系) ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 導体部：　銅箔(35μmか50μm) COPPER FOIL (35μm or 50μm) 金具パターンエリア (0.3) (0.3) C 3.05 (NON-ACCUMULATIVE) カバーレイ　:　ポリイミド(25μm) COVER FILM: POLYIMIDE(25μm) (0.3) (ピッチ) 0.5±0.05 (PITCH) (公差非累積) 0.8 3.65 2.2 ±0.05 0.5(N-1) (0.3) KEEPING OUT AREA OF PATTERN AND SOLDERING 1.85MIN. 0.55MAX. パターンおよび 半田禁止エリア 3.65 (0.2) 0.45MAX. 補強板：ポリエステル系 REINFORCE BOARD: PET 接着剤(難燃ポリエステル系) ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 絶縁テープ：ポリエステル系(25μm) INSULATING FILM: PET(25μm) D 補強板：ポリイミド REINFORCE BOARD: POLYMIDE 熱硬化接着剤 THERMOSETTING ADHESIVE ベースフィルム：ポリイミド(25μm) BASE FILM: POLYIMIDE(25μm) 熱硬化接着剤 THERMOSETTING ADHESIVE 導体部：　銅箔(35μm) COPPER FOIL (35μm) 熱硬化接着剤 THERMOSETTING ADHESIVE D C FFC構成推奨仕様 STRUCTURE OF FFC FPC構成推奨仕様 STRUCTURE OF FPC 参考基板レイアウト (マウント面) B RECOMMENDED P.C.BOARD PATTERN DIMENSION (REF.) (MOUNTING SIDE) PATTERN B R0.3 (0.605) BOARD THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION (FROM PATTERN EDGE) VIEW M (DETAIL OF FITTING NAIL ON PATTERN) A DOCUMENT STATUS 10 FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 P1 RELEASE DATE 9 2018/03/14 07:58:46 8 7 6 GENERAL TOLERANCES (UNLESS SPECIFIED) 10 UNDER ±　0.2 10 OVER 30 UNDER ±　0.25 ±　0.3 30 OVER ANGULAR 　　±　3　° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 5 DIMENSION UNITS SCALE mm 10:1 GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.25 2 PLACES ± 0.3 1 PLACE ± 0 PLACES ± DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 CURRENT REV DESC: EC NO: 600082 DRWN: YCHEN128 CHK'D: KTAKAHASHI APPR: NUKITA INITIAL REVISION: DRWN: MUMEDA APPR: NUKITA THIRD ANGLE PROJECTION 2018/02/27 2018/03/14 2018/03/14 2005/02/04 2005/02/17 DRAWING SERIES A3-SIZE 52435 3 0.5 FPC CONN. ZIF FOR SMT R/A(TOP CONTACT) PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER SD-52435-016 MATERIAL NUMBER PSD 001 CUSTOMER GENERAL MARKET SEE TABLE 2 E SHEET NUMBER 2 OF 2 1 A