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0524352733

0524352733

  • 厂商:

    MOLEX10(莫仕)

  • 封装:

    -

  • 描述:

    05 FPC ZIF HSG ASSY

  • 数据手册
  • 价格&库存
0524352733 数据手册
9 7 8 6 5 4 3 2 1 E E 5 注記NOTES  1.使用材料 MATERIAL ハウジング:ポリアミド(PA)、ガラス充填、UL94V-0、ナチュラル(白) HOUSING:POLYAMIDE,GLASS FILLED,UL94V-0,NATURAL(WHITE) アクチュエータ:ポリフェニレンサルファイド(PPS)、ガラス充填、UL94V-0、黒 ACTUATOR:POLYPHENYLENE SULFIDE,GLASS FILLED,UL94V-0,BLACK ターミナル:リン青銅、(t=0.2) TERMINAL:PHOSPHOR BRONZE 金具:リン青銅、(t=0.2) FITTING NAIL:PHOSPHOR BRONZE 2.めっき仕様 PLATING ターミナル TERMINAL 錫銀ビスマスめっき(1.0μm以上) 下地:ニッケルめっき(1.0μm以上) TIN SILVER BISMUTH PLATING (1.0 MICROMETER MINIMUM) UNDER PLATE:NICKEL PLATING (1.0 MICROMETER MINIMUM) 金具 FITTING NAIL 錫めっき(1.0μm以上) 下地:ニッケルめっき(1.0μm以上) TIN PLATING (1.0 MICROMETER MINIMUM) UNDER PLATE:NICKEL PLATING (1.0 MICROMETER MINIMUM) R0.3は、FPCの導体部にかからないこと 3 R0.3 MUST NOT BE OVERLAPED TO PATTERN OF FPC.  4.エンボステープ梱包時は、アクチュエータがロックした状態になります。 IN THE PACKAGE,ACTUATOR SHOULD BE LOCKED. 偶数極に適用 5 APPLY FOR EVEN CIRCUIT. パターン剥離止め金具 6 FITTING NAIL FOR PREVENTION OF PEELING OF P.W.B. PATTERN. ソルダーテール半田付け面のズレ量、および金具半田付け面のズレ量は、 7 基準面Hに対し上方向 0.1MAXIMUM 、下方向 0.15MAXIMUM とし、 相互のばらつきは0.1MAXIMUMとする。 MISALIGNMENT OF SOLDER TAILS AND FITTING NAILS FROM DATUM H UPPER DIRECTION : 0.1MAXIMUM, LOWER DIRECTION :   0.15MAXIMUM OFFSET BETWEEN UPPER AND LOWER : 0.1MAXIMUM. 8.ELV及びRoHS適合品 ELV AND RoHS COMPLIANT. D C B 6 7   21.6 21.1 20.6 20.1 19.6 19.1 18.6 18.1 17.6 17.1 19.6 19.1 18.6 18.1 17.6 17.1 16.6 16.1 15.6 15.1 15.65 15.15 14.65 14.15 13.65 13.15 12.65 12.15 11.65 11.15 14.5 14.0 13.5 13.0 12.5 12.0 11.5 11.0 10.5 10.0 D C B (A) CONNECTOR SERIES NO. 52435-3033 52435-2933 52435-2833 25435-2733 52435-2633 52435-2533 52435-2433 52435-2333 52435-2233 52435-2133 30 29 28 27 26 25 24 23 22 21 D C B オーダー番号 極数 ORDER NO. CKT 52435-**22 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION A DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 9 P1 RELEASE DATE 2018/04/13 8 03:51:00 7 6 5 GENERAL TOLERANCES (UNLESS SPECIFIED) 10 UNDER ± 0.2 10 OVER 30 UNDER ± 0.25 ± 0.3 30 OVER ANGULAR   ± 3 ° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 DIMENSION UNITS SCALE mm 1:1 GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.25 2 PLACES ± 0.3 1 PLACE ± 0 PLACES ± DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS CURRENT REV DESC: REVISED EC NO: 600129 DRWN: YCHEN128 CHK'D: KTAKAHASHI APPR: NUKITA INITIAL REVISION: DRWN: NASANUMA APPR: KMORIKAWA THIRD ANGLE PROJECTION 3 2018/04/09 2018/04/12 2018/04/13 2012/09/13 2013/03/15 PRODUCT CUSTOMER DRAWING SERIES A3-SIZE 52435 2 DOC TYPE DOC PART REVISION DOCUMENT NUMBER SD-52435-022 MATERIAL NUMBER DRAWING A 0.5 FPC CONN ZIF R/A HOUSING ASSY (UPPER CONTAT) PSD 001 C SHEET NUMBER CUSTOMER GENERAL MARKET 1 1 OF 2 10 9 8 7 6 5 4 3 2 0.3 ±0.05 0.3 ±0.05 仕上がり厚さ THICKNESS F 1 仕上がり厚さ THICKNESS F めっき:錫めっき(0.5-1.2μm)   下地ニッケル(1-5μm) PLATING: TIN(0.5-1.2μm)      NICKEL UNDER(1-5μm) めっき:錫めっき(0.5-1.2μm)   下地ニッケル(1-5μm) PLATING: TIN(0.5-1.2μm)      NICKEL UNDER(1-5μm) 5 E E 接着剤(難燃ポリエステル系) ADHESIVE(FLAME-RETARDANT POLYESTER ADHESIVE) 絶縁テープ:ポリエステル系(25μm) INSULATING FILM: PET(25μm) 接着剤(難燃ポリエステル系) ADHESIVE(FLAME-RETARDANT POLYESTER ADHESIVE) 導体部: 銅箔(35μm) COPPER FOIL (35μm) FPC構成推奨仕様 FFC構成推奨仕様 RECOMMENDED STRUCTURE OF FPC RECOMMENDED STRUCTURE OF FFC 推奨基板レイアウト(マウント面) C FPC/FFCについて:   抜き方向は、導体側から補強板側を推奨致します。   尚、接着剤の接点部への付着は導通不良の原因になりますので、   染み出しが無い様お願い致します。 ABOUT FPC/FFC: RECOMMENDED PUNCHER DIRECTION: FROM CONDUCTOR SIDE TO STIFFNER SIDE PLEASE PUT APPROPRIATE AMOUNT OF ADHESIVE ON ADHEREND BECAUSE THERE IS A POSSIBILITY THAT THE EXTRA ADHESIVE  CAUSES THE DEFECT IN ELECTRICAL CONTINUITY. RECOMMENDED P.C.BOARD PATTERN DIMENSION (MOUNTING SIDE) B カバーレイ : ポリイミド(25μm) COVER FILM: POLYIMIDE(25μm) C 補強板:ポリエステル系 REINFORCE BOARD: PET 接着剤(難燃ポリエステル系) ADHESIVE(FLAME-RETARDANT POLYESTER ADHESIVE) 絶縁テープ:ポリエステル系(25μm) INSULATING FILM: PET(25μm) D 補強板:ポリイミド REINFORCE BOARD: POLYMIDE 熱硬化接着剤 THERMOSETTING ADHESIVE ベースフィルム:ポリイミド(25μm) BASE FILM: POLYIMIDE(25μm) 熱硬化接着剤 THERMOSETTING ADHESIVE 導体部: 銅箔(35μm) COPPER FOIL (35μm) 熱硬化接着剤 THERMOSETTING ADHESIVE D マスク厚    :  100μm マスク開口率  :  100% SCREEN THICKNESS : 100μm SCREEN OPEN RATIO : 100% B THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION A DOCUMENT STATUS 10 FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 P1 RELEASE DATE 9 2018/04/13 03:51:00 8 7 6 GENERAL TOLERANCES (UNLESS SPECIFIED) 10 UNDER ± 0.2 10 OVER 30 UNDER ± 0.25 ± 0.3 30 OVER ANGULAR   ± 3 ° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 5 DIMENSION UNITS SCALE mm 5:1 GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.25 2 PLACES ± 0.3 1 PLACE ± 0 PLACES ± DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 CURRENT REV DESC: REVISED EC NO: 600129 DRWN: YCHEN128 CHK'D: KTAKAHASHI APPR: NUKITA INITIAL REVISION: DRWN: NASANUMA APPR: KMORIKAWA THIRD ANGLE PROJECTION 2018/04/09 2018/04/12 2018/04/13 2012/09/13 2013/03/15 DRAWING SERIES A3-SIZE 52435 3 0.5 FPC CONN ZIF R/A HOUSING ASSY (UPPER CONTAT) PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER SD-52435-022 MATERIAL NUMBER PSD 001 CUSTOMER GENERAL MARKET 2 C SHEET NUMBER 2 OF 2 1 A
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