0524372771

10 9 7 8 6 5 4 F 3 1 F 注記NOTES 　1.使用材料 MATERIAL ハウジング：46ナイロン、ガラス充填、UL94V-0、白 HOUSING:PA46,GLASS FILLED,UL94V-0,WHITE アクチュエータ：ポリフェニレンサルフィド（PPS）、ガラス充填、 UL94V-0、茶色 ACTUATOR:POLYPHENYLENE SULFIDE,GLASS FILLED, UL94V-0,BROWN ターミナル：リン青銅、ニッケル下地金めっき（t=0.2） TERMINAL:PHOSPHOR BRONZE,GOLD OVER NICKEL PLATING E 金具：リン青銅、ニッケル下地錫めっき（t=0.2） FITTING NAIL: PHOSPHOR BRONZE,TIN OVER NICKEL PLATING 　2.エンボステープ梱包時は、アクチュエータがロックした状態になります。 IN THE PACKAGE,ACTUATOR OF PART NO.52437-**29 SHOULD BE LOCKED. 3 ソルダーテール半田付け面のズレ量、及び金具半田付け面のズレ量は、 基準面Hに対して上方向に0.1MAXIMUM、下方向0.15MAXIMUMとする。 MISALIGNMENT OF SOLDER TAILS AND FITTING NAILS FROM DATUM-H. UPPER DIRECTON:0.1MAXIMUM LOWER DIRECTION:0.15 MAXIMUM 4 偶数極に適用 D APPLY FOR EVEN CIRCUIT. 5 ﾊﾟﾀｰﾝ剥離止め金具 FITTING NAIL FOR PREVENTION OF PEELING OF P.W.B. PATTERN. 6 R0.3は、FPCの導体部にかからないこと R0.3 MUST NOT BE OVERLAPED TO PATTERN OF FPC. 7.ソルダーテールの平坦度は、0.1MAXIMUMとする。 SOLDER TAIL COPLANARITY IS 0.1 MAXIMUM. 8.ELV 及び RoHS 適合品 ELV AND RoHS COMPLIANT 0.25 0.5 E D 21.6 21.1 20.6 20.1 19.6 19.1 18.6 18.1 17.6 17.1 C K 5 金具 FITTING NAIL DOCUMENT STATUS 10 C B 14.5 14.0 13.5 13.0 12.5 12.0 11.5 11.0 10.5 10.0 52437-3071 52437-2971 52437-2871 52437-2771 52437-2671 52437-2571 52437-2471 52437-2371 52437-2271 52437-2171 30 29 28 27 26 25 24 23 22 21 極数 EMBOSSED PACKAGE (A) C B CKT. ORDER No. オーダー番号 CONNECTOR SERIES NO. : 52437-**29 0.9 VIEW K 0.7 0.63 (金具部投影図) (DETAIL OF FITTING NAIL) 2.605 FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 15.65 15.15 14.65 14.15 13.65 13.15 12.65 12.15 11.65 11.15 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION 0.65 A 19.6 19.1 18.6 18.1 17.6 17.1 16.6 16.1 15.6 15.1 D 1.65 B 2 P1 RELEASE DATE 9 2018/03/14 07:58:47 8 7 6 GENERAL TOLERANCES (UNLESS SPECIFIED) 10 UNDER ±　0.2 10 OVER 30 UNDER ±　0.25 ±　0.3 30 OVER ANGULAR 　　±　3　° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 5 DIMENSION UNITS SCALE mm 10:1 GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.25 2 PLACES ± 0.3 1 PLACE ± 0 PLACES ± DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 CURRENT REV DESC: EC NO: 600082 DRWN: YCHEN128 CHK'D: KTAKAHASHI APPR: NUKITA INITIAL REVISION: DRWN: MUMEDA APPR: NUKITA THIRD ANGLE PROJECTION 2018/03/02 2018/03/14 2018/03/14 2004/12/20 2004/12/24 DRAWING SERIES A3-SIZE 52437 3 0.5 FPC CONN.ZIF FOR SMT R/A (BOTTOM CONTACT) GOLD PLATING PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER SD-52437-019 MATERIAL NUMBER PSD 001 CUSTOMER GENERAL MARKET SEE TABLE 2 F SHEET NUMBER 1 OF 2 1 A 7 8 5 6 4 3 2 0.3 ±0.05 0.3 ±0.05 仕上がり厚さ THICKNESS 0.5(N+1)±0.07 　　　APPLICABLE FFC OF GOLD PLATING RECOMMENDED DIMENSION THICKNESS: 0.3+0.05/-0.05 THICKNESS: 0.3+0.05/-0.05 仕上がり厚さ：0.3±0.05 (NON-ACCUMULATIVE) 金具パターンエリア M SOLDERING AREA OF FITTING NAIL (0.3) (0.3) 3.05 C コネクタ位置 DETAIL L B 1.1 1.25 CONNECTOR POSITION FPCについて 打ち抜き方向は導体側から補強板を推奨いたします。 補強フィルム材質はポリイミドを推奨いたします。 接着剤は熱効果接着剤を推奨致します。 ABOUT FPC : RECOMMENDED PUNCHER DIRECTION : FROM CONDUCTOR SIDE TO STIFFNER BOARD SIDE. RECOMMENDED MATERIAL : STIFFNER FILM : POLYIMIDE BONDING AGENT : THERMOSETTING BONDING AGENT PATTERN (FROM PATTERN EDGE) VIEW M (DETAIL OF FITTING NAIL ON PATTERN) DOCUMENT STATUS 10 FORMAT: master-tb-prod-A3 REVISION: H DATE: 2018/01/18 P1 RELEASE DATE 9 2018/03/14 B THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION R0.3 (0.605) BOARD A C FFC構成推奨仕様 STRUCTURE OF FFC FPC構成推奨仕様 STRUCTURE OF FPC L 1.25 補強板：ポリエステル系 REINFORCE BOARD: PET 接着剤(難燃ポリエステル系) ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 絶縁テープ：ポリエステル系(25μm) INSULATING FILM: PET(25μm) (0.3) (ピッチ) 0.5±0.05 (PITCH) (公差非累積) 補強板：ポリイミド REINFORCE BOARD: POLYMIDE 熱硬化接着剤 THERMOSETTING ADHESIVE ベースフィルム：ポリイミド(25μm) BASE FILM: POLYIMIDE(25μm) 熱硬化接着剤 THERMOSETTING ADHESIVE 導体部：　銅箔(35μm) COPPER FOIL (35μm) 熱硬化接着剤 THERMOSETTING ADHESIVE 3.65 0.8 KEEPING OUT AREA OF PATTERN AND SOLDERING 1.85MIN. 0.55MAX. パターンおよび 半田禁止エリア ±0.05 0.5(N-1) 2.2 3.65 (0.3) 0.45MAX. E D (0.2) 仕上がり厚さ：0.3±0.05 めっき：金めっき(0.２μm)　 　下地ニッケル(1-5μm) PLATING: GOLD(0.2μm)　 　　　 NICKEL UNDER(1-5μm) 適合金めっきFFC推奨寸法 　　　APPLICABLE FPC OF GOLD PLATING RECOMMENDED DIMENSION D めっき：金めっき(0.２μm)　 　下地ニッケル(1-5μm) PLATING: GOLD(0.2μm)　 　　　 NICKEL UNDER(1-5μm) 4±0.5 適合金めっきFPC推奨寸法 0.5±0.08 0.3±0.03 (PITCH) 6 6±0.5 4±0.5 E 0.5±0.05 　　 補強板 (STIFFENER BOARD) R0.3 0.5(N-1)±0.05 0.5±0.08 0.35+0.04 -0.03 (PITCH) 6±0.5 0.5±0.05 F 0.5(N+1)±0.07 0.5±0.1 　　補強板 (STIFFENER BOARD) 0.5(N-1)±0.05 0.5±0.1 仕上がり厚さ THICKNESS カバーレイ　:　ポリイミド(25μm) COVER FILM: POLYIMIDE(25μm) F 1 接着剤(難燃ポリエステル系) ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 絶縁テープ：ポリエステル系(25μm) INSULATING FILM: PET(25μm) 9 接着剤(難燃ポリエステル系) ADHESIVE（FLAME-RETARDANT POLYESTER ADHESIVE) 導体部：　銅箔(35μmか50μm) COPPER FOIL (35μm or 50μm) 10 07:58:47 8 7 6 GENERAL TOLERANCES (UNLESS SPECIFIED) 10 UNDER ±　0.2 10 OVER 30 UNDER ±　0.25 ±　0.3 30 OVER ANGULAR 　　±　3　° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 5 DIMENSION UNITS SCALE mm 5:1 GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 3.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.25 2 PLACES ± 0.3 1 PLACE ± 0 PLACES ± DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 CURRENT REV DESC: EC NO: 600082 DRWN: YCHEN128 CHK'D: KTAKAHASHI APPR: NUKITA INITIAL REVISION: DRWN: MUMEDA APPR: NUKITA THIRD ANGLE PROJECTION 2018/03/02 2018/03/14 2018/03/14 2004/12/20 2004/12/24 DRAWING SERIES A3-SIZE 52437 3 0.5 FPC CONN.ZIF FOR SMT R/A (BOTTOM CONTACT) GOLD PLATING PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER SD-52437-019 MATERIAL NUMBER PSD 001 CUSTOMER SEE SHEET 1 2 GENERAL MARKET F SHEET NUMBER 2 OF 2 1 A