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0717640176

0717640176

  • 厂商:

    MOLEX10(莫仕)

  • 封装:

    -

  • 描述:

    CONN HEADER R/A 76POS 2.54MM

  • 详情介绍
  • 数据手册
  • 价格&库存
0717640176 数据手册
12 11 10 9 7 8 5 6 4 3 2 2.54 ±0.05 TYP. .100 ±.002 (NON-ACCUM.) H 2.54 ±0.05 .100 ±.002 2.29 REF. .090 ⌀ 1.14 ±0.05 TYP. .045 ±.002 G BANDOLIER PIN 0.64/[.025] SQUARE RECOMMENDED P.C. BOARD HOLE LAYOUT 1 CKTS A B 04 06 08 10 12 14 16 18 20 22 24 26 28 30 5.08/[.200] 7.62/[.300] 10.16/[.400] 12.70/[.500] 15.24/[.600] 17.78/[.700] 20.32/[.800] 22.86/[.900] 25.40/[1.000] 27.94/[1.100] 30.48/[1.200] 33.02/[1.300] 35.56/[1.400] 38.10/[1.500] 2.54/[.100] 5.08/[.200] 7.62/[.300] 10.16/[.400] 12.70/[.500] 15.24/[.600] 17.78/[.700] 20.32/[.800] 22.86/[.900] 25.40/[1.000] 27.94/[1.100] 30.48/[1.200] 33.02/[1.300] 35.56/[1.400] H G A REF. B REF. F C ±0.25 C ±0.010 1.27 REF. .050 CKT. 3 CKT. 5 CKT. 1 CKT. 7 5.08 REF. .200 F 2.54 .100 SEE NOTE 8 2.54 .100 E E E REF. 1.27 REF. .050 CKT. 8 2.54 TYP. .100 2.29 REF. .090 CKT. 2 CKT. 6 1.27 SEE NOTE 8 .050 CKT. 4 2.54 REF. .100 D C B A NOTES: 1. MATERIAL: WAFER - HIGH TEMPERATURE THERMAL PLASTIC, 94V-0; COLOR: BLACK PIN - COPPER ALLOY 2. PLATING: TIN - 0.00381/[.000150] MINIMUM TIN PLATE OVER NICKEL PLATE. 15 GOLD - 0.00038/[.000015] MINIMUM GOLD PLATE IN SELECT AREA, 0.00191/[.000075] MINIMUM TIN PLATE IN SELECT AREA, OVER NICKEL PLATE OVERALL. 30 GOLD - 0.00076/[.000030] MINIMUM GOLD PLATE IN SELECT AREA, 0.00191/[.000075] MINIMUM TIN PLATE IN SELECT AREA, OVER NICKEL PLATE OVERALL. * THE PRIMARY SHIPPING CARTON WILL BE LABELED "COMPLIANT TO RoHS DIRECTIVE 2002/95/EC AND ELV ANNEX II OF DIRECTIVE 2000/53/EC". CARTONS WITHOUT THIS LABEL MAY CONTAIN PRODUCT WITH LEAD. 3. PRODUCT CONFORMS TO PS-71764. 4. PACKAGING INFORMATION: FOR 4 THRU 8 CIRCUIT PARTS USE PK-70873-0353 FOR 10 CIRCUITS AND OVER USE PK-70873-0075 5. FOR ILLUSTRATION PURPOSES, 20 (DUAL 10) CIRCUIT SIZE IS SHOWN. 6. PINS MUST MEET SOLDERABILITY SPEC. ES-152, EXCEPT VOIDS ARE PERMISSIBLE AT BANDOLIER PIN AT BANDOLIER PIN FAYING SURFACE. (APPROX. 0.64/[.025] LNG X 0.15/[.006] WD. REF.) 2 LOCATIONS 7. WAFER TO BE FLAT WITHIN 0.03 MM/CM OR [.003 IN./IN] 8. MEASURE POINT FOR PLATING THICKNESS. 9. THIS PART CONFORMS TO CLASS B REQUIREMENTS OF COSMETIC SPECIFICATION PS-45499-002 D C B THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE MM/INCH 4:1 GENERAL TOLERANCES (UNLESS SPECIFIED) MM DOCUMENT STATUS 12 P1 RELEASE DATE 11 2019/03/11 10 INCH 4 PLACES ± ± 3 PLACES ± ± 0.01 0.01 2 PLACES ± 0.25 ± ± 0.25 ± 1 PLACE 0 PLACES ± ANGULAR TOL FORMAT: Eng-lega-master-tb-prod-C REVISION: D DATE: 2018/01/18 CURRENT REV DESC: MIGRATED TO NX ± ± 0.5 ° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 07:13:14 9 8 7 6 5 EC NO: 613447 DRWN: ABABU01 CHK'D: NMANE02 APPR: MRAMAKRISHNA INITIAL REVISION: DRWN: CAC APPR: DJB THIRD ANGLE PROJECTION 4 DUAL ROW WAFER ASS'Y 2019/03/07 W/BREAK-OFF OPTION RT. ANG. (0.64)/.025 SQ PINS 2019/03/11 2019/03/11 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 1995/08/23 1995/08/23 DRAWING SERIES C-SIZE 71764 3 SD-71764-001 MATERIAL NUMBER PSD 001 CUSTOMER GENERAL MARKET SEE TABLE 2 A3 SHEET NUMBER 1 OF 3 1 A 12 11 10 9 7 8 5 6 4 3 2 1 H H ITEM NO: 71764-0004/0030, 9003 6.10/[.240] DIM. C 2.79/[.110] DIM. E (REF.) TIN FINISH TIN CONNECTOR END PLATING TIN P.C. BOARD END PLATING PACKAGING SEE NOTE 4 SHEET 1 ITEM NUMBER CKTS VOIDS 04 71764-0004 06 71764-0006 08 71764-0008 10 71764-0010 12 71764-0012 14 71764-0014 16 71764-0016 18 71764-0018 20 71764-0020 22 71764-0022 24 71764-0024 26 71764-0026 28 71764-0028 30 71764-0030 G F E D 06 71764-9003 ITEM NO: 71764-0104/0130, 9001, 9004 6.10/[.240] DIM. C 2.79/[.110] DIM. E (REF.) FINISH 15 GOLD CONNECTOR END PLATING GOLD TIN P.C. BOARD END PLATING PACKAGING SEE NOTE 4 SHEET 1 ITEM NUMBER CKTS VOIDS 04 71764-0104 06 71764-0106 08 71764-0108 10 71764-0110 12 71764-0112 14 71764-0114 16 71764-0116 18 71764-0118 20 71764-0120 22 71764-0122 24 71764-0124 26 71764-0126 28 71764-0128 30 71764-0130 3 06 08 71764-9001 71764-9004 ITEM NO: 71764-0204/0230, 9000, 9002 6.10/[.240] DIM. C 2.79/[.110] DIM. E (REF.) PLATING FINISH 30 GOLD CONNECTOR END PLATING GOLD TIN P.C. BOARD END PLATING PACKAGING SEE NOTE 4 SHEET 1 ITEM NUMBER CKTS VOIDS 04 71764-0204 06 71764-0206 08 71764-0208 10 71764-0210 12 71764-0212 14 71764-0214 16 71764-0216 18 71764-0218 20 71764-0220 22 71764-0222 24 71764-0224 26 71764-0226 28 71764-0228 30 71764-0230 3, 4 5, 6 06 71764-9002 3, 4 10 71764-9000 8 G F E D C C B B THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE MM/INCH 1:1 CURRENT REV DESC: MIGRATED TO NX GENERAL TOLERANCES (UNLESS SPECIFIED) MM A 4 PLACES ± ± 3 PLACES ± ± 0.01 0.01 2 PLACES ± 0.25 ± ± 0.25 ± 1 PLACE 0 PLACES ± ANGULAR TOL DOCUMENT STATUS 12 FORMAT: Eng-lega-master-tb-prod-C REVISION: D DATE: 2018/01/18 P1 RELEASE DATE 11 2019/03/11 10 INCH ± ± 0.5 ° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 07:13:14 9 8 7 6 5 EC NO: 613447 DRWN: ABABU01 CHK'D: NMANE02 APPR: MRAMAKRISHNA INITIAL REVISION: DRWN: CAC APPR: DJB THIRD ANGLE PROJECTION 4 DUAL ROW WAFER ASS'Y 2019/03/07 W/BREAK-OFF OPTION RT. ANG. (0.64)/.025 SQ PINS 2019/03/11 2019/03/11 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 1995/08/23 1995/08/23 DRAWING SERIES C-SIZE 71764 3 SD-71764-001 MATERIAL NUMBER PSD 001 CUSTOMER GENERAL MARKET SEE TABLE 2 A3 SHEET NUMBER 2 OF 3 1 A 12 11 10 9 8 7 5 6 4 3 2 1 H H G G ITEM NO: 71764-0304/0330 8.13/[.320] DIM. C 2.79/[.110] DIM. E (REF.) TIN PLATING FINISH TIN CONNECTOR END PLATING TIN P.C. BOARD END PLATING PACKAGING SEE NOTE 4 SHEET 1 ITEM NUMBER CKTS VOIDS 04 71764-0304 06 71764-0306 08 71764-0308 10 71764-0310 12 71764-0312 14 71764-0314 16 71764-0316 18 71764-0318 20 71764-0320 22 71764-0322 24 71764-0324 26 71764-0326 28 71764-0328 30 71764-0330 F E D ITEM NO: 71764-0404/0430 8.13/[.320] DIM. C 2.79/[.110] DIM. E (REF.) PLATING FINISH 15 GOLD CONNECTOR END PLATING GOLD TIN P.C. BOARD END PLATING PACKAGING SEE NOTE 4 SHEET 1 ITEM NUMBER CKTS VOIDS 04 71764-0404 06 71764-0406 08 71764-0408 10 71764-0410 12 71764-0412 14 71764-0414 16 71764-0416 18 71764-0418 20 71764-0420 22 71764-0422 24 71764-0424 26 71764-0426 28 71764-0428 30 71764-0430 ITEM NO: 71764-0504/0530 8.13/[.320] DIM. C 2.79/[.110] DIM. E (REF.) PLATING FINISH 30 GOLD CONNECTOR END PLATING GOLD TIN P.C. BOARD END PLATING PACKAGING SEE NOTE 4 SHEET 1 ITEM NUMBER CKTS VOIDS 04 71764-0504 06 71764-0506 08 71764-0508 10 71764-0510 12 71764-0512 14 71764-0514 16 71764-0516 18 71764-0518 20 71764-0520 22 71764-0522 24 71764-0524 26 71764-0526 28 71764-0528 30 71764-0530 F E D C C B B THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE MM/INCH 1:1 CURRENT REV DESC: MIGRATED TO NX GENERAL TOLERANCES (UNLESS SPECIFIED) MM A 4 PLACES ± ± 3 PLACES ± ± 0.01 0.01 2 PLACES ± 0.25 ± ± 0.25 ± 1 PLACE 0 PLACES ± ANGULAR TOL DOCUMENT STATUS 12 FORMAT: Eng-lega-master-tb-prod-C REVISION: D DATE: 2018/01/18 P1 RELEASE DATE 11 2019/03/11 10 INCH ± ± 0.5 ° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 07:13:14 9 8 7 6 5 EC NO: 613447 DRWN: ABABU01 CHK'D: NMANE02 APPR: MRAMAKRISHNA INITIAL REVISION: DRWN: CAC APPR: DJB THIRD ANGLE PROJECTION 4 DUAL ROW WAFER ASS'Y 2019/03/07 W/BREAK-OFF OPTION RT. ANG. (0.64)/.025 SQ PINS 2019/03/11 2019/03/11 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 1995/08/23 1995/08/23 DRAWING SERIES C-SIZE 71764 3 SD-71764-001 MATERIAL NUMBER PSD 001 CUSTOMER GENERAL MARKET SEE TABLE 2 A3 SHEET NUMBER 3 OF 3 1 A
0717640176
1. 物料型号:文档列出了不同型号的双排带状电缆组件,例如71764-0204、71764-0206等,每个型号对应不同的电路数量和配置。

2. 器件简介:文档描述了这些组件是双排带状电缆组件,具有直角引脚,并且提供了不同尺寸和电路数量的选项。

3. 引脚分配:提供了不同电路数量的引脚分配表,例如4、6、8、10等,以及相应的引脚间距和尺寸。

4. 参数特性:文档详细列出了材料规格、镀层要求、焊接性规格等。例如,材料为高温热塑性塑料,颜色为黑色,引脚为铜合金,镀层包括锡和金。

5. 功能详解:文档提供了组件的一般公差、角度公差、焊接端镀层、PCB端镀层等信息。

6. 应用信息:文档提到了组件符合PS-71764标准,并提供了包装信息,例如PK-70873-0353和PK-70873-0075。

7. 封装信息:提供了不同型号的封装尺寸和细节,例如DIM.C和DIM.E(REF.)。
0717640176 价格&库存

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