12
11
10
9
7
8
5
6
4
3
2
1
MATERIALS AND FINISHES:
H
H
BODY: BRASS
PLATED: GOLD (1µ-in MIN) OVER NICKEL PHOSPHOR (80µ-in MIN)
CONTACT: BERYLLIUM COPPER
PLATED: GOLD (8µ-in MIN) OVER NICKEL PHOSPHOR (80µ-in MIN)
INSULATOR: PTFE
G
G
F
F
INSULATOR AND
CONTACT FLUSH
TO BELOW BODY
.276 REF
7.01
.235 REF
5.98
E
⌀ .354
⌀ .020
9.00
4 PLS
0.51
.079
2.01
2 PLS
.042 REF
1.07
2 PLS
SMA JACK
E
.149 REF
3.78 2 PLS
.007 REF
0.18
.281
7.14
.132 2 PLS
3.35
D
R.P
D
.010
0.25
C
C
.435 REF
11.06
.276 ±.003
7.01 ±0.08
B
B
73251-9780
PART NO.
SYMBOLS THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
CURRENT REV DESC: NEW RELEASE
= 0
TRAY
PACKAGING
MIL-STD-348, FIG. 310-2
SPECIFICATION
IN/MM
INTERFACE
DESCRIPTION
=
0
=
0
=
0
=
A
=
DOCUMENT STATUS
12
FORMAT: IN-tb-prod-C
REVISION: C
DATE: 2018/01/18
P1
RELEASE DATE
11
2019/07/24
10
C
20:13:13
9
8
7
6
0
0
=
0
=
0
=
0
NTS
GENERAL TOLERANCES
(UNLESS SPECIFIED)
MM
INCH
4 PLACES ±
±
3 PLACES ±
± 0.005
2 PLACES ±
0.13
±
±
0.25
±
1 PLACE
0 PLACES ±
ANGULAR TOL
±
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
5
0.01
°
EC NO:
620918
DRWN: BSHAH
CHK'D: LMEIER
APPR: AROBERTSON
INITIAL REVISION:
DRWN: DRWN BY
APPR: APPR BY
THIRD ANGLE PROJECTION
4
2019/07/16
2019/07/24
2019/07/24
SMA JACK PCB DETENT EDGE MOUNT FLAT
TAB CONTACT, SMA-J/PCB, EWR-13186
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
XXXX/XX/XX
XXXX/XX/XX
DRAWING
SERIES
C-SIZE
73251
3
A
DOC TYPE DOC PART REVISION
732519780
MATERIAL NUMBER
CUSTOMER
PSD
000
A
SHEET NUMBER
SEE TABLE
1 OF 2
2
1
12
11
10
9
7
8
5
6
4
3
2
1
PCB CONNECTOR LAUNCH / PAD (FOR REFERENCE ONLY)
ALL HATCHED SURFACES SHOWN BELOW ARE COPPER (Cu)
H
G
H
MOUNTING LAYER
(LAYER 1)
SIGNAL LAYER
(LAYER 2)
.022
0.56
IMPEDANCE
CONTROLLED
DIMENSION
.122
3.10
IMPEDANCE
CONTROLLED
DIMENSION
REFERENCE LAYER
(LAYER 3 & 4)
SUBSEQUENT LAYER(S)
G
.071
1.80
45°
2PLS
.010
0.25
ALL
LAYERS
F
.272
6.90
.070
1.78
E
F
.063
1.60
.010 2 PLS
0.25
ALL LAYERS
.280 MIN
7.10
.029
0.75
.069
1.75
.118
3.00
E
VIAS
SILK SCREEN
PCB STACK UP
.146 TYP
3.70
D
TYPICAL PERFORMANCE
CHARACTERISTICS WITH
CONNECTOR AND PCB
LAUNCH SHOWN
.181 TYP
4.60
.089
2.26
2 PLS
.152
3.86
.027
0.68
.034
0.86
=
0
=
0
=
0
=
RELEASE DATE
11
2019/07/24
10
C
20:13:13
9
6 TO 10 GHz
IN/MM
A
P1
1.75
8
3.02
10.0
0.7
3.02
10.0
0.7
1/2 oz. Cu
Isola Tachyon 100G
4
3.02
10.0
0.7
1/2 oz. Cu
Isola Tachyon 100G
5*
C
3.02
10.0
0.7
1/2 oz Cu
* SUBSEQUENT LAYERS MAY BE ADDED AS
REQUIRED FOR INDIVIDUAL APPLICATIONS
SYMBOLS THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
CURRENT REV DESC: NEW RELEASE
= 0
=
DOCUMENT STATUS
12
DC TO 6 GHz
D
2.1
B
.073
1.85
2 PLS
FORMAT: IN-master-tb-prod-C
REVISION: C
DATE: 2018/01/18
1.25
THICKNESS
(mil)
Dk
1/2 oz. Cu
3
CONTACT MOLEX RF / MICROWAVE FOR
APPLICATION SPECIFIC ASSISTANCE
.374
9.50
.180
4.57
.339 TYP
8.60
B
1/2 oz. Cu + PLATING
2
VARYING PCB STACKUPS AND PCB
LAUNCH WILL RESULT IN VARYING RESULTS
.050 TYP
1.27
1
Isola Tachyon 100G
.098
2.49
2 PLS
.260 TYP
6.60
MATERIAL
Isola Tachyon 100G
VSWR (FULLY MATED) FREQUENCY BAND
C
LAYER
7
6
0
0
=
0
=
0
=
0
NTS
GENERAL TOLERANCES
(UNLESS SPECIFIED)
MM
INCH
4 PLACES ±
±
3 PLACES ±
± 0.005
2 PLACES ±
0.13
±
±
0.25
±
1 PLACE
0 PLACES ±
ANGULAR TOL
±
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
5
0.01
°
EC NO:
620918
DRWN: BSHAH
CHK'D: LMEIER
APPR: AROBERTSON
INITIAL REVISION:
DRWN: DRWN BY
APPR: APPR BY
THIRD ANGLE PROJECTION
4
2019/07/16
2019/07/24
2019/07/24
SMA JACK PCB DETENT EDGE MOUNT FLAT
TAB CONTACT, SMA-J/PCB, EWR-13186
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
XXXX/XX/XX
XXXX/XX/XX
DRAWING
SERIES
C-SIZE
73251
3
A
DOC TYPE DOC PART REVISION
732519780
MATERIAL NUMBER
CUSTOMER
PSD
000
A
SHEET NUMBER
SEE TABLE
2 OF 2
2
1
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