0749934000

PRODUCT SPECIFICATION PRODUCT SPECIFICATION FOR HIGH DENSITY METRIC (HDM) BACKPLANE AND DAUGHTERCARD INTERCONNECT SYSTEM (STACKING AND MIDPLANE) REVISION: F ECR/ECN INFORMATION: EC No: UCP2009-1724 DATE: 2009/05/01 DOCUMENT NUMBER: PS-73780-999 TITLE: PRODUCT SPECIFICATION FOR HIGH DENSITY METRIC (HDM) INTERCONNECT SYSTEM (MIDPLANE & STACKING) SHEET No. 1 of 7 CREATED / REVISED BY: CHECKED BY: APPROVED BY: S. DANNELLEY B. SMART S. MILLER FILENAME: PS73780C.DOC PRODUCT SPECIFICATION 1.0 SCOPE This specification covers the performance requirements and test methods for the following products listed by series numbers: * * * * * * * 73642, 73643, 73644, 73650, 73942, 73943, 73944, 74992, 74349, 74301 73650, 73769, 73770, 73771, 73781, 73782, 73783, 74428, 74993 73650, 73797, 73798, 73799, 74349, 74992 73650, 73800, 73801, 73802, 74349, 74992 73656 73780, 74300 73998 HDM Backplane Signal Module HDM Backplane Signal Stacking Module HDM Backplane Signal Single-End Midplane Module HDM Backplane Signal Double-End Midplane Module HDM Midplane Backplane Power HDM Daughtercard Signal Stacking Module HDM Daughtercard Power Stacking Module The HDM backplane stacking and midplane interconnect systems consist of 6-row, 2mm grid modules providing 30 contacts per linear centimeter (over 75 per inch). The stacking connectors are used for parallel board packaging with stack heights from 15mm to 32mm. The midplane backplane modules allow rear-side mating of cards. Both the daughtercard receptacles and the backplane headers are through-hole connectors with solder tail or eyeof-the-needle compliant pin terminals. 2.0 PRODUCT DESCRIPTION 2.1 PRODUCT NAMES HDM (High Density Metric) 2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS Refer to the appropriate sales drawings for information on dimensions, materials, platings and markings. 2.3 SAFETY AGENCY APPROVALS UL File Number: E29179 CSA File Number: 152514 (LR19980) REVISION: F ECR/ECN INFORMATION: EC No: UCP2009-1724 DATE: 2009/05/01 DOCUMENT NUMBER: PS-73780-999 TITLE: PRODUCT SPECIFICATION FOR HIGH DENSITY METRIC (HDM) INTERCONNECT SYSTEM (MIDPLANE & STACKING) SHEET No. 2 of 7 CREATED / REVISED BY: CHECKED BY: APPROVED BY: S. DANNELLEY B. SMART S. MILLER FILENAME: PS73780C.DOC PRODUCT SPECIFICATION 3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS AS-73642-9998 AS-73656-1998 AS-73670-9996 AS-73670-9997 AS-73670-9998 Application Specification HDM Compliant Backplane Connectors Application Specification HDM Compliant BP Power Modules Application Specification HDM Compliant Terminal Performance Application Specification HDM Backplane and Daughtercard Trace Routing Guidelines Application Specification HDM Compliant and Solder Tail Daughtercard Connectors Refer to the appropriate sales drawings and other sections of this specification for the necessary referenced documents and specifications. 4.0 RATINGS 4.1 CURRENT Signal Contact: Power: Midplane Power: 1 Amp 15 Amps per blade at 30°C rise from ambient temperature 11 Amps per blade at 30°C rise from ambient temperature 4.2 VOLTAGE Signal Contact: Power Contact: 250VAC 500VAC 4.3 TEMPERATURE RANGE Operating: -55°C to 105°C Non-operating: -55°C to 85°C 4.4 CONTACT WIPE LENGTH REVISION: F 5.0mm Backplane Pin 1.75mm 5.5mm Backplane Pin 2.25mm 6.0mm Backplane Pin 2.75mm Short Power Blade 3.75mm Medium Power Blade 4.75mm Long Power Blade 5.75mm ECR/ECN INFORMATION: EC No: UCP2009-1724 DATE: 2009/05/01 DOCUMENT NUMBER: PS-73780-999 TITLE: PRODUCT SPECIFICATION FOR HIGH DENSITY METRIC (HDM) INTERCONNECT SYSTEM (MIDPLANE & STACKING) SHEET No. 3 of 7 CREATED / REVISED BY: CHECKED BY: APPROVED BY: S. DANNELLEY B. SMART S. MILLER FILENAME: PS73780C.DOC PRODUCT SPECIFICATION 5.0 PERFORMANCE 5.1 ELECTRICAL PERFORMANCE REVISION: F ITEM TEST CONDITION REQUIREMENT CONTACT RESISTANCE (LOW LEVEL) Mated, 100mA max, 20mV per EIA-364-TP-23 10 milliohm maximum change INSULATION RESISTANCE Unmated, 500VDC per EIA-364-TP-21 Initial: 5000 megohms minimum Final: 1000 megohms minimum DIELECTRIC WITHSTANDING VOLTAGE Unmated, 1500VAC for signal, 2000VAC for power, per EIA-364-TP-20 No breakdown or flashover SIGNAL CONTINUITY Mated per EIA-364-TP-87 No interrupts greater than 10 nanoseconds COMPLIANT PIN INTERFACE RESISTANCE Contact inserted into PCB per EIA-364-TP-23 1 milliohm maximum ECR/ECN INFORMATION: EC No: UCP2009-1724 DATE: 2009/05/01 DOCUMENT NUMBER: PS-73780-999 TITLE: PRODUCT SPECIFICATION FOR HIGH DENSITY METRIC (HDM) INTERCONNECT SYSTEM (MIDPLANE & STACKING) SHEET No. 4 of 7 CREATED / REVISED BY: CHECKED BY: APPROVED BY: S. DANNELLEY B. SMART S. MILLER FILENAME: PS73780C.DOC PRODUCT SPECIFICATION 5.2 MECHANICAL PERFORMANCE ITEM TEST CONDITION REQUIREMENT MATING FORCE Mate daughtercard and backplane assembly per EIA-364-TP-13 0.6N per signal pin 1.3N per power blade (nominal values) DURABILITY 250 Cycles, mated and unmated per EIA-364-TP-09 10 milliohm max change in LLCR VIBRATION Mated, 10-100Hz, 10g’s, 24 hr, 3 axis per EIA-364-TP-28 10 milliohm max change in LLCR MECHANICAL SHOCK Mated, 30g half-sine, 11ms, 3 axis per EIA-364-TP-27 10 milliohm max change in LLCR NORMAL FORCE/ SPRING RATE Apply perpendicular force to terminal at rate of 25+/-6mm per minute Signal: 0.5N (50 g) min Spring rate: 12.5g/mil deflection (nominal) Power: 1.0N (100 g) min GUIDE PIN STRENGTH Apply perpendicular force to guide pin tip at rate of 12.7+/-6mm per minute. Record force at 1mm pin displacement Guide pin in plastic housing: 75N (nominal value) REVISION: F ECR/ECN INFORMATION: EC No: UCP2009-1724 DATE: 2009/05/01 DOCUMENT NUMBER: PS-73780-999 TITLE: PRODUCT SPECIFICATION FOR HIGH DENSITY METRIC (HDM) INTERCONNECT SYSTEM (MIDPLANE & STACKING) SHEET No. 5 of 7 CREATED / REVISED BY: CHECKED BY: APPROVED BY: S. DANNELLEY B. SMART S. MILLER FILENAME: PS73780C.DOC PRODUCT SPECIFICATION 5.3 ENVIRONMENTAL PERFORMANCE REVISION: F ITEM TEST CONDITION REQUIREMENT THERMAL SHOCK Mated, 5 cycles from -55°C to 85°C per EIA-364-TP-32 10 milliohm max change in LLCR TEMPERATURE LIFE Mated, +105°C for 1000 hours per EIA-364-TP-17 10 milliohm max change in LLCR HUMIDITY Mated, 600 hours from +25°C to +65°C per EIA-364-TP-31 10 milliohm max change in LLCR DUST Unmated per EIA-364-TP-50 10 milliohm max change in LLCR MIXED FLOWING GAS 10 days unmated, 10 days mated, per EIA-364-TP-65 and ASTM B827 10 milliohm max change in LLCR ECR/ECN INFORMATION: EC No: UCP2009-1724 DATE: 2009/05/01 DOCUMENT NUMBER: PS-73780-999 TITLE: PRODUCT SPECIFICATION FOR HIGH DENSITY METRIC (HDM) INTERCONNECT SYSTEM (MIDPLANE & STACKING) SHEET No. 6 of 7 CREATED / REVISED BY: CHECKED BY: APPROVED BY: S. DANNELLEY B. SMART S. MILLER FILENAME: PS73780C.DOC PRODUCT SPECIFICATION 6.0 TEST SEQUENCE Bellcore Test Plan GROUP 1 GROUP 2 GROUP 3 GROUP 4 GROUP 5 Visual Exam Visual Exam Visual Exam Visual Exam Visual Exam Separation Force Mate/Unmate Forces Mate/Unmate Forces Separation Force Mate/Unmate Forces LLCR/CPIR Normal Force LLCR/CPIR LLCR/CPIR LLCR/CPIR Durability (100 cycles) Plating Thickness Durability (100 cycles) Thermal Shock Temperature Life Mate/Unmate Forces Porosity Separation Force Humidity LLCR/CPIR LLCR LLCR LLCR/CPIR Separation Force Mate/Unmate Forces MFG (10 days Unmated) Dust Mate/Unmate Forces Visual Exam LLCR (After 5 & 10 days) LLCR Visual Exam Normal Force MFG (10 days Mated) Vibration (3 axis) Normal Force LLCR (After 5 & 10 days) LLCR Disturbance Mechanical Shock (3 axis) LLCR LLCR/CPIR Durability (100 cycles) Separation Force Mate/Unmate Forces LLCR/CPIR Visual Exam Visual Exam Normal Force Normal Force LLCR = Low Level Contact Resistance CPIR = Compliant Pin Interface Resistance REVISION: F ECR/ECN INFORMATION: EC No: UCP2009-1724 DATE: 2009/05/01 DOCUMENT NUMBER: PS-73780-999 TITLE: PRODUCT SPECIFICATION FOR HIGH DENSITY METRIC (HDM) INTERCONNECT SYSTEM (MIDPLANE & STACKING) SHEET No. 7 of 7 CREATED / REVISED BY: CHECKED BY: APPROVED BY: S. DANNELLEY B. SMART S. MILLER FILENAME: PS73780C.DOC