0780011244

PRODUCT SPECIFICATION Reverse Right Angle Mini DIMM, 200 / 244 Ckt 0.60mm pitch SMT 1.0 SCOPE This Product Specification covers the performance requirements of the 0.60 mm centerline edge card socket for board to board interconnect of 1.00 mm thick memory modules. 2.0 PRODUCT DESCRIPTION 2.1 PRODUCT NAME AND SERIES NUMBER (S) Product Descriptions 200/244 Ckt Reverse Right Angle Mini DIMM Series Number 78001 2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS See the appropriate Sales Drawings for information on dimensions, materials, plating and markings, recommended module outlines and footprint Specifications. 2.3 SAFETY AGENCY APPROVALS UL File CSA File : : E29179 1699020 (LR 19980) REVISION: ECR/ECN INFORMATION: TITLE: B EC No: S2007-1019 DATE: 2007/05/17 DOCUMENT NUMBER: PS-78001-001 Reverse Right Angle Mini DIMM, SMT Connector 200/244Ckt, 0.60mm Pitch SHEET No. 1 of 6 CREATED / REVISED BY: CHECKED BY: APPROVED BY: CM TEO 2007/05/17 YT YANG 2007/05/25 SH LENI 2007/05/25 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS The following documents are part of this specification between the requirements of this specified herewith. In the event of conflict between the requirements of this specification and the product drawings, the product drawings shall take precedence. In the event of conflict between the requirements of this specification and reference documents, this specification shall take precedence. 4.0 RATINGS 4.1 VOLTAGE 30 VRMS at 60 Hz 4.2 CURRENT 1.0 Amps at 30°C Temperature Rise 4.3 TEMPERATURE Operating Temperature: -55°C to +85°C 5.0 PERFORMANCE 5.1 ELECTRICAL REQUIREMENTS ITEM DESCRIPTION TEST CONDITION 1 Contact Resistance (Low Level) Mate connectors: apply a maximum voltage of 20 mV and a current of 100 mA. EIA-364-23 50 mΩ maximum at initial 10 mΩ maximum change from initial 2 Temperature Rise at rated current Temperature of mater connector at rated current for 96 hours (6 consecutive ckts link in series) 1.0 Amps per contact at a maximum of 30°C temperature rise 3 Insulation Resistance Unmate & unmount connectors: apply a voltage of 500 VDC between adjacent terminals and between terminals to ground. EIA-364-21 1000 Mega Ω minimum 4 Dielectric Withstanding Voltage Apply 500 VAC for 1 minute between adjacent terminals of an unmated connector. No breakdown or flashover EIA-364-20 REVISION: ECR/ECN INFORMATION: TITLE: B EC No: S2007-1019 DATE: 2007/05/17 DOCUMENT NUMBER: PS-78001-001 REQUIREMENT Reverse Right Angle Mini DIMM, SMT Connector 200/244Ckt, 0.60mm Pitch SHEET No. 2 of 6 CREATED / REVISED BY: CHECKED BY: APPROVED BY: CM TEO 2007/05/17 YT YANG 2007/05/25 SH LENI 2007/05/25 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 5.2 MECHANICAL REQUIREMENTS ITEM 5 DESCRIPTION Vibration 6 Shock (Mechanical) 7 Durability 8 Module Insertion Force (w/ Latches) TEST CONDITION Amplitude : 1.52mm peak to peak Sweep : 10-55-10 Hz in one min. Duration : 2 hrs each on XYZ axis Module weight: 15g for 244Ckt and 13g for 200Ckt. EIA 364-28 Mate connectors and shock at 30 g’s with half -sine waveform for 11 milliseconds, 3 shocks in each perpendicular axis (18 shocks total). Module weighted : 15g for 244Ckt and 13g for 200Ckt. No change in LLCR greater than 10mΩ from initial. Discontinuity : No greater than 1.0 micro sec. No change in LLCR greater than 10mΩ from initial. Discontinuity : No greater than 1.0 micro sec. Mate and unmated connectors up to 25 cycles No change in LLCR greater at a maximum rate of 10 cycles per minute. than 10 mΩ from initial. Reseating to be done for 3 cycles. Insert a 1.00 mm thick Module(0.10x0.10 mm chamfer) at a rate of 25 ± 6mm (1 ± ó inch) per minute. See Sales drawing for PCB/ Module details. Total insertion force not to exceed : 195.0 N (43.73lbs) for 200 ckt 238.0 N (53.37lbs) for 244 ckt Apply a pulling force on module card at a rate of 25 ± 6 mm/min. (1 ± ¼ inch) with 35.0 N (7.85lbs) min. recommended test module as per sales retention force of the module drawing, inserted into connector with latches in connector with no damage closed. 9 Module Rip Out Force 10 Latch Actuation Force Apply an actuation force on each latch at a rate of 25 ± 6 mm/ min (1 ± ¼ inch) with recommended test module as per sales drawing inserted into connector. The force to fully actuate the latch open shall be 35 N (7.85 lbs) max. per latch. 11 Latch Overstress Force Apply an actuation force on each latch at a rate of 25 ± 6 mm / min (1 ± ¼ inch) in the fully open position. 35 N (7.85 lbs) min force with no damage. 12 Terminal Retention Force Axial pullout force on the terminal in the housing at a rate of 25 ± 6 mm (1 ± ¼ inch) per minute. 3 N minimum REVISION: ECR/ECN INFORMATION: TITLE: B REQUIREMENT EC No: S2007-1019 DATE: 2007/05/17 DOCUMENT NUMBER: PS-78001-001 Reverse Right Angle Mini DIMM, SMT Connector 200/244Ckt, 0.60mm Pitch SHEET No. 3 of 6 CREATED / REVISED BY: CHECKED BY: APPROVED BY: CM TEO 2007/05/17 YT YANG 2007/05/25 SH LENI 2007/05/25 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 5.3 ENVIRONMENTAL REQUIREMENTS ITEM DESCRIPTION 13 Shock (Thermal) 14 Thermal Aging 15 Cyclic Temperature & Humidity 16 Solderability 17 Porosity 18 Solvent Resistance 19 Resistance to Soldering Heat Test TEST CONDITION Mate connectors; expose to 5 cycles of: Duration (Minutes) Temperature °C -55 +0/-3 30 +25 +10/-5 5 MAXIMUM +85 +3/-0 30 +25 +10/-5 5 MAXIMUM EIA-364-32-Test condition l Mate connectors and expose to 500 hours at 105 ± 2°C. Per EIA-364-17 Preconditioning to be done at 105°C for 72 hrs Mate connectors and expose for 10 days at 25°C to 65°C at 90-98% RH. Per EIA-364-31, Method III. Solder time: 5±0.5 seconds. Solder temperature: 260±5°C Subject to steam aging for 8 hours ± 5 mins. B S2007-1019 DATE: 2007/05/17 DOCUMENT NUMBER: PS-78001-001 No change in LLCR greater than 10 mΩ from initial. No change in LLCR greater than 10 mΩ from initial. No change in LLCR greater than 10 mΩ from initial. Solder coverage: 95% minimum Nitric Acid Test, 10 contacts per contact type Maximum number of pores : selected at random. 30uin-1 pore per 10 contacts Per EIA 364-53 42 parts DI water by volume, 1 part of propylene glycol monomethyl ether (Glycolether PM, 1 methoxy-2-propanol). 1 part by volume of monoethanolamine. MIL – STD – 202F Method 215J. No Damage or discoloration of connector materials or marking. Unmated, exposed to reflow profile as defined No Damage or blistering. in Section 8.1. REVISION: ECR/ECN INFORMATION: TITLE: EC No: REQUIREMENT Reverse Right Angle Mini DIMM, SMT Connector 200/244Ckt, 0.60mm Pitch SHEET No. 4 of 6 CREATED / REVISED BY: CHECKED BY: APPROVED BY: CM TEO 2007/05/17 YT YANG 2007/05/25 SH LENI 2007/05/25 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 6.0 TEST SEQUENCE Test Description Sequence Contact Resistance 1 1 9 3 5 7 2 1 3 5 3 1 4 6 8 4 Test Group 6 7 5 8 9 10 Temperature Rise 11 12 1 1 5 2 6 Insulation Resistance Dielectric Withstand Voltage Vibration 6 Mechanical Shock 8 Durability (5X) pre-cond. 2 Durability (25X) 2 Module Insertion Force 1 Module Ripout Force 2 Latch Actuation Force 1 Latch Overstress Force 2 Thermal Shock Thermal Aging 105°C – 500hrs 3 3 5 4 2 Cyclic Temp & Humidity Plating thickness 1 Solderability 1 Porosity 1 Solvent Resistance 1 Terminal Retention Force 1 3 Resistance to Soldering Heat 2 Temp life (pre-conditioning) 105°C – 72hrs 4 Reseating (3X) Sample Size per Test Group 5 4 7 5 5 5 5 5 5 5 5 5 5 5 7.0 PACKAGING Parts shall be packed in trays and protected against damage during handling, transportation and storage. REVISION: ECR/ECN INFORMATION: TITLE: B EC No: S2007-1019 DATE: 2007/05/17 DOCUMENT NUMBER: PS-78001-001 Reverse Right Angle Mini DIMM, SMT Connector 200/244Ckt, 0.60mm Pitch SHEET No. 5 of 6 CREATED / REVISED BY: CHECKED BY: APPROVED BY: CM TEO 2007/05/17 YT YANG 2007/05/25 SH LENI 2007/05/25 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 8.0 OTHER INFORMATIONS 8.1 Reflow Profile. 260 +0/-5°C 260 250 C Notes : 1. Reflow solder Preheat at 3°C/s to 150°C. 2. Reflow at 250°C for 30s per figure. 3. Peak to be at 260 +0/-5°C. 4. Component must withstand (2) reflow solder cycles with a cool down between. REVISION: ECR/ECN INFORMATION: TITLE: B EC No: S2007-1019 DATE: 2007/05/17 DOCUMENT NUMBER: PS-78001-001 Reverse Right Angle Mini DIMM, SMT Connector 200/244Ckt, 0.60mm Pitch SHEET No. 6 of 6 CREATED / REVISED BY: CHECKED BY: APPROVED BY: CM TEO 2007/05/17 YT YANG 2007/05/25 SH LENI 2007/05/25 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC