Camera Sockets for
Serial and Parallel
Data Applications
Accelerate state-of-the-art camera module developments
with feature-packed camera socket solutions for serial
and parallel data applications
The absence of a camera socket industry standard led to compatibility
issues that made component sourcing and matching difficult. The release
of the SMIA specification addressed standardization issues, made multiple
sourcing easier and shortened design cycles.
Molex unveiled a class of SMT, SMIA-compliant sockets for serial data
applications. These space-saving and high reliability sockets support ultraslim mobile phone, tablet PC and vision system applications. Available in
through-board and on-board mounting styles, they meet a variety of design
requirements including low-profile (space-constrained), single-side PCB,
compact footprint and more.
Complementing these are parallel data sockets available in side or bottomcontact, on-board or through-board mounting. These sockets feature a
characteristically higher pin count than serial versions and can also come
in a variety of X-Y (camera module) dimensions; housing and shell features;
and mounting styles. An example is the 34-circuit, 8.50 by 9.50mm series
105199 socket which comes with side-contacts and on-board mounting
configuration.
Molex offers sockets in both on-board (105028-1001) and through-board
(105028-2001) versions for series 105028.
Molex is also ready to assist customers with customized socket solutions if
needed.
For more information visit our website at:
www.molex.com/product/camerasocket.html
Serial data (SMIA*compliant) sockets, SMT
Bottom Contact:
78725 SMIA85,
Through-board
105163 SMIA65,
Through-board
105167 SMIA65, On-board
105168 SMIA75,
Through-board
105190 SMIA75, On-board
105200 SMIA55,
Through-board
Parallel data (non-SMIAcompliant) sockets, SMT
Bottom Contact:
78499 6.50 by 6.50mm,
On-board
Side Contact:
47337 8.50 by 8.50mm,
Through-board
105199 8.50 by 9.50mm,
On-board
105028 8.50 by 8.50mm,
On-board and
Through-board
Camera Sockets for Serial and Parallel
Data Applications
Features and Benefits
Serial Data (SMIA-compliant) Sockets
SMIA-compliant sockets
Eliminate compatibility issues when used with non-standard camera modules
For faster and easier camera module selection by mobile phone makers using
PCB-to-socket footprint matching
Anti-short housing wall design
Prevents electrical shorting between socket terminals and the base metal shell
Dimpled terminal design
For added contact reliability between camera socket and module
Dual locking latches on socket
Position and secure the camera module to socket
Bottom-contact styles
Meet common module requirements based on latest trends
Parallel Data (non-SMIA-compliant) Sockets
Side-contact options (series
47337, 105028 and 105199)
Requires zero height between housing base and camera base
Better contact force of (typically) 0.35N when mated
Higher pin-count
Supports additional features and functionality built into camera modules
Wide range of socket designs
Expand configuration possibilities for customized camera applications
*S
MIA stands for Standard Mobile Imaging Architecture (SMIA) and is a royalty-free, open standard specification developed jointly
by Nokia Corporation, ST Microelectronics NV and their licensors. Its purpose is to standardize functional and optical aspects of
camera modules and allow mobile handset vendors to work with multiple suppliers in cost-efficient module sourcing.
Camera Sockets for
Serial and Parallel
Data Applications
Specifications - Serial Data Versions
Reference Information
Packaging: Tape-and-reel
Mates with: Camera modules
Designed In: mm
RoHS: Yes
Halogen Free: Yes
Glow Wire Compliant: No
Electrical
Voltage (max.):
10V DC (Series 78725, 105168);
50V DC (others)
Current (max.): 0.5A per contact
Contact Resistance:
60milliohms (78725, 105167,
105168, 105190, 105200)
80milliohms (105163)
Dielectric Withstanding Voltage
(1 min.):
500VAC (RMS) (78725, 105190)
150VAC (RMS) (105163, 105167,
105200)
Insulation Resistance (min.):
400 Megohm (105163, 105167);
100 Megohm (others)
SMIA55,
5.50 by 5.50mm,
14 circuits
Through-board,
3.78mm height
(Series 105200)
SMIA65,
6.50 by 6.50mm,
12 circuits
Through-board,
3.10mm height
(Series 105163)
Mechanical
Contact Force at max. deflection of
contact spring (max.):
0.70N (105167, 105168, 105190)
Contact Force at min. deflection of
contact spring (min.):
0.2N (78725, 105167, 105168,
105200)
Module Insertion Force (min.):
15N (78725, 105190); 10N
(105167, 105168, 105200)
Module Locking Force (min.):
15N (78725, 105168, 105190,
105200); 12N (105167)
Durability (cycles min.):
30 (78725, 105168, 105190);
20 (105163, 105167, 105200)
SMIA65,
6.50 by 6.50mm,
12 circuits
On-board,
4.50mm height
(Series 105167)
SMIA75,
7.50 by 7.50mm,
16 circuits
On-board,
4.00mm height
(Series 105190)
Physical
Housing:
High temperature thermoplastic,
black, UL94-V0
Contact:
Phosphor Bronze Alloy (105190);
Copper Alloy (others)
Plating:
Contact Area — 0.30μm (12μ”)
Gold (Au)
Solder Tail Area — Gold (Au) Flash
Underplating — 2.0μm (80μ”)
Nickel (Ni) overall
Operating Temperature:
-30 to +85°C
(78725, 105168, 105200)
-55 to +85°C
(105163, 105167, 105190)
SMIA75,
7.50 by 7.50mm,
16 circuits
Through-board,
4.20mm height
(Series 105168)
SMIA85,
7.50 by 7.50mm,
18 circuits
Through-board,
5.25mm height
(Series 78725)
Ordering Information - Serial Data Versions
Order No.
SMIA Classification
Circuits
Socket Height (mm)
Module Dimensions (mm)
Mounting Style
105200-0008
SMIA55
14
3.78
5.50 by 5.50
Through-board
SMIA65
12
105167-0001
4.50
105163-1001
On-board
6.50 by 6.50
3.10
105190-0001
Through-board
4.00
SMIA75
16
105168-0601
On-board
7.50 by 7.50
4.20
Through-board
78725-1002
SMIA85
18
5.25
8.50 by 8.50
Camera Sockets for
Serial and Parallel
Data Applications
Specifications - Parallel Data Versions
Reference Information
Packaging: Tape-and-reel
Mates with: Camera modules
Designed In: mm
RoHS: Yes
Halogen Free: Yes
Glow Wire Compliant: No
Electrical
Voltage (max.): 50V DC
Current (max.): 0.5A DC per contact
Contact Resistance:
60milliohms (47337, 105028)
80milliohms (78499, 105199)
Dielectric Withstanding Voltage
(1 min.):
500VAC (RMS) (105199)
150VAC (RMS) (47337, 78499,
105028)
Insulation Resistance (min.):
100 (78499); 400 (47337, 105028);
1000 Megaohm (105199)
6.50 by 6.50mm, SMT,
On-board, 24 circuits
Bottom Contact,
3.50mm height
(Series 78499)
Mechanical
Terminal / Housing Retention Force
(min.):
0.49N (105199); 1.0N (47337,
78499, 105028)
Durability (cycles min.):
5 (78499); 20 (105199, 105028);
30 (47337)
Physical
Housing:
High temperature thermoplastic,
white (105199),
black (others), UL94-V0
Contact: Copper Alloy
Plating:
Contact Area — 0.30μm (12μ”)
Gold (Au)
Solder Tail Area — Gold (Au) Flash
Underplating — 2.0μm (80μ”)
Nickel (Ni) overall
Operating Temperature:
-30 to +85°C (105199)
-55 to +85°C
(47337, 78499, 105028)
8.50 by 8.50mm, SMT,
Through-board,
24 circuits
Side Contact,
4.20mm height
(Series 47337)
8.50 by 8.50mm, SMT,
Through-board,
32 circuits
Side Contact,
5.25mm height
(Series 105028)
8.50 by 8.50mm,
SMT, On-board,
32 circuits
Side Contact,
4.20mm height
(Series 105028)
8.50 by 9.50mm,
SMT, On-board,
34 circuits
Side Contact,
4.28mm height
(Series 105199)
Ordering Information - Parallel Data Versions
Order No.
Module Dimensions (mm)
Circuits
Socket Height (mm)
Contact Style
78499-0002
6.50 by 6.50
24
3.50
Bottom contact
Mounting Style
On-board
105028-1001
4.20
32
105028-2001
8.50 by 8.50
5.25
Side contact
47337-0001
105199-0001
8.50 by 9.50
24
4.20
34
4.28
Through-board
On-board
Camera Sockets for
Serial and Parallel
Data Applications
Product Features - Mounting Configurations
Vertical space savings
Shell
Housing
PCB
Top and bottom
shell of socket
Terminals
Typical on-board
(top-mount) style socket
Typical through-board
(mid-mount) style socket
On-board (top-mount) and Through-board (mid-mount) style features and advantages
On-board style mounting
(Serial data: Series 105167, 105190;
Parallel data: Series 78499, 105028 and 105199)
Through-board style mounting
(Serial data: Series 78725, 105163, 105168, 105200;
Parallel data: Series 47337, 105028)
Occupies only single side of the PCB, frees up
the entire opposite side for other uses
Occupies both sides of the PCB but frees up
vertical space above PCB for other uses
Comprises fewer components
(housing, terminals and metal shell)
Includes more components
(housing, terminals, top and bottom shells)
Increases overall mobile phone height
Greater vertical space-saving with its lower profile height;
excellent for ultra-slim applications
Product Features - Contact Styles
Module pads are located
at the sides of the
camera module
Side-contact camera socket
Module pads located at
the bottom of the
camera module
Bottom-contact camera socket
Advantages of side- and bottom-contact style camera sockets
Side-contact style
(Parallel data: Series 47337, 105028, 105199)
Bottom-contact style
(Serial data: Series 78725, 78499, 105163,
105167, 105168, 105190, 105200)
Zero height
Height between housing and camera base (~ 0.25mm)
Better contact force (~ 0.35N)
Contact force (~ 0.25N)
Specially designed camera module
Common camera module design
Non market trend
Market trend
Product Features - Dual Locking Latches
Housing wall
Camera module ‘shoulders’
Bottom contact terminal
Dual-locking latches feature a 0.12mm height difference to
accommodate the camera module’s ‘shoulders’ (zoom-in). By locking
the module to the socket in the correct position, it ensures proper
mechanical and electrical contact is maintained during operation
Dual locking latches on the socket wall for precise positioning and securing of mated module
Camera Sockets for
Serial and Parallel
Data Applications
Product Features - Anti-Short Housing Wall Feature
(SMIA-Compliant Versions Only)
Molex’s anti-short housing wall feature prevents shorting of the socket’s
bottom contacts with the metal shell particularly during mating with the
camera module. This feature is vital as it protects the costly investments of
mobile phone, camera module and other user-applications
Downward pressure of
camera module during
insertion depresses the
socket’s bottom
terminals
Bottom terminals of the camera socket
Fully deflected socket terminal
An anti-shorting feature blocks the bottom terminals
from contacting the socket’s bottom metal shell
Metal shell of socket
Cross-section illustration of an anti-shorting feature in Molex’s SMIA-compliant camera sockets
Product Features - Dimpled Contact Design
•M
olex’s dimpled terminal design
has been tested to demonstrate
the ability in accepting maximum
stress levels (measured in Mega
Pascal) compared with variant
designs. This feature is important
as the terminal’s reduced contact
radius, width and area provides
higher contact pressure between
camera module and socket
terminals for improved contact
reliability
•G
old-plated contacts with
their excellent electrical and
mechanical qualities offer even
higher contact integrity. All
Molex’s dimpled contacts are goldplated
Dimple
Socket terminal
Dimpled design of Molex’s SMIA-compliant camera socket terminals
Terminal designs
Contact height
(Nominal)
Contact force
(Nominal)
Non-dimpled
Dimpled
Crowned
Stress
(Pa = Pascals)
~80MPa
0.70+/-0.10mm
30gf
~350MPa
~180MPa
Camera Sockets for
Serial and Parallel
Data Applications
Unique Design Features - SMIA85 Camera Socket
Side view socket showing mounting tab
features for low-profile applications
bottom
contact design
pick-and-place
area
key-slot
feature
Bottom view of socket showing
contacts hidden beneath
protective shell extension for
excellent EMI shielding
Top view of socket showing key-slot
feature and pick-and-place zone
Unique mounting and low-profile features of the through-board style (series 78725)
SMIA85 camera socket
Typical Parallel Data Camera Socket Features
8 circuits on each side
and the opposite
Side contact
design
8 circuits on each side
and the opposite
Top view of series 105028 camera socket
showing high (32) circuit count
Isometric view of series 105028
camera socket
Camera Sockets for
Serial and Parallel
Data Applications
Applications
Consumer
– Camera phones
– Tablet PCs
–P
hablets (a larger category of
smart phones that combines the
functionality of smart phones
with those of tablets)
– Game cameras
– Pinhole cameras
–W
ebcams (notebook and PC
monitors)
Surveillance camera
Industrial
–S
urveillance (Internet protocol)
and security cameras
– Traffic cameras
– Industrial cameras
– Remote or trail cameras
GPS navigator with digital camera
Automotive
–G
PS navigator with digital
camera
Smartphone and tablet PC devices
Webcam on notebook
Selection Matrix
Termination
Styles
Socket Height
(mm)
Serial Data (SMIA-compliant)
Sockets
Bottom Contact
(Module dimensions in mm)
Parallel Data (non-SMIA-compliant) Sockets
Side Contact
(Module dimensions in mm)
3.50
4.00
SMT (on-board)
SMT
(through-board)
(known also as
midmount
or sink-type
Bottom Contact
(Module dimensions in mm)
78499-0002 (6.50 by 6.50)
105190-0001 (7.50 by 7.50)
4.20
105028-1001 (8.50 by 8.50)
4.28
105199-0001 (8.50 by 9.50)
4.50
105167-0001 (6.50 by 6.50)
3.10
105163-1001 (6.50 by 6.50)
3.78
105200-0008 (5.50 by 5.50)
4.20
105168-0601 (7.50 by 7.50)
47337-0001 (8.50 by 8.50)
5.25
78725-1002 (8.50 by 8.50)
105028-2001 (8.50 by 8.50)
www.molex.com/product/camerasocket.html
Order No. 987650-9341
Printed in USA/KC/2012.07
©2012 Molex
