0787261002

DDR4 DIMM Sockets, Halogen-free Angled, Ultra Low-Profile, Aerodynamic and Standard versions Angled, Ultra Low-profile, Aerodynamic and Standard DDR4 DIMM sockets combine excellent performance with maximum space-savings and assembly processing for high-speed data and networking applications Features and Benefits 25° angle inclination to the horizontal (Angled version) Gives up to 45% vertical space savings over Standard vertical versions Ultra-low seating plane of 1.10mm (Ultra low-profile version) Frees up vertical module space to allow use of highdensity DIMMs while maintaining the same design height; Enables the use of very low-profile modules with seating heights below 2.80mm (maximum) in ATCA* blade systems Lower current of 0.75A per terminal compared to 1.0A for ULP DDR3 DIMM versions For bigger energy cost savings Streamlined housing and latch design (Aerodynamic series) Minimizes trapping of hot air around high-density memory modules during operation Metal-reinforced latch tower housing (Angled, Aerodynamic and Standard series) Prevents cleavage or separation of tower bridge due to wear and tear Multiple soldertail length options available for Throughhole and Press-fit sockets (Aerodynamic and Standard series) To suit various PCB thicknesses Flush soldertail design for SMT socket (Standard series only) Minimizes accidental damage to terminals due to bending Anti-stubbing mating contacts (All series) Provide smooth module lead-in and contact grip during insertion From left: Standard, Aerodynamic and Ultra Low-Profile DDR4 DIMM Sockets 25°-Angled DDR4 DIMM Socket Applications Data/Computing High-end computing Personal computers RAID / Storage Telecommunications/Networking Infrastructure Networking Servers Data Centers Product Name Product Description, or series list Specifications Reference Information Packaging: Tray UL File No.: E29179 (78860) CSA File No.: TBA Use With: JEDEC MO-309 memory modules Designed In: Millimeter RoHS: Yes Halogen Free: Yes Glow Wire Compliant: No Electrical Voltage (max.): 29V AC (RMS)/DC Current (max.): 0.75A per pin Low Level Contact Resistance (max.): 12 (78860); 20 (151080); 10 milliohms (others) Dielectric Withstanding Voltage: 500V AC Insulation Resistance (min.): 1 megohm Mechanical Module Insertion Force (with latches): 106.8N max Module Rip-out Force (min.): 9.10kgf Compliant-pin Insertion Force to PCB (single): 4.50kgf max.(78731, 151024) Compliant-pin Retention Force to PCB (single): 0.30kg min. (78731, 151024) Module Unmating Force: 2.02kgf Terminal Retention Force (min.): 300gf (per pin); 13.3N (per forklock for 78860, 151016 only) Latch Actuation Force (max.): 3.50kgf per latch Durability: 25 cycles Physical Housing: Halogen-free, high-temperature Nylon, glass-filled, UL94V-0 (both socket and latch) Contact: Copper Alloy Plating: Refer to Sales Drawing PCB Thickness: Refer to Sales Drawings Operating Temperature: -55 to +85°C Ordering Information Series No. Style Termination 151080 Angled 25° Through-hole 78860 Ultra Low-Profile Through-hole 151016 151024 Aerodynamic 78726 78730 Through-hole Press-fit Through-hole Standard 78731 SMT Press-fit www.molex.com/link/ddr4.html Order No. 987650-9721 Rev. 6 Printed in USA/KC/2015.06 ©2015 Molex