0877592650

0877592650

  • 厂商:

    MOLEX10(莫仕)

  • 封装:

    SMD

  • 描述:

    排针 间距:2mm 2x13P SMT

  • 详情介绍
  • 数据手册
  • 价格&库存
0877592650 数据手册
This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0877592650 Active milligrid 2.00mm (.079") Pitch Milli-Grid™ Header, Surface Mount, Vertical, 26 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free Documents: 3D Model Drawing (PDF) Product Specification PS-87761-100 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification UL General Product Family Series Application Overview Product Name PCB Headers 87759 Board-to-Board milligrid Milli-Grid™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Mated Height (in) Mated Height (mm) Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PCB Locator PCB Retention Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Polarized to Mating Part Polarized to PCB Shrouded Stackable Temperature Range - Operating Termination Interface: Style Yes 26 26 Black 100 No 94V-0 No No None None 0.150 In 3.80 mm Phosphor Bronze Gold Tin High Temperature Thermoplastic 2 Vertical Yes None Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 15 0.38 No No No Yes -55°C to +105°C Surface Mount Search Parts in this Series 87759Series Mates With 79107 Milli-Grid™ Receptacle, Vertical, Through Hole. 79108 Milli-Grid™ Flex-toBoard, Vertical Receptacle. Milli-Grid™ Receptacle, Surface Mount. 79109. 87381 Electrical Current - Maximum per Contact Voltage - Maximum 2A 125V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 10 Reflow Capable (SMT only) 3 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-89990-475 PS-87761-100 SD-87759-113 This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0877592650
1. 物料型号: - 型号:0877592650 - 状态:Active(活跃)

2. 器件简介: - 描述:2.00mm (.079") Pitch Milli-Grid™ Header, Surface Mount, Vertical, 26 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free(2.00毫米(.079英寸)间距的Milli-Grid™ 插座,表面贴装,垂直型,26路,0.38微米(15微英寸)金(Au)选择性镀层,带有压配合塑料插销,无铅) - 应用:Board-to-Board(板对板)

3. 引脚分配: - 引脚数量:26(Circuits (Loaded))

4. 参数特性: - 颜色:黑色(Color - Resin) - 耐久性:100次(Durability (mating cycles max)) - 阻燃等级:94V-0(Flammability) - 金属材质:磷青铜(Material - Metal) - 镀层材质:金(Material - Plating Mating) - 镀层终止材质:锡(Material - Plating Termination) - 树脂材质:耐高温热塑性塑料(Material - Resin) - 行数:2(Number of Rows) - 方向:垂直(Orientation) - 间距:2.00mm(Pitch - Mating Interface (mm)) - 镀层厚度最小值:0.38微米(Plating min: Mating (um))

5. 功能详解: - 该产品支持断离功能(Breakaway:Yes) - 不支持首次配合/最后断离(First Mate / Last Break:No) - 不支持对配合部件的导向(Guide to Mating Part:No) - 未对配合部件进行键控(Keying to Mating Part:None) - 未对配合部件进行锁定(Lock to Mating Part:None) - 未对配合部件进行极化(Polarized to Mating Part:No) - 不支持堆叠(Stackable:Yes) - 操作温度范围:-55°C至+105°C(Temperature Range - Operating)

6. 应用信息: - 产品适用于板对板连接(Application:Board-to-Board) - 与79107 Milli-Grid™ Receptacle, Vertical, Through Hole等型号配合使用

7. 封装信息: - 封装类型:Tube(管装) - 引脚间距:2.00mm(Pitch - Term. Interface (mm)) - 表面贴装风格(Termination Interface: Style:Surface Mount)
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