0877822007

0877822007

  • 厂商:

    MOLEX10(莫仕)

  • 封装:

    SMD

  • 描述:

  • 详情介绍
  • 数据手册
  • 价格&库存
0877822007 数据手册
This document was generated on 04/09/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0877822007 Active 0.60mm (.024") Pitch miniDIMM DDR2 Socket, Vertical, SMT, 0.76µm (30µ") Gold (Au) over Nickel, 1.8V, with Pick and Place Cover, 244 Circuits, Type C Tray, Lead free Documents: 3D Model Drawing (PDF) Product Specification PS-87782-027 (PDF) RoHS Certificate of Compliance (PDF) Series Memory Module Sockets 87782 Latches in Off-White Color|With Cap Socket MO-244 MiniDIMM image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Comments Component Type JEDEC Outline Product Name Physical Circuits (Loaded) Color - Resin Durability (mating cycles max) Entry Angle Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin PCB Locator PCB Retention Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Temperature Range - Operating Termination Interface: Style 244 Black 25 Vertical (Top Entry) Yes Copper Alloy Gold Tin High Temperature Thermoplastic Yes Yes Tray 0.024 In 0.60 mm 0.024 In 0.60 mm 30 0.76 100 2.54 -55°C to +85°C Surface Mount Search Parts in this Series 87782Series Mates With JEDEC MO-244 Modules Electrical Current - Maximum per Contact Voltage - Maximum Voltage Key 1A 30V (RMS) 1.8V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 SMC & Wave Capable (TH only) 2 260 Material Info Reference - Drawing Numbers Product Specification Sales Drawing PS-87782-027 SD-87782-001 This document was generated on 04/09/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0877822007
1. 物料型号: - 型号:0877822007 - 状态:Active(活跃) - 描述:0.60mm (.024") 间距 miniDIMM DDR2 插座,垂直,SMT,0.76m (30") 金(镀镍上),1.8V,带取放盖,244路,C型托盘,无铅。

2. 器件简介: - 产品家族:Memory Module Sockets(内存模块插座) - 系列:87782 - 组件类型:JEDEC Outline Socket MO-244 - 产品名称:MiniDIMM

3. 引脚分配: - 引脚数量:244

4. 参数特性: - 电路(已加载):244 - 树脂颜色:黑色 - 耐用性(最大插拔次数):25次 - 进入角度:垂直(顶部进入) - 与配合部件的键控:是 - 金属材质:铜合金 - 镀层材质:金 - 镀层终止:锡 - 树脂材质:高温热塑性塑料 - PCB定位器:是 - PCB保持:是 - 包装类型:托盘 - 配合接口间距(英寸):0.024 In - 配合接口间距(毫米):0.60 mm - 终止接口间距(英寸):0.024 In - 终止接口间距(毫米):0.60 mm - 镀层最小:配合(微英寸):30 - 镀层最小:配合(微米):0.76 - 镀层最小:终止(微英寸):100 - 镀层最小:终止(微米):2.54 - 操作温度范围:-55°C至+85°C - 终止接口风格:表面贴装

5. 功能详解: - 最大电流每接触点:1A - 最大电压:30V(RMS) - 电压键:1.8V

6. 应用信息: - 与JEDEC MO-244模块配合使用

7. 封装信息: - 封装类型:Tray(托盘) - 配合接口间距:0.024英寸(0.60毫米)
0877822007 价格&库存

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