0878332620

厂商：
MOLEX10(莫仕)
封装：
-
描述：
HEADER SHRD RA/SLOT 26CKT

数据手册：

下载0878332620.pdf

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详情介绍
数据手册
价格&库存

0878332620 数据手册

This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0878332620 Active milligrid 2.00mm (.079") Pitch Milli-Grid™ Header, Right Angle, Shrouded, Lead-free, 26 Circuits, 0.38µm (15µ") Gold (Au) Plating, without PCB Locator, with Locking Windows, Center Polarization Slot, Tube Documents: 3D Model Drawing (PDF) Product Specification PS-87831-027 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series Agency Certification CSA UL LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Overview Product Name PCB Headers 87833 Wire-to-Board Contact Molex for application in automotive industry milligrid Milli-Grid™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Glow-Wire Compliant Guide to Mating Part Keying to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) No 26 26 Black 100 No 94V-0 No No None Yes Phosphor Bronze Gold Tin Nylon 2 Right Angle 0.085 In 2.16 mm No None 0.062 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 15 0.38 75 1.88 Search Parts in this Series 87833Series Mates With 50394 Wire-to-Board Terminals. 51110 Wire-to-Board Crimp Housing. 87568 Wireto-Board IDT Housings. 79107 Board-toBoard Top Entry Through Hole Receptacle. 79108 Board-to-Board FFC/FPC Top Entry Through Hole Receptacle. L Polarized to Mating Part Polarized to PCB Shrouded Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Side Slots (2) No Fully No Yes -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 2A 125V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 11 SMC & Wave Capable (TH only) 1 265 Material Info Reference - Drawing Numbers Product Specification Sales Drawing PS-87831-027 SD-87833-010 This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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0878332620

1. 物料型号： - 型号：0878332620

2. 器件简介： - 描述：2.00mm (.079") 间距 Milli-Grid™ 直角、带护套、无铅、26路、0.38m (15") 金 (Au) 镀层，无PCB定位器，带锁定窗口中心极化槽，管装。

3. 引脚分配： - 路数（已加载）：26 - 路数（最大）：26

4. 参数特性： - 颜色 - 树脂：黑色 - 耐用性（最大插拔次数）：100次 - 首次配对/最后断开阻燃性：无 - 94V-0：符合 - 灼热丝合规性：无 - 金属材质：磷青铜 - 镀层材质：金 - 镀层终止：锡 - 树脂材质：尼龙 - 行数：2 - 接口间距 - 配合界面 (in)：0.079 In - 接口间距 - 配合界面 (mm)：2.00 mm - 镀层最小 - 配合界面 (uin)：15 - 镀层最小 - 配合界面 (um)：0.38 - 镀层最小 - 终止 (uin)：75 - 镀层最小 - 终止 (um)：1.88

5. 功能详解： - 该产品为Wire-to-Board应用，与50394 Wire-to-Board Terminals、51110 Wire-to-Board Crimp Housing、87568 Wire-to-Board IDT Housings等产品兼容。

6. 应用信息： - 产品家族：PCB Headers - 系列：87833 - 应用：Wire-to-Board - 注：如需在汽车工业中应用，请联系Molex。

7. 封装信息： - 包装类型：管装 - PCB厚度推荐 (in)：0.062 In - PCB厚度推荐 (mm)：1.60 mm

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