0901310147

PRODUCT SPECIFICATION 2.54mm Pitch 3 Row Dual Wafer Through Hole Header 1.0 SCOPE This specification covers the performance requirements of the Molex C-Grid III product series for those products listed in Appendix 4. 2.0 PRODUCT DESCRIPTION 2.1 PRODUCT NAME AND SERIES NUMBER (S) See appropriate Sales drawings for information. 2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS See the appropriate Sales Drawings for information on dimensions, materials, plating and markings, recommended module outlines and footprint Specifications. 2.3 CONNECTOR SIZE Refer to the appropriate sales drawing for dimensional information and detail. 2.4 PCB / MODULE DIMENSIONS Refer to the appropriate sales drawing for PCB layout and dimensional. 2.5 SAFETY AGENCY APPROVALS UL File : E29179 3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS See sales drawings and any other sections of this specification for the relevant reference documents and specifications. In cases where this product specification differs from the product drawings, the product drawings take precedence. Crimp Specification 90119: See Application Specification AS-90119 90146: See Application Specification AS-90146 Product Class Definitions PLATING CLASS 1 2 3 4 FEMALE Tin 0.38um to 0.64um Gold 0.76um to 1.02um Gold 0.76um to 1.02um Gold MALE Tin 0.15um to 0.30um Gold 0.38um to 0.64um Gold 0.76um to 1.02um Gold REVISION: ECR/ECN INFORMATION: TITLE: Q2 EC No: S2012-0309 DATE: 2011/10/18 DOCUMENT NUMBER: PS-99020-0001 SHEET No. C-GRID III 1 of 9 CREATED / REVISED BY: CHECKED BY: APPROVED BY: SKANG 2011/10/18 ATSEE 2011/10/21 MLONG 2011/10/21 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 4.0 RATINGS 4.1 VOLTAGE Operating Voltage according to IEC 130-1: ≤ 350 V DC/AC 4.2 CURRENT Current Carrying Capacity: ≤3A 4.3 TEMPERATURE Operating Temperature: - unshrouded and shrouded headers and PCB connectors: -55°C to +125°C - crimp modules and housings: -55°C to +105°C Non-operating Temperature: - unshrouded and shrouded headers and PCB connectors: -55°C to +125°C - crimp modules and housings: -55°C to +105°C 5.0 PERFORMANCE 5.1 ELECTRICAL REQUIREMENTS ITEM DESCRIPTION Contact 5.1.1 Resistance (Low Level) TEST CONDITION REQUIREMENT Mate connectors: apply a maximum voltage of 20mV and a current of 100mA Mated per EIA-364-23 20 mΩ initial, 10 mΩ maximum change from initial Measure between adjacent contact at 500VDC for 1 minute, per (MIL-STD-1344 MTD 3001.1) 5.1.2 Insulation Resistance - shrouded and unshrouded headers: ≥ 5000MΩ - PCB connectors, crimp housings and ≥ 1000MΩ modules: Dielectric 5.1.3 Withstanding Voltage Test between adjacent contact at 500VAC rms ≥ 1000V and 1 minute hold time. REVISION: ECR/ECN INFORMATION: TITLE: Q2 EC No: S2012-0309 DATE: 2011/10/18 DOCUMENT NUMBER: PS-99020-0001 SHEET No. C-GRID III 2 of 9 CREATED / REVISED BY: CHECKED BY: APPROVED BY: SKANG 2011/10/18 ATSEE 2011/10/21 MLONG 2011/10/21 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 5.2 MECHANICAL REQUIREMENTS ITEM DESCRIPTION TEST CONDITION REQUIREMENT As per IEC 512-8 test 15b : - shrouded and unshrouded headers: -straight (two directions): -right angle (one direction): 5.2.1 ≥ 20N ≥ 20N Contact Retention - PCB connectors: in housing -90147, 90148, 90151: -90152: - 90119 loaded in crimp housings and modules: ≥ 15 N ≥ 8.8 ≥ 15 N As per IEC 512-7 test 13b using gauge P11 in Appendix 1: 5.2.2 Insertion Force (per contact) - PCB connectors (90147, 90148, 90151 & 90152) and 90119 loaded in crimp modules and housings - Gold plated: - Tin plated: ≤1N ≤3N As per IEC 512-7 test 13b using gauge P12 in Appendix 1: 5.2.3 Withdrawal Force (per contact) - PCB connectors (90147, 90148, 90151 & 90152) and 90119 loaded in crimp modules and housings - Gold plated: - Tin plated: ≥ 0.2 N ≥ 0.2 N As per IEC 512-9 test 9a: 5.2.4 Durability 5.2.5 Solderability 30 cycles 100 cycles 200cycles 500 cycles Class 1: Class 2: Class 3: Class 4: 95% of immersed area must not show voids, pinholes, etc. As per IEC 512-6 test 12a method 1 @235°C/2s REVISION: ECR/ECN INFORMATION: TITLE: Q2 EC No: S2012-0309 DATE: 2011/10/18 DOCUMENT NUMBER: PS-99020-0001 SHEET No. C-GRID III 3 of 9 CREATED / REVISED BY: CHECKED BY: APPROVED BY: SKANG 2011/10/18 ATSEE 2011/10/21 MLONG 2011/10/21 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 5.2.6 5.2.7 Resistance to Soldering Heat For Series 90130, 90136, 90708, 90120, 90121, 90122, 90131, 90547: As per IEC 512-6, test 12d @230±5°C/3s For 91814 Series only: Connectors subjected to reflow profile shown in Appendix 3. As per IEC 512-4 test 6c: Shock 50g/11ms As per IEC 512-4 test 6d with mountings per Appendix 2: Class 1: 5.2.8 There shall be no damage that will impair normal operation. Vibration Class 2,3,4: 10 - 500 Hz, 0.35mm or 5g Duration: 2 hours each, 3 Directions 10 - 2000 Hz, 1.50mm or 20g Duration: 2 hours each, 3 directions 5.2.9 Tensile Strength of crimp termination 5.2.10 Glow Wire Test As per IEC 512-8 test 16d: 75% of wire tensile strength As per IEC 60695-2-11 @750°C with a max 2 second flame allowed. Applicable to Crimp housing 90142-10** and 90156-10** only Test carried out with crimp terminals loaded No damage that will impair normal operation. REVISION: ECR/ECN INFORMATION: TITLE: Q2 EC No: S2012-0309 DATE: 2011/10/18 DOCUMENT NUMBER: PS-99020-0001 SHEET No. C-GRID III 4 of 9 CREATED / REVISED BY: CHECKED BY: APPROVED BY: SKANG 2011/10/18 ATSEE 2011/10/21 MLONG 2011/10/21 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 5.3 ENVIRONMENTAL REQUIREMENTS ITEM DESCRIPTION TEST CONDITION REQUIREMENT As per IEC 512-6 test 11c: Class 1,2: 55°C 90- 95% R.H. Duration: 21 days Class 3,4: 55°C 90 - 95% R.H. Duration: 56 days 5.3.1 Damp Heat As per IEC 512-6 test 11i: - unshrouded and shrouded headers and PCB connectors: - crimp modules and housings: 5.3.2 Dry Heat 125°C Duration: 16 hours 105°C Duration: 16 hours As per IEC 68-2-43 test Kd: 5.3.3 Industrial Atmosphere Class SO2 (at 10ppm) 1 Not Applicable 2, 3 4 days 4 10 days Class H2S (at 1ppm) 1 Not Applicable 2, 3 4 days 4 10 days As per IEC 68-2-42 test Kc: 5.3.4 Industrial Atmosphere As per IEC 512-6 test 11d: 5.3.5 Thermal Shock - unshrouded and shrouded headers and PCB 55°C to +125°C, 10 cycles connectors: - crimp modules and housings: -55°C to +105°C, 10 cycles REVISION: ECR/ECN INFORMATION: TITLE: Q2 EC No: S2012-0309 DATE: 2011/10/18 DOCUMENT NUMBER: PS-99020-0001 SHEET No. C-GRID III 5 of 9 CREATED / REVISED BY: CHECKED BY: APPROVED BY: SKANG 2011/10/18 ATSEE 2011/10/21 MLONG 2011/10/21 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION APPENDIX 1 INSERTION AND WITHDRAWAL GAUGES REVISION: ECR/ECN INFORMATION: TITLE: Q2 EC No: S2012-0309 DATE: 2011/10/18 DOCUMENT NUMBER: PS-99020-0001 SHEET No. C-GRID III 6 of 9 CREATED / REVISED BY: CHECKED BY: APPROVED BY: SKANG 2011/10/18 ATSEE 2011/10/21 MLONG 2011/10/21 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION APPENDIX 2 VIBRATION MOUNTINGS REVISION: ECR/ECN INFORMATION: TITLE: Q2 EC No: S2012-0309 DATE: 2011/10/18 DOCUMENT NUMBER: PS-99020-0001 SHEET No. C-GRID III 7 of 9 CREATED / REVISED BY: CHECKED BY: APPROVED BY: SKANG 2011/10/18 ATSEE 2011/10/21 MLONG 2011/10/21 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION APPENDIX 3 REFLOW PROFILE PROFILE FEATURE Pb-FREE PROCESS (RoHS) COMPATIBLE Product Series 91814. Average Ramp Up Rate 3oC/second max. Preheat - Temperature Min (TS min) - Temperature Max (TS max) - Time (tS) 150oC 200oC 60 – 180 seconds Time over Liquidus - Temperature (TL) - Time (tL) 217oC 60 – 150 seconds Time from 25oC to Peak Temperature (TP) 8 minutes max. Peak Temperature (TP) 260oC max. Time within 5oC of Peak Temperature (tP) 40 seconds max. Ramp Down Rate 6oC/second max. REVISION: ECR/ECN INFORMATION: TITLE: Q2 EC No: S2012-0309 DATE: 2011/10/18 DOCUMENT NUMBER: PS-99020-0001 SHEET No. C-GRID III 8 of 9 CREATED / REVISED BY: CHECKED BY: APPROVED BY: SKANG 2011/10/18 ATSEE 2011/10/21 MLONG 2011/10/21 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION APPENDIX 4 C-GRID III PRODUCT RANGE PRODUCT TYPE QF50 SHROUDED HEADERS SERIES 5320 FEMALE 5576 HEADER VERTICAL 5578 HEADER RIGHT ANGLE 90130-1 DUAL ROW VERTICAL FULLY LOADED 90130-2 DUAL ROW VERTICAL VOIDED PINS 90130-3 DUAL ROW RIGHT ANGLE FULLY LOADED 90130-4 DUAL ROW RIGHT ANGLE VOIDED PINS 91814-3 DUAL ROW RIGHT ANGLE FULLY LOADED HIGH TEMP 90136-1 SINGLE ROW VERTICAL 90136-2 SINGLE ROW RIGHT ANGLE 90708 DUAL ROW LOW PROFILE VERTICAL 90120 SINGLE ROW VERTICAL 90121 SINGLE ROW RIGHT ANGLE 90122 DUAL ROW RIGHT ANGLE 90131 DUAL ROW VERTICAL 90547 SINGLE ROW VERTICAL DOUBLE BODY CRIMP TERMINALS 90119 FEMALE CRIMP PCB CONNECTORS 90147 SINGLE ROW VERTICAL 90148 SINGLE ROW HORIZONTAL 90151 DUAL ROW VERTICAL 90152 DUAL ROW HORIZONTAL 90123 SINGLE ROW CRIMP 90143 DUAL ROW UNSHROUDED HEADERS MODULAR HOUSINGS CRIMP HOUSINGS 90142 DUAL ROW 90156 SINGLE ROW 90160 DUAL ROW 6.0 PACKAGING Parts shall be packed in trays and protected against damage during handling, transportation and storage. REVISION: ECR/ECN INFORMATION: TITLE: Q2 EC No: S2012-0309 DATE: 2011/10/18 DOCUMENT NUMBER: PS-99020-0001 SHEET No. C-GRID III 9 of 9 CREATED / REVISED BY: CHECKED BY: APPROVED BY: SKANG 2011/10/18 ATSEE 2011/10/21 MLONG 2011/10/21 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC