1042490810

LANGUAGE PRODUCT SPECIFICATION ENGLISH 【1．SCOPE】 This specification covers the 0.8 mm PITCH BOARD TO BOARD CONNECTOR series. 【2．PRODUCT NAME AND PART NUMBER】 REV. SHEET Product Name Part Number Receptacle Housing Assembly 104249-0891 Embossed Tape Package for 104249-0891 104249-0810 Plug Housing Assembly 104250-0800 Embossed Tape Package for 104250-0800 104250-0820 0 1 1~12 1 A REVISE ON PC ONLY TITLE: 0.8 BB CONN. H=0.75 (ONLY POWER TERMINAL VER.) PRODUCT SPECIFICATION CONFIDENTIAL RELEASED - A '15/05/15 JHCHANG REV. DESCRIPTION STATUS DESIGN CONTROL K DOCUMENT NUMBER PS-104249-001 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION WRITTEN BY: CHECKED BY: APPROVED BY: JHCHANG KSKIM YSKIM02 DATE: YR/MO/DAY 2015/05/15 FILE NAME SHEET 1 OF 12 EN-037(2013-04 rev.1) PS-104249-001.docx LANGUAGE PRODUCT SPECIFICATION ENGLISH 【3．RATINGS】 Item Standard Rated Voltage (MAX.) 50 V For 4 PINS 0.3A / 1PIN Rated Current (MAX.) *3 For 4 PINS 4.5A / 1PIN Ambient Temperature *1 Range Storage condition after opening the Humidity prevention package [ AC (rms) / DC ] -40°C ~ + 85°C *2 Temperature -10℃～+50℃ Humidity 85%R.H. MAX. (No condensation) For 6 months after shipping (unopened package) *1. Non-operating connectors after reflow must follow the operating temperature range condition. *2. Including the terminal temperature rise generated by conducting electricity. *3. When 2 circuits are constructed via PWB/FPC circuit, 9A of current per 2-circuit is applicable. But the circuit via fitting nail shall not be acceptable for excessive temperature increase. Term REVISE ON PC ONLY A SEE SHEET 1 OF 12 REV. DESCRIPTION TITLE: 0.8 BB CONN. H=0.75 (ONLY POWER TERMINAL VER.) PRODUCT SPECIFICATION CONFIDENTIAL THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-104249-001 PS-104249-001.docx 2 OF 12 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION ENGLISH 【4．PERFORMANCE】 4-1．Electrical Performance Item Test Condition Requirement 4-1-1 Contact Resistance Mate connectors and measured by dry circuit, 20mV MAX., 10mA. MAX. (JIS C5402 5.4) 4-1-2 Insulation Resistance Mate connectors and apply 250V DC between adjacent terminal and ground. (JIS C5402 5.2/MIL-STD-202 Method 302) 100 Mega ohm MIN. 4-1-3 Dielectric Strength Mate connectors and apply 250V AC (rms) for 1 minute between adjacent terminal and ground. (JIS C5402 5.1/MIL-STD-202 Method 301) No Breakdown on function 4-1-4 Temperature Rise 10 milliohm MAX. /PIN Mate connectors and conduct the maximum rated current. (UL 498) 30 °C MAX. 4-2．Mechanical Performance Item Test Condition Insertion and Withdrawal Force 4-2-1 Terminal / Housing Retention Force 4-2-2 Requirement Insertion 46.5 N MAX. {4.74 kgf} Withdrawal 10.0 N MIN. {1.02 kgf} Insert and withdraw connectors at the speed rate of 5cycle per minute. Apply axial pull out force at the speed rate of 25±3 mm/minute on the terminal assembled in the housing. REVISE ON PC ONLY A SEE SHEET 1 OF 12 REV. DESCRIPTION TITLE: 0.15N {0.015 kgf} MIN. 0.8 BB CONN. H=0.75 (ONLY POWER TERMINAL VER.) PRODUCT SPECIFICATION CONFIDENTIAL THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-104249-001 PS-104249-001.docx 3 OF 12 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION ENGLISH 4-3．Environmental Performance and Others Item Test Condition Repeated Insertion / Withdrawal 4-3-1 4-3-2 Vibration Mechanical Shock 4-3-3 Heat Resistance 4-3-4 Cold Resistance 4-3-5 Requirement When mated up to 10 cycles repeatedly by the rate of 5 cycles per minute. Amplitude : 1.5mm P-P Frequency : 10~55~10 Hz in 1 minute. Duration : 2 hours in each X.Y.Z.axes. (MIL-STD-202 Method 201) 490m/s２ { 50G } , 3 strokes in each X.Y.Z.axes. (JIS C60068-2-27/MIL-STD-202 Method 213) 85±2°C, 96 hours (JIS C60068-2-2/MIL-STD-202 Method 108) Contact Resistance 20milliohm MAX. Appearance No Damage on function Contact Resistance 20milliohm MAX. Discontinuity 1.0 microsecond MAX. Appearance No Damage on function Contact Resistance 20milliohm MAX. Discontinuity 1.0 microsecond MAX. Appearance No Damage on function Contact Resistance 20milliohm MAX. Appearance No Damage on function Contact Resistance 20milliohm MAX. –40±3°C, 96 hours (JIS C60068-2-1) REVISE ON PC ONLY A SEE SHEET 1 OF 12 REV. DESCRIPTION TITLE: 0.8 BB CONN. H=0.75 (ONLY POWER TERMINAL VER.) PRODUCT SPECIFICATION CONFIDENTIAL THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-104249-001 PS-104249-001.docx 4 OF 12 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION ENGLISH Item 4-3-6 Test Condition Humidity Temperature Cycling 4-3-7 4-3-8 Salt Spray 4-3-9 SO2 Gas 4-3-10 Solderability Requirement Appearance No Damage on function Contact Resistance 20milliohm MAX. Dielectric Strength Must meet 4-1-3 Insulation Resistance 50 Mega ohm MIN. 5 cycles of : a) – 55°C, 30 minutes b) + 85°C, 30 minutes (JIS C0025) Appearance No Damage on function Contact Resistance 20milliohm MAX. 48±4 hours exposure to a salt spray from the 5±1% solution at 35±2°C. (JIS C60068-2-11/MIL-STD-202 Method 101) Appearance No Damage on function Contact Resistance 20milliohm MAX. Appearance No Damage on function Contact Resistance 20milliohm MAX. Solder Wetting 95% of immersed area must show no voids, pin holes. Temperature : 60±2°C Relative Humidity : 90~95% Duration : 96 hours (JIS C60068-2-3/MIL-STD-202 Method 103) Density of SO2 gas : 50±5ppm Temperature : 40±2°C Duration : 24 hours Soldering Time : 3±0.5 sec. Solder Temperature : 245±5 °C REVISE ON PC ONLY A SEE SHEET 1 OF 12 REV. DESCRIPTION TITLE: 0.8 BB CONN. H=0.75 (ONLY POWER TERMINAL VER.) PRODUCT SPECIFICATION CONFIDENTIAL THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-104249-001 PS-104249-001.docx 5 OF 12 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION ENGLISH Item 4-3-11 Test Condition Resistance to Soldering Heat ( Soldering iron method ) Requirement 0.2mm from terminal tip and fitting nail tip. Soldering time : 5 seconds MAX. Solder temperature : 350℃±10℃ Appearance ( { ): }: No Damage on function Reference Reference Standard Unit 【５．PRODUCT SHAPE, DIMENSIONS AND MATERIALS】 Refer to the drawing. ELV AND RoHS COMPLIANT. REVISE ON PC ONLY A SEE SHEET 1 OF 12 REV. DESCRIPTION TITLE: 0.8 BB CONN. H=0.75 (ONLY POWER TERMINAL VER.) PRODUCT SPECIFICATION CONFIDENTIAL THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-104249-001 PS-104249-001.docx 6 OF 12 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION ENGLISH 【6．INFRARED REFLOW CONDITION】 250℃ +5℃/-10℃ MAX (Peak Temperature.) 30~60 Seconds MAX. (230℃ MIN.) 90~120 Seconds (Pre-heat 150～200℃) TEMPERATURE CONDITION GRAPH (TEMPERATURE ON BOARD PATTERN SIDE) NOTE; Please check the reflow soldering condition by your own devices beforehand. Because the condition changes by the soldering devices, PWB, and so on. Also please check mount condition in case of Nitrogen atmosphere. 【7．INSTRUCTION UPON USAGE】 [Mating] Please mate the connector with parallel manner. (Fig. 1) Please locate the inside wall of the rec. housing and the plug after mating. In the case of skew mating, please do not mate the connector at more than 10°lead in angle. (Fig. 2) Please do not mate the rec. and plug at an angle as this way, because the housing is broken. (Fig. 3) [Un-mating] Please extract the connector with parallel manner (Fig. 1), or swing them right to left slightly. (Fig. 4) Please do not mate connector at an angle as this manner, because the housing might be broken. Please be very careful when extracting the connection at an angle. This many cause damage to the connector. (Fig. 5) (Please take care of twist extraction.) REVISE ON PC ONLY A SEE SHEET 1 OF 12 REV. DESCRIPTION TITLE: 0.8 BB CONN. H=0.75 (ONLY POWER TERMINAL VER.) PRODUCT SPECIFICATION CONFIDENTIAL THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-104249-001 PS-104249-001.docx 7 OF 12 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION ENGLISH PLUG REC. Fig. 1 Mating & Un-mating in parallel manner (Ideal) Outside of PLUG Less than 10 degrees Less than 10 degrees Inside wall of REC. Fig. 2 Mating with the alignment using outside of plug Outside of PLUG Inside wall of PLUG Inside wall of REC. Interference area Inside wall of REC. Fig. 3 Mating with the alignment using inside of plug (Not preferred) Fig. 4 Un-mating by shaking back or force Fig. 5 Un-mating with one strong rotation (can damage connector) REVISE ON PC ONLY A SEE SHEET 1 OF 12 REV. DESCRIPTION TITLE: 0.8 BB CONN. H=0.75 (ONLY POWER TERMINAL VER.) PRODUCT SPECIFICATION CONFIDENTIAL THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-104249-001 PS-104249-001.docx 8 OF 12 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION ENGLISH 【11．OTHERS】 1. Prohibit from applying an excessive load to the housing around terminals before mounting the connector onto PWB. 2. Please do not touch the terminals and fitting nails before or after mounting the connector onto PWB. 3. There may be slight differences in the housing coloring, but there will be no influence on the product’s performance. 4. Specification is met although black spots, scratch on the housing, or a minim air bubble and so on may exist on mold resin. As LCP is used as the mold material, the weld lines may be visible in some cases. However, they do not affect product performance. 5. Please ensure that the connector is fully mated. After setting the connector and cable assembly in the device, please ensure that the connector does not become unengaged due to vibration and shock conditions. There may be case of coming off if mating is insufficient and connectors get an inclines of 5 degrees. 6. There is instruction of design the following. Please prepared without pattern area. When an excessive mounting gap occurs, there may be contact area solder wicking. 7. The mounting specification for coplanarity does not include the influence of warpage of PWB. The warpage of PWB should be a maximum of 0.02mm if measuring from one connector edge to the other. 8. This connector performance was tested based on using rigid epoxy-glass PWB. If you need to mount the connector on FPC, please make sure to conduct the reflow test in advance. 9. Recommend to place any stiffener board or film on the backside of FFC/FPC when you mount the connector to prevent deformation. Due to the low profile design, please be cautious to set the reflow condition to prevent solder wicking. 10. Fillet condition might be different depending on the mounting condition, please care of fillet condition of connectors. 11. There may be a case which changes housing color by depending on reflow conditions. However, it does not effect on connector performance. 12. There may be a case that the plated surface looks wavy by depending on reflow conditions. However, it does not effect on connector performance. 13. There is no influence in the product performance though discoloration might be seen in the soldering tail after the reflow. There is no solder on the top surface of tail in spec, and there is no influence in performance. REVISE ON PC ONLY A SEE SHEET 1 OF 12 REV. DESCRIPTION TITLE: 0.8 BB CONN. H=0.75 (ONLY POWER TERMINAL VER.) PRODUCT SPECIFICATION CONFIDENTIAL THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-104249-001 PS-104249-001.docx 9 OF 12 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION ENGLISH 14. Because this product has a cut off area on the tip of the terminal, the solderability performance in this area is not as good as compared to the side/back of the terminal. However, by building a good soldering fillet at the side/back of the terminal, there will be no issue on either the product function or the retention force of PWB. 15. If you leave any soldering area on this product open, there may be the possibility of a missing terminal short circuiting between pins, terminal buckling or the potential for the connector to come off of PWB. Therefore, please solder all of the terminals and fitting nails on PWB. 16. If there is accidental contact with the connector while it is going through the reflow machine, there may be deformation or damage caused to the connector. Please check to prevent this. 17. When conducting manual repairs using a soldering iron, please follow the soldering conditions shown in the product specification. If the conditions in the product spec are not followed, it may cause the terminals to fall off, a change in the contact gap, a deformation of the housing, melting of the housing, and damage the connector. 18. When conducting manual repairs with a soldering iron, please do not use excessive solder or flux than needed. This may cause solder wicking or flux wicking issues, also it may eventually cause a contact defect and functional issues. 19. Please do not stack up PWB directly after mounted the connector on it. 20. If an alternative solder past is used (other than Sn-Ag-Cu 96.5%-3%-0.5%), please ensure in advance that the solder ability and PWB peeling force will not have any issues. 21. Please do not use the connector in a condition where the wire, PWB, or the contact area is experiencing a sympathetic vibration of wires and PWB, and constant movement of devices. This may cause a defect in the contact due to the contact area being worn down. Therefore, please fix wires and PWB on the chassis, and reduces sympathetic vibration. 22. Please do not conduct any “washing process” on the connector because it may damage the product’s function. 23. Please investigate the mounting condition (reflow soldering condition) on your own devices beforehand. The mounting conditions may change due to the soldering temperature, soldering paste, air reflow machine, Nitrogen reflow machine, and the type of PWB. The different mounting conditions may have an influence on the product’s performance. 24. Please do not use the connector alone to provide mechanical support for PWB. Please ensure that there is a fixed structure on the phone chassis or other component support for PWB. 25. There should not be more than one board to board connection between two separate PWB. When mounting several board to board connectors between parallel PWB, please ensure to separate each mated board to board connectors by using separate PWB. 26. Please keep enough clearance between connector and chassis of your application in order not to apply any pressure on the connector. REVISE ON PC ONLY A SEE SHEET 1 OF 12 REV. DESCRIPTION TITLE: 0.8 BB CONN. H=0.75 (ONLY POWER TERMINAL VER.) PRODUCT SPECIFICATION CONFIDENTIAL THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-104249-001 PS-104249-001.docx 10 OF 12 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION ENGLISH 27. This product is not designed for the mating and un-mating of the connectors to be performed under the condition of an active electrical circuit. It may cause a spark and product defect if the connectors are mated and un-mated in this way. 28. After mated the connector, please do not allow PWB to apply pressure on the connector in either the pitch direction or the span direction. It may cause damage to the connector and may crack the soldering. 29. Due to the low profile design, there might be the flux going up to receptacle terminal beam part , anchor part and the other side of plug contacting part. However, it does not effect on connector performance. 30. To prevent excessive temperature increase, please make appropriate circuit design for PWB/FPC on which the connectors mount. 31. Notes of caution about wiring of power circuit - To prevent excessive temperature increase, please make appropriate circuit design for PWB/FPC on which the connectors mount. - The heat capacity of micro connector is very lower than PWB, so the temperature rise by power distribution depends on the wiring condition of PWB mainly. Also the reasonable dimension of wiring section on PWB is 1.0mm width x 35μm thickness in case of applying 1A. - It is possible to apply Max. 9A on this connector by shunting current to 2 power pins on PWB wiring. But the circuit via fitting nail shall not be acceptable for excessive temperature increase. In addition, the fitting nail in this product can’t be acceptable for the electrical circuit. REVISE ON PC ONLY A SEE SHEET 1 OF 12 REV. DESCRIPTION TITLE: 0.8 BB CONN. H=0.75 (ONLY POWER TERMINAL VER.) PRODUCT SPECIFICATION CONFIDENTIAL THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-104249-001 PS-104249-001.docx 11 OF 12 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION ENGLISH REV. REV. RECORD DATE ECN NO. WRITTEN BY : CHECKED BY : 0 PROPOSED '15/04/16 - JHCHANG KSKIM 1 PRODUCT NUMBER MODIFICATION '15/04/28 - JHCHANG KSKIM A RELEASED '15/05/15 - JHCHANG KSKIM REVISE ON PC ONLY A SEE SHEET 1 OF 12 REV. DESCRIPTION TITLE: 0.8 BB CONN. H=0.75 (ONLY POWER TERMINAL VER.) PRODUCT SPECIFICATION CONFIDENTIAL THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT NUMBER FILE NAME SHEET PS-104249-001 PS-104249-001.docx 12 OF 12 EN-037(2013-04 rev.1)