1046421610

C (0.1) Contact Soldertails (16- 0.4 0) T1 T2 T3 T6 S8(--) (C5)S6 S3(C3) (C2)S2 3.76 S4(--) (C1)S1 1.85 G1 G8 S6 C5 Vpp(Program V) C6 S8 -- Reserved (24- 1.35 ) PCB OUTLINE (24- 7.55 ) 1.2 ±0.1 GND DESCRIPTION DAT2 CD/DAT32 D CMD T4 T5 CLK T6 Vss(GND) T7 DAT0 T8 DAT1 S/W SOCKET OUTLINE I/O S7 T1 T2 T3 T4 S7(C6) C4 GND PIN NO. (C4)S5 T5 S5 E [microSD CARD PIN-MAP] ( 17.8 ) G7 8P 6P DESCRIPTION S1 C1 Vcc(Supply V) S2 C2 RST(Reset) S3 C3 CLK(Clock) S4 -- Reserved G1~G8 2.6 12.09 13.6 1.34 1.84 G6 ALL SOCKET SPACES(HATCHING AREA) WITHOUT SOLDER PATTERN 16-0.58 0.7 (9.25) (16- 6.65 ) T7 (0.2) mSD Card Center (8- 0.55 ) Contact Soldertails (6.05) G2 (0.1) (3.5) mSIM Card & Socket Center Switch Soldertail S/W Shell Soldertails (8- 6.5 0) T8 (0.95) Eject Stroke (by Eject Puller) 1.85 ±0.1 4 1.8 (0.4) (0.9) (0.15) 2 ±0.1 (3.15) #3 m-SIM Contact #2 #1 5.85 (0.6) (18.20) 16.9 Vacuum Area 1.7 G3 18.25 ±0.12 #5 G5 Shell Soldertails Switch Switch Soldertail 9 ±0.12 #6 (14.5) #7 16-0.38 ±0.1 0.94 ±0.1 Pitch 0.88x6=5.28 ±0.15 #8 *See Sheet3 For Detail (8P Vs 6P) (2.41) NO PATTERN AREA �⌀4� 1 [microSIM CARD PIN-MAP] G4 1.54 ±0.1 (10.3) #4 3.76 ±0.1 10.25 ±0.1 2.10 +0.15 +0.05 24-0.45 ±0.1 6 2 12-15.1 (12- 14.1 ) (8.68) 24-1.35 1.4 ±0.1 ******* 0.35 ±0.1 1.415 ±0.1 13.6 ±0.1 (2.2) 0.49 ±0.12 0.045 ±0.1 12.09 ±0.1 16.9 ±0.1 D m-SD Contact # 8 # 7 #6 #5 #4 #3 #2 #1 -DATE CODEexample: M-> Molex initial 2-> Year(2012) B-> Month(November) 1, ...9, A, B, C 15-> Date(15th) A-> Site initial(Ansan) 1-> Manufacture line number 3 10.25 Pitch 0.88x6=5.28 (0.88) 3 (8.6) 4 1.415 (2.4) E (2- 0.55 ) 1 ( 1.2 ) 5 Card Space 2 5 6 (0.05) 7 8 M2B15A1 9 VDD CARD DETECTOR C RECOMMENDED PCB LAYOUT [FRONT VIEW] ☆ 9.82 +0.1 -0.08 mSD Entrance of a Housing Pitch 1.1x7=7.7 ±0.2 ☆0.86 +0.08 -0.04 13.2 ±0.12 ☆ 12.15 +0.12 mSIM Entrance of a Housing -0.05 ☆0.8 +0.08 -0.04 [TOLERANCE : ±0.05] NOTES 1. MATERIALS: SEE TABLE 2. FINISHES: SEE TABLE 3. MATES WITH -UPPER: microSD Card -LOWER: microSIM(UICC) Card 4. PRODUCT SPECIFICATIONS: PS-104642-001 5. PACKING SPECIFICATIONS: SPK-104642-002 6. COPLANARITY OF SOLDER TAILS: 0.08mm MAX. BEFORE & AFTER 250°C REFLOW 2TIMES 7.REFERENCE CARD DIMENSIONS ARE WITH STANDARD DIMENSION CARD 8.CUSTOMER'S CTF DIMENSION(☆) IS EQUAL TO MOLEX MAJOR QUALITY SYMBOL( 2.25 ±0.2 7.59 ±0.2 (14.1) [Circuit diagram for Detection Switch of microSD card] Circuit Card insertion condition Card detect-switch mSD #6pin Switch terminal SWITCH TERMINAL PHOSPHOR BRONZE 3 microSD SHELL STAINLESS STEEL BRIGHT NICKEL 1.27㎛ MIN. 4 microSIM SHELL STAINLESS STEEL 5 HOUSING LIQUID CRYSTAL POLYMER NATURAL(IVORY) COLOR, UL94V-0 6 EJECT-PULLER STAINLESS STEEL NONE RELEASE STATUS FORMAT: master-tb-prod-A3 REVISION: G DATE: 2015/12/14 9 P1 RELEASE DATE 01.09.2016 8 0 = 0 = 4 = C 23:51:41 7 = = BRIGHT NICKEL 1.27㎛ MIN. 6 0 0 0 = 0 = 0 A4 5 TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 1.0 ° REV 2 CONTACT TERMINAL COPPER ALLOY (16P) 2016/09/19 = FINISHES MATERIALS 2016/12/15 2016/12/22 PARTS NAME SHCHU YSKIM02 Close REDRAWN Card insertion ISOMETRIC (SCALE 4/1) SMD ONLY ) 104642-1610 SOLDER TYPE B 1046421610 PART (ORDER) NO. MATERIAL NO. QUALITY THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE SYMBOLS GENERAL CONTACT mSIM: GOLD 0.05㎛ MIN. OVER Pd-Ni 0.3㎛ MIN. CONTACT mSD: GOLD 0.05㎛ MIN. Pd-Ni 0.2㎛ MIN. SWITCH: GOLD 0.1㎛ MIN. (Pd-Ni IS PALLADIUM NICKEL) SOLDERS: GOLD 0.05㎛ MIN. BASE: NICKEL 1.27 MIN. 1 A Open 111721 ICYANG NO. Without Card EC NO: DRWN: CHK'D: APPR: B 4 PLACES ± 3 PLACES ± 0.12 2 PLACES ± 0.12 1 PLACE ± 0.15 0 PLACES ± 0.15 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 MM 5:1 DRWN BY DATE 2016/04/14 YHJUNG02 CHK'D BY 2016/08/29 SHCHU APPR BY YSKIM02 DRAWING SIZE COMBO 2.10H PULLER TYPE MICROSD/MICROSIM 8P/8P WITH S/W DATE A DATE 2016/09/01 THIRD ANGLE PROJECTION A3 PRODUCT CUSTOMER DRAWING SERIES MATERIAL NUMBER 104642 SEE TABLE DOCUMENT NUMBER GENERAL DOC TYPE DOC PART SHEET NUMBER 1046421610 3 CUSTOMER 2 PSD 1 OF 3 000 1 7 8 Pitch20 ±0.1 COVER TAPE 2 ±0.1 5 6 ⌀1.5 ±0.1 4 ±0.1 4 3 2 1 1.75 ±0.1 9 EMBOSSED CARRIER (28.3) NOTES (9.3) SOCKET A1 1. QUANTITY OF PRODUCTS : 1,500 PCS / 1 REEL 2. LEAD LENGTH (3.3) (1.5) (0.2) (1.7) D 32 ±0.3 (14.3) E (9.3) E 25 ±10 COVER TAPE NON-BONDED PART 10~20PCS (R0.75) D UNREELING DIRECTION NUMBER OF EMPTY PART TOP VIEW OF EMBOSSED CARRIER COVER TAPE TAIL PART (EMPTY) COMPONENT SUPPLIER 400 ±80 ( 60 MIN.) UNREELING OF PRODUCTS 3. PEELING OFF FORCE OF COVER TAPE : 0.1N~0.59N(10.2~60gf) (PEELING DIRECTION AS BELOW) - PEELING OFF SPEED : 300mm/Min.(Ref.) DIRECTION C C 10° PEEL OFF DIRECTION (⌀ 380 ) UNREELING DIRECTION 4. MATERIALS OF EMBOSSED CARRIER AND COVER TAPE : PET(POLYETHYLEN TEREPHTHALATE) B B 0 = 0 = RELEASE STATUS FORMAT: master-tb-prod-A3 REVISION: G DATE: 2015/12/14 9 P1 RELEASE DATE 01.09.2016 8 C 23:51:41 7 6 0 = 0 EC NO: DRWN: CHK'D: APPR: = 0 2016/12/22 = = 0 A4 5 TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 1.0 ° YSKIM02 0 REV A = REDRAWN (32.4) 0 111721 ICYANG SHCHU = 2016/09/19 2016/12/15 QUALITY THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE SYMBOLS GENERAL 4 PLACES ± 3 PLACES ± 0.12 2 PLACES ± 0.12 1 PLACE ± 0.15 0 PLACES ± 0.15 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 MM 2:1 DRWN BY DATE 2016/04/14 YHJUNG02 CHK'D BY 2016/08/29 SHCHU APPR BY YSKIM02 DRAWING SIZE COMBO 2.10H PULLER TYPE MICROSD/MICROSIM 8P/8P WITH S/W DATE A DATE 2016/09/01 THIRD ANGLE PROJECTION A3 PRODUCT CUSTOMER DRAWING SERIES MATERIAL NUMBER 104642 SEE SHEET1 DOCUMENT NUMBER GENERAL DOC TYPE DOC PART SHEET NUMBER 1046421610 3 CUSTOMER 2 PSD 2 OF 3 000 1 9 7 8 5 6 4 3 2 1 REFERENCE DRAWING E E 2 3 4 5 6 7 8 15 ±0.1 1 2.9 ±0.1 6 5 4 8 7.9 ±0.1 7 15 ±0.1 6 0.3 ±0.1 2.5 ±0.1 5 1.1 ±0.1 0.7 ±0.1 9.7 ±0.1 0.76 ±0.08 2.5 ±0.1 0.7 ±0.1 5- R0.8 ±0.1 1 2 12 ±0.1 1.34 MAX 3.04 MIN 3.88 MAX 5.58 MIN 6.42 MAX 8.12 MIN 8.96 MAX 10.66 MIN C 3 4 1 2 D 3 2.15 MAX 4.15 MIN 9.77 MAX 11.77 MIN D (0.95) 11 ±0.1 C MICRO SIM SPECIFICATION MICRO SIM 6P microSD CARD B B [Reference Standards] -.microSD CArd Addendum Versopm 3.0 Draft 0.8 -.ETSI TS 102 221 V9.1.0, Smart Cards, UICC-Terminal interface, Physical and logical characteristics = 0 = 0 = 0 = 9 P1 RELEASE DATE 01.09.2016 8 23:51:41 7 6 = 0 = 0 A4 5 REV RELEASE STATUS FORMAT: master-tb-prod-A3 REVISION: G DATE: 2015/12/14 C 0 EC NO: DRWN: CHK'D: APPR: = 0 TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 1.0 ° REDRAWN A 0 111721 ICYANG SHCHU YSKIM02 = 2016/09/19 2016/12/15 2016/12/22 QUALITY THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE SYMBOLS GENERAL 4 PLACES ± 3 PLACES ± 0.12 2 PLACES ± 0.12 1 PLACE ± 0.15 0 PLACES ± 0.15 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 MM 4:1 DRWN BY DATE 2016/04/14 YHJUNG02 CHK'D BY 2016/08/29 SHCHU APPR BY YSKIM02 DRAWING SIZE COMBO 2.10H PULLER TYPE MICROSD/MICROSIM 8P/8P WITH S/W DATE A DATE 2016/09/01 THIRD ANGLE PROJECTION A3 PRODUCT CUSTOMER DRAWING SERIES MATERIAL NUMBER 104642 SEE SHEET1 DOCUMENT NUMBER GENERAL DOC TYPE DOC PART SHEET NUMBER 1046421610 3 CUSTOMER 2 PSD 3 OF 3 000 1