1054291208

PRODUCT SPECIFICATION NANO-FITTM WIRE-TO BOARD CONNECTOR SYSTEM SMT, DUAL ROW, VERTICAL SMT, DUAL ROW, RIGHT ANGLE Series: 105429 Series: 105405 SMT, SINGLE ROW, VERTICAL SMT, SINGLE ROW, RIGHT ANGLE Series: 105431 Series: 105430 TABLE OF CONTENTS Nano-Fit Web Page REVISION: E ECR/ECN INFORMATION: EC No: 642212 DATE: 2020/7/29 DOCUMENT NUMBER: PS-105405-001 TITLE: PRODUCT SPECIFICATION FOR NANO-FITTM & WIRE TO BOARD HEADER OF SMT TYPE SHEET No. 1 of 16 CREATED / REVISED BY: CHECKED BY: APPROVED BY: Dixon Li Jonny Zheng Jonny Zheng Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION Table of Contents 1.0 SCOPE 3 2.0 PRODUCT DESCRIPTION 2.1 Product Name and Series Numbers 2.2 Dimensions, Materials, Plating and Markings 2.3 Safety Agency Approvals 2.4 TPA Function 3 3 3 3 3 3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS 3.1 Molex Documents 3.2 Industry Documents 4 4 4 4.0 ELECTRICAL PERFORMANCE RATINGS 4.1 Voltage 4.2 Applicable Wires 4.3 Maximum Current Rating 4.4 Temperature 4.5 Durability 5 5 5 5 6 6 5.0 QUALIFICATION 6 6.0 PERFORMANCE 6.1 Electrical Performance 6.2 Mechanical Performance 6.3 Environmental Performance 7 7 7 9 7.0 TEST SEQUENCE GROUPS 11 8.0 SOLDER INFORMATION 8.1 Solder Process Temperature 8.2 Reflow Solder Profile 13 13 13 9.0 PACKAGING 15 10.0 CABLE TIE/ WIRE TWIST LOCATION 15 11. 0 POLARIZATION AND KEYING OPTIONS 16 TABLE OF CONTENTS Nano-Fit Web Page REVISION: E ECR/ECN INFORMATION: EC No: 642212 DATE: 2020/7/29 DOCUMENT NUMBER: PS-105405-001 TITLE: PRODUCT SPECIFICATION FOR NANO-FITTM & WIRE TO BOARD HEADER OF SMT TYPE SHEET No. 2 of 16 CREATED / REVISED BY: CHECKED BY: APPROVED BY: Dixon Li Jonny Zheng Jonny Zheng Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION 1.0 SCOPE This Product Specification covers the mechanical, electrical and environmental performances requirements and test methods of Nano-fit 2.50 mm pitch wire to board power connector series products, header SMT type, terminated with 20, 22, 24 and 26 AWG stranded wire using crimp technology with tin or gold plating. 2.0 PRODUCT DESCRIPTION 2.1 product name and series number PRODUCT NAME & SERIES NUMBER Description (Header) Series Number VERTICAL SINGLE ROW, SMT TYPE 105431 VERTICAL DUAL ROW, SMT TYPE 105429 RIGHT ANGLE SINGLE ROW, SMT TYPE 105430 RIGHT ANGLE DUAL ROW, SMT TYPE 105405 2.2 Dimensions, materials, platings and markings Dimensions & Platings: see individual sales drawings. Material: RoHS compliant materials. 2.3 Safety agency approvals a) UL-1977 recognition file number: E29179. b) CSA approval file number: LR 19980. c) VDE Glow Wire approval file number: 569200-9020-0023/236653 WIRE TO BOARD: CSA Per UL 4 Amps @ 250V ( 20-26 AWG WIRE) 4 Amps at 250V (20-26 AWG WIRE) 2.4 TPA function a> Make sure crimp terminal is properly seated. b> Increase crimp terminal retention force to receptacle, the spec is defined in section 6.2.2 and 6.2.3 TABLE OF CONTENTS Nano-Fit Web Page REVISION: E ECR/ECN INFORMATION: EC No: 642212 DATE: 2020/7/29 DOCUMENT NUMBER: PS-105405-001 TITLE: PRODUCT SPECIFICATION FOR NANO-FITTM & WIRE TO BOARD HEADER OF SMT TYPE SHEET No. 3 of 16 CREATED / REVISED BY: CHECKED BY: APPROVED BY: Dixon Li Jonny Zheng Jonny Zheng Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION 3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS 3.1 Molex documents See series specific sales drawings and the other sections of this specifications for the necessary referenced documents and specifications. Nano-fit Test summary 1054050000-TS-000.pdf Nano-fit Application Specification – AS-105405-001 Molex Solderability Specification SMES-152 Molex Heat Resistance Specification AS-40000-5013 Molex Moisture Technical Advisory AS-45499-001 Molex Package Handling Specification 454990100-PK Application Tooling Specification (ATS)* *Application Tooling Specification for terminals is not provided in this document. ATS for terminals can be available from respective terminal part number page in Molex.com 3.2 Industrial documents EIA-364-1000 UL-60950-1 CSA STD. C22.2 NO. 182.3-M1987 IEC 60695-2-11 IEC 60335-1 USCAR-2 Rev.6 TABLE OF CONTENTS Nano-Fit Web Page REVISION: E ECR/ECN INFORMATION: EC No: 642212 DATE: 2020/7/29 DOCUMENT NUMBER: PS-105405-001 TITLE: PRODUCT SPECIFICATION FOR NANO-FITTM & WIRE TO BOARD HEADER OF SMT TYPE SHEET No. 4 of 16 CREATED / REVISED BY: CHECKED BY: APPROVED BY: Dixon Li Jonny Zheng Jonny Zheng Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION 4.0 ELECTRICAL PERFORMANCE RATINGS 4.1 VOLTAGE * 250 Volts AC(RMS)/DC * This connector voltage rating meets the connector level provided by the safety agency. 4.2 APPLICABLE WIRES Maximum Insulation Diameter and Applicable Wire Gauges Stranded copper 26 AWG: 1.27 mm MAXIMUM Stranded copper 24 AWG: 1.27 mm MAXIMUM Stranded copper 22 AWG: 1.57 mm MAXIMUM Stranded copper 20 AWG: 1.57 mm MAXIMUM 4.3 MAXIMUM CURRENT RATING Current rating is application dependent and may be affected by the wire rating as listed in UL-60950-1, table 3B. Each application should be evaluated by the end user for compliance to specific safety agency requirements. The ratings listed in the chart below are per Molex test method based on a 30° C maximum temperature rise over ambient temperature and are provided as a guideline. Appropriate de-rating is required based on circuit size, ambient temperature, copper trace size on the PCB, gross heating from adjacent modules/components and other factors that influence connector performance. Wire size & stranding, tin coated or bare copper, wire length & crimp quality are other factors that influence current rating. Wire to Board Current Rating (Amp Max.) AWG Wire Size 20 (As tested with tinned copper wire and gold 15u” plated terminals) Connector fully loaded with all circuits powered Ckt Size(Single row) Ckt Size(Dual row) 2 3 4 5 6 7 8 4 6 8 10 X X X X X X X 7.00 *6.58 *6.17 *5.75 12 *5.33 14 *4.92 16 4.50 22 24 26 X X X *4.67 X X *4.33 X X 4.00 X X X X X X X X X X X X X X X X X X X X 6.00 X X *5.67 X X *5.33 X X *5.00 X X 1) Values are for REFERENCE ONLY. 2) Current deratings are based on not exceeding 30°C Temperature Rise. 3) PCB trace design can greatly affect temperature rise results in Wire-to-Board applications. 4) Data is for all circuits powered. 5) * indicates interpolated information. TABLE OF CONTENTS Nano-Fit Web Page REVISION: E ECR/ECN INFORMATION: EC No: 642212 DATE: 2020/7/29 DOCUMENT NUMBER: PS-105405-001 TITLE: PRODUCT SPECIFICATION FOR NANO-FITTM & WIRE TO BOARD HEADER OF SMT TYPE SHEET No. 5 of 16 CREATED / REVISED BY: CHECKED BY: APPROVED BY: Dixon Li Jonny Zheng Jonny Zheng Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION 4.4 TEMPERATURE Operating temperature (including T-rise from applied current) is rated -40°C to 105°C(for tin) or 115°C(for gold) Field temperatures and field life: Tested per EIA 364-1000.01 to meet field temperature of 65°C for 10 years life per table-8. 4.5 DURABILITY Tin plated: 25 cycles* Gold plated: 50 cycles* * When tested in accordance with EIA-364-1000.01 test method (see Sec. 7.0 of this specification). Durability per EIA-364-09 5.0 QUALIFICATION. Laboratory conditions and sample selection are in accordance with EIA-364-1000.01. TABLE OF CONTENTS Nano-Fit Web Page REVISION: E ECR/ECN INFORMATION: EC No: 642212 DATE: 2020/7/29 DOCUMENT NUMBER: PS-105405-001 TITLE: PRODUCT SPECIFICATION FOR NANO-FITTM & WIRE TO BOARD HEADER OF SMT TYPE SHEET No. 6 of 16 CREATED / REVISED BY: CHECKED BY: APPROVED BY: Dixon Li Jonny Zheng Jonny Zheng Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. PRODUCT SPECIFICATION 6.0 PERFORMANCE. 6.1 ELECTRICAL PERFORMANCE. DESCRIPTION TEST CONDITION REQUIREMENT Contact Resistance EIA 364-23 (LLCR) Subject mated contacts assembled in housing to 20 mV maximum open circuit at 100 mA maximum. Wire resistance shall be 10 milliohms Max(initial) removed from the measured value. * Never cross mate gold plated terminals to tin plated terminals. 6.1.1 6.1.2 Insulation Resistance EIA 364-21 After 500 VDC for 1 minute, measure the insulation resistance between the adjacent contacts of mated and unmated connector assemblies. 1000 Mega ohms MINIMUM 6.1.3 Glow Wire Test IEC 60695-2-12 & IEC 60695-2-13 Test at temperature of 750˚C & 850˚C Flames or glowing of the test specimen extinguish within 30 s after removal of the glow-wire, and there is no ignition of the wrapping tissue placed underneath the test specimen 6.1.4 Dielectric Withstanding Voltage EIA 364-20 Method B Apply 1500 & 1800V DC for 1minute between adjacent terminals. No breakdown current leakage