PRODUCT SPECIFICATION
MILLIGRID
Wire to Board
CONNECTOR SYSTEM
Vertical Header
Receptacle Housing
Series: 151013
Series: 151014
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Table of Contents
ITEM
PAGE
1.0
SCOPE ....................................................................................................................... 3
2.0
PRODUCT DESCRIPTION ........................................................................................ 3
2.1 DESCRIPTION, SERIES NUMBER, AND LINKS ................................... 3
2.2 DIMENSIONS, MATERIALS, PLATINGS ................................................ 3
2.3 ENVIRONMENTAL CONFORMANCE .................................................... 3
2.4 SAFETY AGENCY LISTINGS ................................................................. 3
3.0
APPLICABLE DOCUMENTS AND SPECIFICATION ................................................ 4
3.1 MOLEX DOCUMENTS ............................................................................ 4
3.2 INDUSTRY DOCUMENTS ...................................................................... 4
4.0
ELECTRICAL PERFORMANCE RATINGS ............................................................... 4
4.1 VOLTAGE ................................................................................................ 4
4.2 APPLICABLE WIRES .............................................................................. 4
4.3 CURRENT RATING (MAXIMUM AMPERES) ......................................... 5
4.4 TEMPERATURE ...................................................................................... 5
4.5 DURABILITY ............................................................................................ 5
5.0
QUALIFICATION ........................................................................................................ 5
6.0
PERFORMANCE ........................................................................................................ 6
6.1 ELECTRICAL PERFORMANCE .............................................................. 6
6.2 MECHANICAL PERFORMANCE ............................................................ 7
6.3 ENVIRONMENTAL PERFORMANCE ..................................................... 9
7.0
TEST SEQUENCE GROUPS ................................................................................... 11
8.0
SOLDER INFORMATION ......................................................................................... 12
8.1 SOLDER PROCESS TEMPERATURE ................................................. 12
9.0
PACKAGING ............................................................................................................ 12
10.0 PANEL MOUNT PLACEMENT AND INSTALLATION ............................................. 12
11.0 CABLE TIE AND / OR TWIST TIE LOCATION ........................................................ 13
12.0 POLARIZATION AND KEYING OPTIONS ............................................................... 14
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PRODUCT SPECIFICATION
1.0
SCOPE
This specification covers the performance requirements for 2mm pitch, Dual Row Shrouded Blind Mate
Header and Receptacle with 24 to 30 AWG crimp technology.
2.0
PRODUCT DESCRIPTION
2.1
DESCRIPTION, SERIES NUMBER, AND LINKS
DESCRIPTION
Milligrid 2 mm Pitch Vertical Header
Milligrid 2 mm Receptacle Housing
SERIES NUMBER
151013
151014
The 2mm Grid Wire to Board Connectors comprises of the Crimp Receptacle Housing,151014
series and Crimp Terminal, 50394 series.
2.2
DIMENSIONS, MATERIALS, PLATINGS
See sales drawings for details on dimensions, materials and platings.
2.3
ENVIRONMENTAL CONFORMANCE
To fine product compliance information:
a. Go to molex.com
b. Enter the part number in the search field.
c. At the bottom of the page go to “Environmental” to see compliance status.
2.4
SAFETY AGENCY LISTINGS
UL File Number: UL E29179
CSA Number: 1585720 (LR19980)
CSA approval meets following standards/test procedures:
a) CSA std. C22.2 No. 182.3-M1987
b) UL-1977
* “C” and “US” mark adjacent to CSA signifies that the product has been evaluated to the
applicable CSA and ANSI/UL standards, for use in Canada and US respectively.
CSA (8ckt Fully loaded) NON-current interruption
2.5 Amps @ 125V
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PRODUCT SPECIFICATION
3.0
APPLICABLE DOCUMENTS AND SPECIFICATION
3.1
MOLEX DOCUMENTS
MilliGrid BMI Connectors Test Summary TS
MilliGrid BMI Connectors Application Specification 50394-0002-AS
Molex Solderability Specification SMES-152
Molex Heat Resistance Specification AS-40000-5013
Molex Moisture Technical Advisory AS-45499-001
Molex Package Handling Specification 454990100-PK
3.2
INDUSTRY DOCUMENTS
EIA-364-1000
UL-60950-1
UL-1977
CSA STD. C22.2 NO. 182.3-M1987
4.0
ELECTRICAL PERFORMANCE RATINGS
4.1
VOLTAGE
125 V AC (rms) / DC
4.2
APPLICABLE WIRES
Wire Gage(Stranded copper)
AWG#24 ~ AWG#30
Insulation O.D.
1.4 mm dia. Max.
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4.3
CURRENT RATING (MAXIMUM AMPERES)
Ratings shown represent MAXIMUM current carrying capacity of a fully loaded connector with all
circuits powered in still air. Ratings are based on a 30 °C maximum temperature rise limit over
ambient (room temperature). Current rating is application dependent and below charts are intended
as a guideline. Appropriate de-rating is required depending on factors such as higher ambient
temperature, gross heating from adjacent modules or components and other factors that influence
connector performance.
AWG
#24
#26
#28
#30
4.4
Single Ckt
5.9 A
5.0 A
5.0 A
4.5 A
Fully Loaded (20 Ckts)
2.3 A
2.2 A
2.0 A
1.8 A
TEMPERATURE
Operating Temperature Range
Non-Operating Temperature Range:
: - 40 °C to + 105 °C
: - 40 °C to + 105 °C
Field Temperature and Field Life: 65°C for 3 years (based EIA-364-1000, table 8)
Note: Temperature life test duration (section 6.3. item 2) is based on the assumption that the
contact spends its entire life at the rated field maximum temperature
(based on EIA-364-1000, table 8).
4.5
DURABILITY
Plating Type
Number of Cycles
Gold Plated
25
As tested in accordance with EIA-364-1000 test method (see Sec. 6.2 item 6 of this specification).
Durability per EIA-364-09.
5.0
QUALIFICATION
Laboratory condition, sample selection and test sequences are in accordance with EIA-364-1000.
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6.0
PERFORMANCE
6.1
ELECTRICAL PERFORMANCE
ITEM
DESCRIPTION
TEST CONDITION
REQUIREMENT
6.1.1
Contact
Resistance
(Low Level)
Mate connectors apply a maximum
voltage of 20 mV
and a current of 100 mA.
Per EIA-364-23
40 milliohms
MAXIMUM
6.1.2
Insulation
Resistance
Unmate connectors: Apply 500 VDC for 1
minute, measure the insulation resistance
between adjacent Terminals.
Per EIA-364-21.
1000 Megohms
MINIMUM
6.1.3
Dielectric
Withstanding
Voltage
Unmate connectors: Apply 1000 VAC for
1 minute between adjacent terminals.
Per EIA-364-20
No breakdown
6.1.4
Temperature
Rise
(via Current Cycling)
Mate connectors: measure the
temperature rise at
the rated current after:
1) 96 hours (steady state)
2) 240 hours (45 minutes ON and 15
minutes OFF per hour).
3) 96 hours (steady state)
Temperature rise:
+30 °C MAXIMUM
6.1.5
Contact Resistance on
Crimped Portion
(Receptacle)
Crimp the applicable wire on to the
terminal, measure by dry circuit,
20 mV MAX., 10 mA
5 milliohms Max.
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6.2
MECHANICAL PERFORMANCE
ITEM
DESCRIPTION
6.2.1
Pin Retention Force
(Header)
TEST CONDITION
Apply an axial load on the terminal in
the housing to dislodge the terminals
from the connector at a rate of
0.50 inch per minute
6.2.2
Terminal Mate and
Unmate Forces
Mate and unmate terminal
(male to female) at a rate of
25 ± 6 mm (1 ± ¼ inch) per minute
6.2.3
Crimp Terminal
Insertion Force
(Receptacle)
Insert the crimp terminal into the
housing.
15 N Max.
6.2.4
Crimp Terminal
Retention Force
(in housing)
(Receptacle)
Axial pullout force on the terminal in
the housing at a rate of
25 ± 6 mm (1 ± ¼ inch) per minute
15 N Min.
No dislodge from housing
6.2.5
Panel Mount
Retention
(Receptacle)
Metal panel per RSD-151014-001,
location of connection within the
panel yielding the lowest retention
force applied in the center at
25 ± 6 mm per minute.
25 N Min.
Durability
Mate connectors 25 cycles with
maximum rate of 10 cycles per
minute Per EIA-364-09
20 milliohms Max.
(change from initial)
No evidence of physical
Damage
Vibration
Mate connectors :
Test Condition per EIA-364-28, test
condition VII, test condition letter D
(15 min. in each of 3 mutual
perpendicular directions. Both mating
halves should be rigidly fixed so as
not to contribute to the relative motion
of one contact against another.)
10 milliohms Max.
(change from initial)
&
Discontinuity < 1
microsecond
6.2.7
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8.5 N Min. per pin
(initial)
1.9 N Max. mate
0.35 N Min. unmate Per pin
For Tin Plated Only
(Per Pin)
4 N Max. mate
1 N Min. unmate
6.2.6
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6.2
MECHANICAL PERFORMANCE CONTINUED
ITEM
6.2.8
6.2.9
DESCRIPTION
TEST CONDITION
Mechanical Shock
Mate connectors and shock at 50 g’s
with ½ sine wave (11 milliseconds)
shocks in the ± X, ± Y, ± Z axes
(18 shocks total).
Crimp Wire Pullout
Force (Axial)
(Receptacle)
Fix the crimped terminal, apply axial
pull out force on the wire at the speed
rate of 25 mm ± 3 / minute.
Per JIS C 5402 6.8
AWG #24 = 29.4 N Min.
AWG #26 = 19.6 N Min.
AWG #28 = 9.8 N Min.
AWG #30 = 4.9 N Min.
Reseating
Manually mate and unmate the
connector with the mating half
for 3 cycles with rate of
5 cycles / min maximum.
(EIA-364-09)
Appearance: No damage
Contact Resistance:
20 milliohms Max.
(change from initial)
6.2.10
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REQUIREMENT
10 milliohms Max.
(change from initial)
For Tin Plated Only
20 milliohms Max.
(change from initial)
&
Discontinuity < 1
microsecond
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6.3
ENVIRONMENTAL PERFORMANCE
ITEM
DESCRIPTION
6.3.1
TEST CONDITION
Mate connectors; expose to
5 cycles of:
Temp °C
Duration (Minutes)
-55 + 0/-3
30
+25 ± 10
5 MAXIMUM
+85 + 3/-0
30
+25 ± 10
5 MAXIMUM
Per EIA 364-32 condition I
Thermal Shock
20 milliohms Max.
(change from initial)
&
Visual: No Damage
20 milliohms Max.
(change from initial)
&
Dielectric Withstanding
Voltage:
No Breakdown at 500 VAC
&
Insulation Resistance:
1000 Megohms Min.
&
Visual: No Damage
Temperature Life
Humidity
(Cyclic)
24 cycles at temperature 25 ± 3 °C at
80 ± 3% relative humidity and
65 ± 3 °C at 50 ± 3% relative
humidity; dwell time of 1.0 hour;
ramp time of 0.5 hours. Dwell times
start when the temperature and
humidity have stabilized within the
specified levels.
6.3.4
Thermal Cycling
(Tin Plated only)
Cycle the connector between
15 °C ± 3 °C and 85 °C ± 3 °C,
as measured on part.
Ramps should be minimum of 2 °C
per minute, and dwell times should
ensure that the contacts reach the
temperature extremes
(a minimum of 5 minutes)
Humidity is not controlled.
Perform 500 such cycles.
(EIA-364-110)
Appearance: No damage
Contact Resistance:
20 milliohms Max.
(change from initial)
6.3.5
Solderability
(Header)
Solder Time: 5 +/- 0.5 secs.
Solder Temperature: 260 +/- 5 °C
95% of the immersed area
must show no voids, pin
holes.
6.3.3
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20 milliohms Max.
(change from initial)
&
Visual: No Damage
Mate connectors; expose to:
96 hours at 105 ± 2 °C
Per EIA 364-17
6.3.2
REVISION:
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6.3
ENVIRONMENTAL PERFORMANCE CONTINUED
ITEM
DESCRIPTION
6.3.6
Resistance to
Soldering Heat
(Header)
TEST CONDITION
Solder tail to be dipped in flux as per
MIL-STD-202 F
method 210 condition B.
Solder Temperature: 260 +/- 5 °C
Solder Time: 10 +/- 1 secs
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REQUIREMENT
No damage in appearance
of the connector
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PRODUCT SPECIFICATION
7.0
TEST SEQUENCE GROUPS
Test Group
A
B
C
D
E
F
G
H
I
J
K
L
M
1
1
1,5
1
1
1
1
1,8
1
1
1
1
1
Test or Examination
Examination of the connector(s)
Contact Resistance
(Low Level) (LLCR)
3,5, 3,5, 3,5,
7
7 7,9
4,8
Insulation Resistance
3,6
Dielectric Withstanding Voltage
4,7
Temperature Rise (via Current Cycling)
2,5,
7,9
4
Contact Resistance on Crimped Portion
(Receptacle)
2
Pin Retention Force (in housing)
(Header)
2
Terminal Mate Force
3,7
Terminal Unmate Force
5,9
Crimp Terminal Insertion Force
(Receptacle)
2
Crimp Terminal Retention Force
(in housing)(Receptacle)
3
Panel Mount Retention (Receptacle)
2
Durability
6
3
4
4
4
Vibration
6
Mechanical Shock
8
Crimp Wire Pullout Force (Axial)
(Receptacle)
3(a)
2
Humidity (cyclic)
5
Temperature Life
6
Thermal Shock
4(a)
6
Resistance to Soldering Heat (Header)
2
2
2
2
2
2
Solderability (Header)
2
Thermal Cycling (Tin plated)
6
Reseating
8
Note:
(a) Preconditioning
- Durability: 5 cycles
- Temperature Life: 48 hours
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8.0
SOLDER INFORMATION
Per SMES-152 and AS-40000-5013
*These specifications establish standard solderability test methods used to evaluate a products ability to
accept molten solder. Solder Process Temperatures and Reflow Solder Profiles will vary based on
application, equipment, solder paste, PCB thickness, etc.
8.1
SOLDER PROCESS TEMPERATURE
Wave Solder: 260 °C Max
9.0
PACKAGING
Parts shall be packaging to protect the parts from damage during standard shipping, storage, and handling.
Refer to Packaging Specification, PK-151013-0001 and PK-151014-0001 for packaging details.
10.0
PANEL MOUNT PLACEMENT AND INSTALLATION
Connector shall be placed according to the unlocked position before installation.
The connector shall be then pushed towards the locked position as shown.
Do not mount using crimped wires.
Bracket to be inserted one time only
Unlocked Position
Locked Position
Connector
Bracket
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11.0
CABLE TIE AND / OR TWIST TIE LOCATION
The “T” dimension defines a “free” length of wire, or a length of wire that is not subject to significant bias by
external factors such as a wire tie, wire twisting, or other means of bending or deforming of the wires that
repositions them from their natural relaxed state or location where they enter the housing. Wires are to be
dressed in such a manner to allow the terminals to float freely in the pocket. This dimension is general
recommendation and may need to be adjusted for different wire gauges and wire type and insulation
thickness and insulation material.
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12.0
POLARIZATION AND KEYING OPTIONS
12.1
VERTICAL HEADER (Series: 151013)
12.2
RECEPTACLE HOUSING (Series: 151014)
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