1714001038

Impel Backplane Connectors Delivering industry-leading signal integrity and density while providing a scalable price and performance path for future data-rate enhancements, the Impel Backplane Connectors and Customized Cable Assemblies enables OEM equipment to operate at today’s data rates Features and Advantages IEEE 10GBASE-KR and Optical Internetworking Forum (OIF) stat eye compliant channel Demonstrates end-to-end channel performance compliance Staggered header pin interface Provides robust mechanical isolation from the signal pins. Mitigates the concern for bent pins in the field. Provides first-mate-last-break capabilities Compact, compliant-pin backplane and daughtercard connectors with data rates scalable from 25 to 40 Gbps Enables backward and forward compatibility with various high-end Copper and cable architectures Impel Connector technology with tightly coupled differential-pair structure Provides optimal signal integrity and mechanical isolation through the connector system Impel Header, 6-by-16 Differential Pairs Enhanced 0.36mm plated-through-hole diameter Meets manufacturing aspect ratio while providing improved electrical performance 90 Ohms nominal impedence Minimizes impedance discontinuities in the channel Multiple pitch options available: • 1.90mm-pitch broad-edge-coupled • 2.35mm-pitch orthogonal • 3.00mm-pitch quad-route Delivers superior density and electrical performance, low crosstalk, low insertion loss and minimal performance variations across all channels and frequencies to 20 GHz. Offers printed circuit board designers the flexibility to quad route the signal traces (two pairs per layer), reducing the PCB layer count Two compliant-pin attach options and 18 to 72 differential pairs per orthogonal node Provide customers ultimate flexibility to optimize their designs for superior mechanical and electrical performance Custom cable assemblies available Provides a full channel solution for all Impel headers and receptacles. Provides design flexibility per application specifications Impel Backplane Connectors Skewless design Eliminates the need for compensating connector skew on PCB routing Impel Backplane Connectors Applications Telecommunications/Networking Central Office Switches Routers Cellular Infrastructure and Multi-Platform Service (DSL, Cable Data) Data Center Solutions Servers High-End Server Storage Systems Specifications PHYSICAL Housing: LCP Contact: Copper Alloy Plating: Contact Area — 30μ Compliant Pin Area — select Matte Tin Underplating — Nickel PCB Thickness (min.): 1.00mm Operating Temperature: -40 to +105°C Dielectric Withstanding Voltage: Headers/Receptacles: 500V AC Cable Assembly: 300V DC Insulation Resistance — Daughtercard Receptacle: 500V REFERENCE INFORMATION Packaging: Tray UL File No.: E28179 Mates with: See Ordering Information chart below Designed In: Millimeters RoHS: Yes Halogen Free: Yes MECHANICAL Insertion Force to PCB: Backplane Header — 26.69N Daughtercard Receptacle — 17.80N Mating Force: 60g per signal; 80g per shield Unmating Force (min.): 15g Durability (min.): 200 cycles ELECTRICAL Voltage — Daughtercard Receptacle (max.): 150V AC RMS Cable Assembly (max.): 30V AC RMS Current (max.): 0.75A Contact Resistance (max.): 100mA; 20mV Ordering Information Backplane Headers* Series No. Daughtercard Receptacles Series No. Application Pitch (mm) Pairs 171755 171760 Quad Route 3.00 6 172005 172010 Standard 1.90 5 171315 171990 Standard 1.90 4 171745 171750 Standard 1.90 2 171495* 171500 Orthogonal 1.85/2.35mm 6 171335 171320 Standard 1.90 3 171325 171329 Quad Route 3.00 4 171395 171400 Standard 1.90 6 *Midplane Headers Series No. 172130 171740 Custom Component Right-Angle Male Cable Assembly Application Pitch (mm) Pairs Standard 1.90 6 Orthogonal 2.35 6 - - - www.molex.com/link/impel.html Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners. Order No. 987650-8371 Rev. 5 USA/0k/GF/2020.07 ©2020 Molex