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172258-3116

172258-3116

  • 厂商:

    MOLEX10(莫仕)

  • 封装:

    -

  • 描述:

    172258-3116

  • 数据手册
  • 价格&库存
172258-3116 数据手册
APPLICATION SPECIFICATION 1.0 SCOPE This specification covers the requirements for the application of Ultra-Fit Tangless 3.50 mm pitch wire to board connector systems. 2.0 PRODUCT NAME AND SERIES NUMBERS Ultra-Fit Tangless Female Crimp Terminal Ultra-Fit Tangless Receptacle Housing TPA Tangless Ultra-Fit Vertical Header Ultra-Fit Right Angle Header 172253 172256 / 172258 172264 172286 / 172287 / 172298 / 172299 172310 / 172316 3.0 REFERENCE DOCUMENTS See the appropriate sales drawings for information on specific part numbers and materials. 4.0 GENERAL APPLICATION NOTES Appearance:  Parts conform to class "B" requirements of cosmetic specification PS-45499-002 except where noted on the sales drawings. Connector Application  This connector system is designed to mate gold plating to gold plating OR tin plating to tin plating. Never cross mate tin plated parts to gold plated parts.  This connector system is not designed for current sharing (i.e. splitting one current load across multiple circuits)  Connectors are not to be mated or unmated while circuits are live except per the current interrupt rating listed in product specification: PS-172323-0001 Packaging  The parts should remain in the original Molex packaging until ready for use to prevent damage. Chemical Exposure  Do not store terminals or header assemblies near any chemicals listed below as they may cause corrosion in the terminal contacts. Alkalies Amines REVISION: B Ammonia Carbonates Citrates Nitrites ECR/ECN INFORMATION: EC No: 642405 DATE: 7/29/2020 DOCUMENT NUMBER: 1723230003 Phosphates Citrates Sulfur Nitrites Sulfur Compounds Tartrates TITLE: APPLICATION SPECIFICATION FOR SHEET No. ULTRA-FIT WIRE TO BOARD 1 of 8 CONNECTOR SYSTEM CREATED ABCDEFGHIJKLMNOPQRSTUVWX / REVISED BY: CHECKED BY: APPROVED BY: Dixon Li Jonny. Zheng Jonny. Zheng TEMPLATE FILENAME: APPLICATION_SPEC[SIZE_A](V.1).DOC APPLICATION SPECIFICATION Crimped Terminal Extraction  Female terminal extraction tool: See Molex part# 011-03-0016 instructions online on website. Do not reuse terminals that have been removed with the extraction tool. The receptacle housing can be reused if it was not damaged. Minimum wire bend, cable tie or twist location Circuit Sizes 2 4-6 8 10-12 14-16 Dim T Min. (single row) .50” (12.7 mm) .75” (19.1 mm) 1.00” (25.4 mm) Dim T Min. (dual row) .75” (19.1 mm) 1.25” (31.75 mm) 1.25” (31.75 mm) The “T” dimension defines a “free” length of wire, or a length of wire that is not subject to significant bias by external factors such as a wire tie, wire twisting, or other means of bending or deforming of the wires that repositions them from their natural relaxed state or location where they enter the housing. This dimension is a general recommendation and may need to be adjusted for different wire gauges and wire type and insulation thickness and insulation material.  Wires are to be dressed in such a manner to allow the terminals to float freely in the receptacle pocket.  Connector Testing  Do not use Ultra-Fit connectors as test parts, they are not intended to be used with repeated mating. Follow durability cycles as listed in PS-172323-0001 REVISION: B ECR/ECN INFORMATION: EC No: 642405 DATE: 7/29/2020 DOCUMENT NUMBER: 1723230003 TITLE: APPLICATION SPECIFICATION FOR SHEET No. ULTRA-FIT WIRE TO BOARD 2 of 8 CONNECTOR SYSTEM CREATED ABCDEFGHIJKLMNOPQRSTUVWX / REVISED BY: CHECKED BY: APPROVED BY: Dixon Li Jonny. Zheng Jonny. Zheng TEMPLATE FILENAME: APPLICATION_SPEC[SIZE_A](V.1).DOC APPLICATION SPECIFICATION Crimped Terminal Insertion  Terminals are inserted in same direction as below picture for both single row and dual row.  DO NOT reuse receptacle housing if a crimped terminal was pushed out without an extraction tool. Single Row Receptacle – Terminal position into the housing Array arrangement Dual Row Receptacle – Terminal position into the housing REVISION: B ECR/ECN INFORMATION: EC No: 642405 DATE: 7/29/2020 DOCUMENT NUMBER: 1723230003 TITLE: APPLICATION SPECIFICATION FOR SHEET No. ULTRA-FIT WIRE TO BOARD 3 of 8 CONNECTOR SYSTEM CREATED ABCDEFGHIJKLMNOPQRSTUVWX / REVISED BY: CHECKED BY: APPROVED BY: Dixon Li Jonny. Zheng Jonny. Zheng TEMPLATE FILENAME: APPLICATION_SPEC[SIZE_A](V.1).DOC APPLICATION SPECIFICATION TPA Feature Locking feature  Ensure terminals are fully seated and locked during terminal insertion to the receptacle housing TPA Assembly over the wires Crimp Terminal Appearance REVISION: B ECR/ECN INFORMATION: EC No: 642405 DATE: 7/29/2020 DOCUMENT NUMBER: 1723230003 TITLE: APPLICATION SPECIFICATION FOR SHEET No. ULTRA-FIT WIRE TO BOARD 4 of 8 CONNECTOR SYSTEM CREATED ABCDEFGHIJKLMNOPQRSTUVWX / REVISED BY: CHECKED BY: APPROVED BY: Dixon Li Jonny. Zheng Jonny. Zheng TEMPLATE FILENAME: APPLICATION_SPEC[SIZE_A](V.1).DOC APPLICATION SPECIFICATION  Forming marks on female terminal are normal. These are due to stretching of the plating during the forming process and are superficial cracks on the plating surface. Forming Marks Crimp Terminal Function  DO NOT use terminals with damaged front face: Normal Square Front Box REVISION: B ECR/ECN INFORMATION: EC No: 642405 DATE: 7/29/2020 DOCUMENT NUMBER: 1723230003 Damaged Front Box TITLE: APPLICATION SPECIFICATION FOR SHEET No. ULTRA-FIT WIRE TO BOARD 5 of 8 CONNECTOR SYSTEM CREATED ABCDEFGHIJKLMNOPQRSTUVWX / REVISED BY: CHECKED BY: APPROVED BY: Dixon Li Jonny. Zheng Jonny. Zheng TEMPLATE FILENAME: APPLICATION_SPEC[SIZE_A](V.1).DOC APPLICATION SPECIFICATION Crimp Terminal Handling  Due to exposed terminal interface, keep crimp terminals on prepackaged reel until they are crimped onto wires. Do not precut and bulk pack terminals due to risk of damaging the contact interface. Store and handle crimped terminals so the interface does not make contact with other terminals or foreign objects. If terminal interface is damaged please discard prior to assembly. Crimping  For acceptable crimp tools and specifications see application tooling section on Molex.com listed for each terminal part number.  Use with multi strand wire only. Single strand wire should not be used.  This female crimp terminal is designed for single wire crimping only, no double wire crimping is allowed.  Use only Molex specified crimp tooling, refer to Molex.com for acceptable crimp tooling. Crimped terminals must also meet Molex crimp specifications. Using crimp tooling/specifications other than specified voids any product warranties and will negatively impact mechanical and electrical performance. Header Appearance  Discoloration in the bandolier carrier area of the pin is inherent to the plating process and is due to the masking effect of the carrier. This discoloration is in a non-functional area of the pin and will not affect the performance of the header assembly. Refer to cosmetic specification PS-45499002. Right Angle Header Appearance  Forming marks on header pins are acceptable. Refer to cosmetic specification PS-45499-002. REVISION: B ECR/ECN INFORMATION: EC No: 642405 DATE: 7/29/2020 DOCUMENT NUMBER: 1723230003 TITLE: APPLICATION SPECIFICATION FOR SHEET No. ULTRA-FIT WIRE TO BOARD 6 of 8 CONNECTOR SYSTEM CREATED ABCDEFGHIJKLMNOPQRSTUVWX / REVISED BY: CHECKED BY: APPROVED BY: Dixon Li Jonny. Zheng Jonny. Zheng TEMPLATE FILENAME: APPLICATION_SPEC[SIZE_A](V.1).DOC APPLICATION SPECIFICATION Header Assembly to Board  Headers are designed with press fit pegs and need to be pushed into the circuit board.  Header should be flush with board after insertion.  See below for solder process information. Solder Process Temperatures  Wave Solder: 260°C Max  Reflow Solder: 260°C Max Reflow Soldering Profile  See AS-40000-5013 Plated Thru Hole profile  Keep outer ring at 5 mils max with at least 20 mils distance between adjacent metal pads MIN MAX REVISION: B ECR/ECN INFORMATION: EC No: 642405 DATE: 7/29/2020 DOCUMENT NUMBER: 1723230003 TITLE: APPLICATION SPECIFICATION FOR SHEET No. ULTRA-FIT WIRE TO BOARD 7 of 8 CONNECTOR SYSTEM CREATED ABCDEFGHIJKLMNOPQRSTUVWX / REVISED BY: CHECKED BY: APPROVED BY: Dixon Li Jonny. Zheng Jonny. Zheng TEMPLATE FILENAME: APPLICATION_SPEC[SIZE_A](V.1).DOC APPLICATION SPECIFICATION Wave Solder Direction  Preferred wave solder direction: REVISION: B ECR/ECN INFORMATION: EC No: 642405 DATE: 7/29/2020 DOCUMENT NUMBER: 1723230003 TITLE: APPLICATION SPECIFICATION FOR SHEET No. ULTRA-FIT WIRE TO BOARD 8 of 8 CONNECTOR SYSTEM CREATED ABCDEFGHIJKLMNOPQRSTUVWX / REVISED BY: CHECKED BY: APPROVED BY: Dixon Li Jonny. Zheng Jonny. Zheng TEMPLATE FILENAME: APPLICATION_SPEC[SIZE_A](V.1).DOC
172258-3116 价格&库存

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