1722581004

PRODUCT SPECIFICATION ULTRA-FIT™ WIRE-TO-BOARD CONNECTOR SYSTEM Receptacle Housing REVISION: A5 Dual Row: 172258/172262 Single Row: 172256/172260 TPA Receptacle Terminal 172264/172268 172253 ECR/ECN INFORMATION: EC No:UCP2016-0922 DATE: 08/28/2015 DOCUMENT NUMBER: PS-172323-0001 TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT™ WIRE TO BOARD CONNECTOR SYSTEM SHEET No. 1 of 16 CREATED / REVISED BY: CHECKED BY: APPROVED BY: PPEREZ RHODGE RHODGE FILENAME: PS75431r0.DOC PRODUCT SPECIFICATION Header – Vertical Dual Row with Kinked Pins Dual Row: 172298 Single Row: 172286 Header – Vertical Dual Row with Solder Clip Dual Row: 172299 Single Row: 172287 Header – Right Angle Dual Row: 172316 REVISION: A5 ECR/ECN INFORMATION: EC No:UCP2016-0922 DATE: 08/28/2015 DOCUMENT NUMBER: PS-172323-0001 TITLE: Single Row: 172310 PRODUCT SPECIFICATION FOR ULTRA-FIT™ WIRE TO BOARD CONNECTOR SYSTEM SHEET No. 2 of 16 CREATED / REVISED BY: CHECKED BY: APPROVED BY: PPEREZ RHODGE RHODGE FILENAME: PS75431r0.DOC PRODUCT SPECIFICATION Table of Contents 1.0 SCOPE 3 2.0 PRODUCT DESCRIPTION 2.1 Product Name and Series Numbers 2.2 Dimensions, Materials, Plating and Markings 2.3 Safety Agency Approvals 3 3 3 3 3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS 3.1 Molex Documents 3.2 Industry Documents 4 4 4 4.0 ELECTRICAL PERFORMANCE RATINGS 4.1 Voltage 4.2 Applicable Wires 4.3 Maximum Current Rating 4.4 Temperature 4.5 Durability 4.6 Current Interruption 4 4 5 5 6 6 7 5.0 QUALIFICATION 7 6.0 PERFORMANCE 6.1 Electrical Performance 6.2 Mechanical Performance 6.3 Environmental Performance 7 7 8 10 7.0 TEST SEQUENCE GROUPS 12 8.0 SOLDER INFORMATION 8.1 Solder Process Temperature 8.2 Reflow Solder Profile 14 14 14 REVISION: A5 ECR/ECN INFORMATION: EC No:UCP2016-0922 DATE: 08/28/2015 DOCUMENT NUMBER: PS-172323-0001 TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT™ WIRE TO BOARD CONNECTOR SYSTEM SHEET No. 3 of 16 CREATED / REVISED BY: CHECKED BY: APPROVED BY: PPEREZ RHODGE RHODGE FILENAME: PS75431r0.DOC PRODUCT SPECIFICATION 1.0 SCOPE This Product Specification covers Ultra-Fit® 3.50 mm pitch wire to board connector systems with gold and tin plating. Receptacles are terminated with 22 to 16 AWG wire using crimp technology. 2.0 PRODUCT DESCRIPTION 2.1 PRODUCT NAME AND SERIES NUMBER (S) Table 1 – WIRE-TO-BOARD Description Receptacle Crimp Terminal Receptacle Housing, Single Row Receptacle Housing, Single Row TPA Vertical Header Single Row, Kinked Pins Vertical Header Single Row, Solder Clips Vertical Header Dual Row, Kinked Pins Vertical Header Dual Row, Solder Clips Right Angle Header Single Row Right Angle Header Dual Row 2.2 Series Number 172253 172256/172260 172258/172262 172264/172268 172286 172287 172298 172299 172310 172316 DIMENSIONS, MATERIALS, PLATING AND MARKINGS Dimensions & Plating: See individual sales drawings. Material: RoHS compliant materials. 2.3 SAFETY AGENCY APPROVALS 2.3.1 REVISION: A5 UL File Number: E29179 UL (fully loaded) NON-current interruption Current interruption per UL1977 14 Amps @ 400V (16 AWG wire) 14 Amps @ 48V AC (16 AWG wire) ECR/ECN INFORMATION: EC No:UCP2016-0922 DATE: 08/28/2015 DOCUMENT NUMBER: PS-172323-0001 TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT™ WIRE TO BOARD CONNECTOR SYSTEM SHEET No. 4 of 16 CREATED / REVISED BY: CHECKED BY: APPROVED BY: PPEREZ RHODGE RHODGE FILENAME: PS75431r0.DOC PRODUCT SPECIFICATION 2.3.2 IEC License Number per IEC / EN 61984: TBD IEC (fully loaded) NON-current interruption 14 Amps @ 400V (16 AWG wire) 2.3.3 File Number*: 70022376 (LR19980) CSA approval meets following standards/test procedures: * “C” and “US” mark adjacent to CSA signifies that the product has been evaluated to the applicable CSA and ANSI/UL standards, for use in Canada and US respectively. CSA (single circuit) NON-current interruption 14 Amps @ 400V (16 AWG wire) 3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS 3.1 MOLEX DOCUMENTS See series specific sales drawings and the other sections of this specifications for the necessary referenced documents and specifications. Ultra-Fit Test Summary TS-172323-0001 Molex Solderability Specification SMES-152 Molex Heat Resistance Specification AS-40000-5013 3.2 REVISION: A5 INDUSTRY DOCUMENTS EIA-364-1000.01 UL-60950-1 UL-1977 CSA STD. C22.2 NO. 182.3-M1987 IEC / EN 61984 USCAR-2 REV.6 ECR/ECN INFORMATION: EC No:UCP2016-0922 DATE: 08/28/2015 DOCUMENT NUMBER: PS-172323-0001 TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT™ WIRE TO BOARD CONNECTOR SYSTEM SHEET No. 5 of 16 CREATED / REVISED BY: CHECKED BY: APPROVED BY: PPEREZ RHODGE RHODGE FILENAME: PS75431r0.DOC PRODUCT SPECIFICATION 4.0 ELECTRICAL PERFORMANCE RATINGS 4.1 VOLTAGE * 400 Volts AC (RMS) or 400 Volts DC max. * This connector voltage meets the connector level provided by the safety agency. For application voltage requirements per UL-60950 or other standards, the creepage & clearance also needs to be determined based upon pads/traces on the PCB. 4.2 APPLICABLE WIRES Stranded copper 16 AWG: Stranded copper 18 AWG: Stranded copper 20 AWG: Stranded copper 22 AWG: Maximum Insulation Diameter and Applicable Wire Gauges 4.3 2.39mm 2.03mm 1.78mm 1.57mm MAXIMUM MAXIMUM MAXIMUM MAXIMUM MAXIMUM CURRENT RATING Current rating is application dependent and may be affected by the wire rating such as listed in UL-609501. Each application should be evaluated by the end user for compliance to specific safety agency requirements. The ratings listed in the chart below are per Molex test method based on a 30° C maximum temperature rise over ambient temperature and are provided as a guideline. Appropriate de-rating is required based on circuit size, ambient temperature, copper trace size on the PCB, gross heating from adjacent modules/components and other factors that influence connector performance. Wire size, insulation thickness, stranding, tin coated or bare copper, wire length & crimp quality are other factors that influence current rating. Wire to Board Current Rating (Amp Max.) (Tested with TIN plated terminals) Connector fully loaded with all circuits powered Circuit Size (Single Row) Circuit Size (Dual Row) AWG Wire Size 2 3 4 5 6 7 8 4 6 8 10 12 14 16 16 14 12.8* 12.1* 11.5* 11.1* 10.7* 11 12 11.1* 11* 10.5* 10.3* 10* 10 18 12.6* 11.6* 10.9* 10.4* 9.9* 9.5* 9.2* 10.9* 9.9* 9.2* 8.6* 8.2* 7.8* 7.5* 20 11.5* 10.5* 9.8* 9.2* 8.8* 8.4* 8.1* 9.8* 8.8* 8.1* 7.5* 7* 6.7* 6.3* 22 9 8.8* 8.6* 8.1* 7.6* 7.3* 7 8 7.6* 6.9* 6.4* 5.9* 5.5* 5 Temperature Rise vs. Current per EIA-364-70 Tested with UL1061 Tinned Wire and PCB with 2oz. Copper Traces of 1.8mm width and 3.5mm length. *Extrapolated from test data. REVISION: A5 ECR/ECN INFORMATION: EC No:UCP2016-0922 DATE: 08/28/2015 DOCUMENT NUMBER: PS-172323-0001 TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT™ WIRE TO BOARD CONNECTOR SYSTEM SHEET No. 6 of 16 CREATED / REVISED BY: CHECKED BY: APPROVED BY: PPEREZ RHODGE RHODGE FILENAME: PS75431r0.DOC PRODUCT SPECIFICATION Wire to Board Current Rating (Amp Max.) (Tested with GOLD plated terminals) Connector fully loaded with all circuits powered AWG Wire Size Circuit Size (Single Row) Circuit Size (Dual Row) 2 3 4 5 6 7 8 4 6 8 10 12 14 16 16 12 11.2* 11 10.7* 10.5* 10.3* 10 11 9.6* 9 8.5* 8* 7.7* 7 18 11* 10.1* 9.5* 9* 8.6* 8.2* 7.9* 9.5* 8.6* 7.9* 7.4* 7* 6.6* 6.3* 20 10* 9.1* 8.4* 7.9* 7.5* 7.2* 6.9* 8.4* 7.5* 6.9* 6.4* 6* 5.6* 5.3* 22 8 7.7* 7.4* 6.9* 6.5* 6.1* 6 6 5.8* 5.5* 5.3* 5.2* 5.1* 5 Temperature Rise vs. Current per EIA-364-70 Tested with UL1061 Tinned Wire and PCB with 2oz. Copper Traces of 1.8mm width and 3.5mm length. *Extrapolated from test data. 4.4 TEMPERATURE TIN plated Max. operating temperature range (including T-rise from applied current) is -40°C to 105°C. Field temperatures and field life: Tested per EIA 364-1000.01 to meet field temperature of 65°C for 10 years life per table-8. GOLD plated Max. operating temperature range (including T-rise from applied current) is -40°C to 120°C, thermal aging at 120°C for 1000 hours. Field temperatures and field life: Tested per EIA 364-1000.01 to meet field temperature of 85°C for 10 years or 95°C for 7 years life per table-8. 4.5 DURABILITY Tin plated: 25 mating cycles Gold plated: 200 mating cycles As tested in accordance with EIA-364-1000.01 test method (see Sec. 7.0 of this specification). Durability per EIA-364-09. 48 Volt AC @ 14 Amp Tested at 48 volt AC with a current of 14 Amp hot-plug test conducted with all circuits powered with 16 AWG wire per UL1977 with tin plated contacts. 5.0 QUALIFICATION Laboratory conditions and sample selection are in accordance with EIA-364-1000.01 REVISION: A5 ECR/ECN INFORMATION: EC No:UCP2016-0922 DATE: 08/28/2015 DOCUMENT NUMBER: PS-172323-0001 TITLE: PRODUCT SPECIFICATION FOR ULTRA-FIT™ WIRE TO BOARD CONNECTOR SYSTEM SHEET No. 7 of 16 CREATED / REVISED BY: CHECKED BY: APPROVED BY: PPEREZ RHODGE RHODGE FILENAME: PS75431r0.DOC PRODUCT SPECIFICATION 6.0 PERFORMANCE 6.1 ELECTRICAL PERFORMANCE DESCRIPTION TEST CONDITION REQUIREMENT Mate connectors, apply a maximum voltage of 20 mV and a current of 100 mA (measurement locations shown) Per EIA-364-23 Wire resistance and traces shall be removed from the measured value. Maximum (Initial): Tin: 2 m 15µ” & 30µ” Gold: 3 m Initial Contact Resistance (Low Level) REVISION: A5  Contact Resistance @Rated Current (Voltage Drop) Mate connectors; apply the rated current. Per EIA-364-70 Maximum: Tin: 5 m 15µ” & 30µ” Gold: 7 m Insulation Resistance Apply 500 VDC between adjacent terminals or ground. Per EIA-364-21 1,000 M  minimum Dielectric Withstanding Voltage Apply 1800 VAC for 1 minute between adjacent terminals. Per EIA-364-20 No breakdown Current leakage