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1733000106

1733000106

  • 厂商:

    MOLEX10(莫仕)

  • 封装:

    -

  • 描述:

    SPEEDEDGE60CKTRECEPT

  • 详情介绍
  • 数据手册
  • 价格&库存
1733000106 数据手册
APPLICATION SPECIFICATION 1.0 OVERVIEW OF THE CONNECTOR SpeedEdge is a line of Board to Board Connectors that connect one printed circuit board to another printed circuit board to which it’s parallel; this type of connector is also known as a “mezzanine” connector. SpeedEdge is primarily for high speed Differential signals, but is also appropriate for Single-Ended signals, Low Speed signals and Power connections. SpeedEdge can be made in varying heights to accommodate varying separation distances between two parallel boards in a variety of circuit sizes: 22, 60 & 82. Check with Molex for availability. Plug Receptacle Figure 1: SpeedEdge connectors REVISION: A ECM INFORMATION: EC No: 120635 DATE: 2017 /03/ 29 DOCUMENT NUMBER: AS-173300-0001 TITLE: ROUTING GUIDELINE FOR SPEEDEDGE MEZZANINE CONNECTORS SHEET No. 1 of 9 CREATED / REVISED BY: CHECKED BY: APPROVED BY: WHFOO WTCHUA NDYTKO APPLICATION SPECIFICATION 2.0 PCB DESIGN REQUIREMENTS AND ROUTING STRATEGIES Board Design Considerations for SpeedEdge 2.1. Recommended Footprint Design Considerations 1. The SpeedEdge terminals are arranged in dual lines. Refer to applicable sales drawings for more information. 2. Footprint optimization helps to improve electrical performance. Blind vias for signal routing are recommended to achieve best performance. Board stack-up illustrated are referenced to 8 layers board stack-up. Host board and plug board signals are routed with striplines on L2. Edge card signals are routed with striplines on L2 and L7. 3. On host boards and plug boards, ground voids are on L3 ground plane for better impedance control. Ground strip is used in L3 for good ground return. 4. Plug board includes linear ground via array for improved isolation between front and back rows. Pin #1 Pin #30 Antipad Ground strip Ground void Pin #60 Pin #31 Pin #30 Figure 2: 60 Circuits receptacle footprint pattern Ground strip Antipad Linear ground via array Pin #1 Ground void Pin #60 Pin #31 Figure 3: 60 Circuits plug footprint pattern Pin #60 Pin #31 Edge Card Front All Ground plane layers recessed Edge Card Back All Ground plane layers recessed Pin #30 Pin #1 Figure 4: 60 Circuits edge card footprint pattern REVISION: A ECM INFORMATION: EC No: 120635 DATE: 2017 /03/ 29 DOCUMENT NUMBER: AS-173300-0001 TITLE: ROUTING GUIDELINE FOR SPEEDEDGE MEZZANINE CONNECTORS SHEET No. 2 of 9 CREATED / REVISED BY: CHECKED BY: APPROVED BY: WHFOO WTCHUA NDYTKO APPLICATION SPECIFICATION 2.2. Example of Connector Pin configuration pattern 22 Circuits 60 Circuits 82 Circuits Figure 5: Example of SpeedEdge pinout pattern 2.3. Recommended Anti-pad, Ground Strip and Ground Void Dimensions for SpeedEdge Footprint: 1. The anti-pads are rectangular in shape. For Top layer, anti-pad is a single rectangle. For L3 ground void, two rectangular voids are located beneath the SMT pads. 2. The size of the rectangle and the distance of the additional ground vias are tuned to get 100 ohm impedance. 3. Recommended anti-pad dimensions top layer are shown in Table 1. 4. Recommended L2 differential trace and ground strip dimensions are shown in Table 2. 5. Recommended ground void dimensions for L3 layer are shown in Table 3. 6. Recommended ground recess dimensions for Edge Card are shown in Table 4. Blind signal vias Figure 6: Anti-pad with trace and ground strip REVISION: A ECM INFORMATION: EC No: 120635 DATE: 2017 /03/ 29 DOCUMENT NUMBER: AS-173300-0001 TITLE: Figure 7: Anti-pad with only ground plane ROUTING GUIDELINE FOR SPEEDEDGE MEZZANINE CONNECTORS SHEET No. 3 of 9 CREATED / REVISED BY: CHECKED BY: APPROVED BY: WHFOO WTCHUA NDYTKO APPLICATION SPECIFICATION Top Layer Anti-pad Design W Top layer H Figure 8: Receptacle anti-pad dimensions Top layer W H W1 D Figure 9: Plug anti-pad dimensions Summary for recommended dimensions Feature Receptacle Plug Ground via drill size diameter Anti-pad height, H Anti-pad width, W Via array distance, D Via array drill size diameter Via array trace width, W1 0.25mm 1.7mm 1.95mm N/A 0.20mm N/A 0.25mm 2.34mm 1.95mm 0.80mm 0.20mm 0.1016mm Table 1 REVISION: A ECM INFORMATION: EC No: 120635 DATE: 2017 /03/ 29 DOCUMENT NUMBER: AS-173300-0001 TITLE: ROUTING GUIDELINE FOR SPEEDEDGE MEZZANINE CONNECTORS SHEET No. 4 of 9 CREATED / REVISED BY: CHECKED BY: APPROVED BY: WHFOO WTCHUA NDYTKO APPLICATION SPECIFICATION L2 Layer Differential Trace & Ground Strip Design L2 layer Sd Wd W2 Figure 10: Receptacle board differential trace and ground strip dimensions Sg L2 layer Wd W2 Figure 11: Plug board differential trace and ground strip dimensions Summary for recommended dimensions Feature Ground strip width, W2 Differential trace width, Wd Differential trace gap, Sg Receptacle Plug 0.13mm 0.15mm 0.17mm 0.1016mm 0.15mm 0.17mm Table 2 REVISION: A ECM INFORMATION: EC No: 120635 DATE: 2017 /03/ 29 DOCUMENT NUMBER: AS-173300-0001 TITLE: ROUTING GUIDELINE FOR SPEEDEDGE MEZZANINE CONNECTORS SHEET No. 5 of 9 CREATED / REVISED BY: CHECKED BY: APPROVED BY: WHFOO WTCHUA NDYTKO APPLICATION SPECIFICATION L3 Layer Differential Trace & Ground Strip Design Wg L3 layer Wg Hg W3 Figure 12: Receptacle board differential trace and ground strip dimensions Wg L3 layer Wg Hg W3 Figure 13: Plug board differential trace and ground strip dimensions Summary for recommended dimensions Feature Ground void height, Hg Ground void width, Wg Ground strip width, W3 Receptacle Plug 1.70mm 0.80mm 0.35mm 2.37mm 0.80mm 0.35mm Table 3 REVISION: A ECM INFORMATION: EC No: 120635 DATE: 2017 /03/ 29 DOCUMENT NUMBER: AS-173300-0001 TITLE: ROUTING GUIDELINE FOR SPEEDEDGE MEZZANINE CONNECTORS SHEET No. 6 of 9 CREATED / REVISED BY: CHECKED BY: APPROVED BY: WHFOO WTCHUA NDYTKO APPLICATION SPECIFICATION Edge Card Ground Recess Edge card example shown in this routing guide has an 8-layer board stack-up. Gold fingers are located on top and bottom layers. Trace routing are located on L2 and L7 for front and back of the edge card respectively. All ground plane layers are recessed with by Wr measured from the edge of the tie-bar. Direction of Edge Card Insertion To Receptacle Wr Figure 14: Edge card ground recess from edge of tie-bar, Wr, for all ground plane layers Trace Break Out on L2 & L7 Sd W4 Wd Figure 15: Edge Card differential trace and ground strip dimensions for L2 and L7 layers Summary for recommended dimensions Feature Edge Card Ground recess distance, Wr Ground trace width, W4 Differential trace width, Wd Differential trace gap, Sg 3.725mm 0.254mm 0.15mm 0.17mm Table 4 REVISION: A ECM INFORMATION: EC No: 120635 DATE: 2017 /03/ 29 DOCUMENT NUMBER: AS-173300-0001 TITLE: ROUTING GUIDELINE FOR SPEEDEDGE MEZZANINE CONNECTORS SHEET No. 7 of 9 CREATED / REVISED BY: CHECKED BY: APPROVED BY: WHFOO WTCHUA NDYTKO APPLICATION SPECIFICATION 2.4. Recommended routing for high speed differential signal trace. 1. Use symmetric signal traces. 2. Use zero skew traces. 3. On signal reference layers, a ground strip is used for impedance control and good ground return. 4. Routing can be done with blind vias (preferred), back drilled vias or through vias. 5. Short section of single-ended trace from via break-out may need to be tuned for impedance control. 6. Trace bending angle, α ≥ 45degrees. Refer to Figure 8. i. Spacing between the same pair, A ≥ 5 x of distance to reference plane. ii. Length segment B, C ≥ 5 x Trace Width. Figure 16: Trace bending angle L1 Ground Strip Blind vias L8 Figure 17: Signal layers routing with blind vias REVISION: A ECM INFORMATION: EC No: 120635 DATE: 2017 /03/ 29 DOCUMENT NUMBER: AS-173300-0001 TITLE: ROUTING GUIDELINE FOR SPEEDEDGE MEZZANINE CONNECTORS SHEET No. 8 of 9 CREATED / REVISED BY: CHECKED BY: APPROVED BY: WHFOO WTCHUA NDYTKO APPLICATION SPECIFICATION Ground Strip on L2 Figure 18: Typical trace escape route pattern on host board (Receptacle) L2 layer Ground Strip on L2 Figure 19: Typical trace escape route pattern on plug board (Plug) L2 layer Pin #31 Pin #60 Figure 20: Typical trace escape route pattern on edge card L2 layer (Front) Pin #1 Pin #30 Figure 21: Typical trace escape route pattern on edge card L7 layer (Back) REVISION: A ECM INFORMATION: EC No: 120635 DATE: 2017 /03/ 29 DOCUMENT NUMBER: AS-173300-0001 TITLE: ROUTING GUIDELINE FOR SPEEDEDGE MEZZANINE CONNECTORS SHEET No. 9 of 9 CREATED / REVISED BY: CHECKED BY: APPROVED BY: WHFOO WTCHUA NDYTKO
1733000106
物料型号:文档中未明确列出物料型号,但文档编号为AS-173300-0001,可能与型号有关。

器件简介:SpeedEdge是一系列板对板连接器,用于连接平行的印刷电路板,也称为“mezzanine”连接器。它主要用于高速差分信号,但也适用于单端信号、低速信号和电源连接。

引脚分配引脚分配图显示了22、60和82电路的配置模式,其中黄色代表额外的引脚,绿色代表接地(GND),红色代表差分Gbps。

参数特性:文档提供了详细的布线和设计建议,包括盲孔、接地条和接地空隙的尺寸,以及差分信号迹线的推荐布线。

功能详解:SpeedEdge连接器设计用于高速差分信号,也适用于其他类型的信号和电源连接。它具有不同的高度选项以适应不同电路板间距。

应用信息:SpeedEdge连接器适用于需要高速信号传输和良好信号完整性的应用场合。

封装信息:文档提供了详细的布线指导和设计建议,以确保连接器的性能,但没有提供封装的物理尺寸信息。
1733000106 价格&库存

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1733000106
  •  国内价格 香港价格
  • 1+76.519121+9.49417
  • 10+66.5608010+8.25859
  • 100+54.91421100+6.81353

库存:475