2023960807

10 9 7 8 6 B 1.0 �0.5� 8 5.35 �1.9� �1.9� �0.25� E 吸着面 SUCTION AREA �C� CIRCUIT 1 INDICATOR MARK (SUCTION AREA) A PLATING 3.2 (STAND OFF) �0.14� D 4 �0.2� �1.15� CIRCUIT 1 CIRCUIT N 2 番号 NO. 部品 PART 1 ウエハー WAFER SERIES No. DRAWING No. 1.0 0.38 0.76 501568 203558 203559 TIN 2 0.95 1.3 �1.1� DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: J1 DATE: 2021/05/01 �0.6� (SOLDERING AREA) (SOLDERING AREA) ポリアミド(PA), UL94V-0, 色：SEE SHEET 6 POLYAMIDE(PA), UL94V-0, COLOR : SEE SHEET 6 金めっき： 0.1 MICRO-METER MIN. GOLD PLATING 金めっき： 0.05 MICRO-METER MIN. GOLD PLATING ニッケルめっき：1.27 MICRO-METER MIN. NICKEL テール部 TAIL AREA 錫めっき： 1.0 MICRO-METER MIN. MATTE TIN PLATING 下地めっき UNDER PLATING ニッケルめっき：1.0 MICRO-METER MIN. NICKEL RELEASE DATE 9 D C 材質 MATERIAL P1 E 0.55 2022/03/08 7 DIMENSION UNITS SCALE mm NTS 4.0 3.0 2.0 1.0 7.0 6.0 5.0 4.0 5 4 3 2 C B A 極数 CIRCUIT SIZE B CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 3.0 ° 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 09:37:17 8 6.2 5.2 4.2 3.2 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION 黄銅 BRASS ネイル NAIL F TABLE 1 接点部 ソルダーピン CONTACT AREA SOLDER PIN テール部 TAIL AREA 下地めっき UNDER PLATING 3 1 5015680000-SD PSD 000 2035580000-SD PSD 000 2035590000-SD PSD 000 リン青銅 PHOSPHOR BRONZE B A 2 PLATING THICKNESS [micro-meter MIN.] GOLD C 3 1. 本製品は極数によって、ロック形状が変わりますので御注意願います。 　 THE LOCK SHAPE OF THIS PRODUCT CHANGES ACCORDING TO THE NUMBER OF CIRCUIT. 　 2~5 CIRCUITS：フリクションロック FRICTION LOCK 　 6~15 CIRCUITS：インナーポジティブロック INNER POSITIVE LOCK 2　 材料及び仕上げ(めっき仕様)：TABLE 1,2 参照 　 MATERIAL AND FINISHES : SEE TABLE 1 AND 2 3. 製品仕様書：2023960000 PS 000 　 PRODUCT SPECIFICATION: 4. 梱包形態：SEE SHEET 4 　 PACKAGING INFORMATION: 5 嵌合相手：501330 シリーズ 　MATES WITH:501330 SERIES 6. アプリケーション仕様書(コネクタ取扱い説明書)：5013300000-AS 000 　 APPLICATION SPECIFICATION(CONNECTOR MANUAL): 7. ソルダーピン及びネイルの平坦度:0.1 MAX. 　SOLDER PIN AND NAIL COPLANARITY: 0.1 MAX. 8　 偶数極に適用 　APPLY FOR EVEN CIRCUIT 9. その他金めっき厚品及び錫めっき品は以下の図面を御参照ください。 　 PLEASE REFER TO THE FOLLOWING DRAWING 　 FOR OTHER GOLD PLATING VERSION AND TIN PLATING VERSION. (SUCTION AREA) (PITCH) F 5 NOTES 6 5 4 EC NO: 698195 DRWN: MIKEDA01 CHK'D: SAKIYAMA APPR: AIDA INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION 2022/02/28 2022/03/08 2022/03/08 PICO-CLASP 1.0 W/B SINGLE ROW RA SMT INNER LOCK GOLD PLATING 0.1 MICRO-METER PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2019/04/02 2019/04/05 DRAWING SERIES A3-SIZE 202396 3 2023960000-SD MATERIAL NUMBER CUSTOMER SEE SHEET 6 2 PSD 000 C SHEET NUMBER 1 OF 6 1 A 10 9 7 8 6 5 4 3 2 1 B 1.0 �0.5� �0.25� F 5.35 �2.1� �1.5� F E (SUCTION AREA) 8 (PITCH) E 吸着面 SUCTION AREA �C� (SUCTION AREA) 1 A 4.5 CIRCUIT 1 INDICATOR MARK �0.2� �1.15� C CIRCUIT N CIRCUIT 1 3 0.95 0.55 �1.1� �0.6� (SOLDERING AREA) 2 番号 NO. 部品 PART 1 ウエハー WAFER (SOLDERING AREA) 1.3 TABLE 2 材質 MATERIAL ポリアミド(PA), UL94V-0, 色：SEE SHEET 6 POLYAMIDE(PA), UL94V-0, COLOR : SEE SHEET 6 リン青銅 PHOSPHOR BRONZE B 2 接点部 ソルダーピン CONTACT AREA SOLDER PIN テール部 TAIL AREA 下地めっき UNDER PLATING 金めっき： 0.1 MICRO-METER MIN. GOLD PLATING 金めっき： 0.05 MICRO-METER MIN. GOLD PLATING ニッケルめっき：1.27 MICRO-METER MIN. NICKEL 3 ネイル NAIL DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: J1 DATE: 2021/05/01 テール部 TAIL AREA 錫めっき： 1.0 MICRO-METER MIN. MATTE TIN PLATING 下地めっき UNDER PLATING ニッケルめっき：1.0 MICRO-METER MIN. NICKEL P1 RELEASE DATE 9 2022/03/08 7 DIMENSION UNITS SCALE mm NTS 14.0 13.0 12.0 11.0 10.0 9.0 8.0 7.0 6.0 5.0 17.0 16.0 15.0 14.0 13.0 12.0 11.0 10.0 9.0 8.0 15 14 13 12 11 10 9 8 7 6 C B A 極数 CIRCUIT SIZE B CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 3.0 ° 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 09:37:17 8 C 12.7 11.7 10.7 9.7 8.7 7.7 6.7 5.7 4.7 3.7 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION 黄銅 BRASS A 4.7 2 3.3 (STAND OFF) D �0.1� D 6 5 4 EC NO: 698195 DRWN: MIKEDA01 CHK'D: SAKIYAMA APPR: AIDA INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION 2022/02/28 2022/03/08 2022/03/08 PICO-CLASP 1.0 W/B SINGLE ROW RA SMT INNER LOCK GOLD PLATING 0.1 MICRO-METER PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2019/04/02 2019/04/05 DRAWING SERIES A3-SIZE 202396 3 2023960000-SD MATERIAL NUMBER CUSTOMER SEE SHEET 6 2 PSD 000 C SHEET NUMBER 2 OF 6 1 A 10 9 7 8 5 6 4 3 2 1 (6.74) 嵌合相手：501330シリーズ MATE WITH：501330 SERIES F (A) (A) F DISTANCE FROM CONNECTOR OUT-LINE TO TERMINAL PAD E �0.9� E 製品レイアウト(参考：6~15 CIRCUITS) PRODUCT LAYOUT(REFERENCE:6~15 CIRCUITS) B ±0.05 1.0 ±0.05 公差非累積 (PITCH) (6.24) NON-ACCUMULATIVE ±0.05 0.6 (6.24) (0.55) TYP.(N) CIRCUIT N CIRCUIT 1 (0.55) 0.55 MIN. D D 製品輪郭線 PART OUTLINE �0.4� DISTANCE FROM CONNECTOR OUT-LINE TO NAIL PAD 0.7 ±0.05 1.2 MIN. TYP.(2) TYP.(2) (4.7) (5.0) (3.2) 5.55 ±0.05 C b) 6~15 CIRCUITS a) 2~5 CIRCUITS 1.0 MIN. C 1.8 ±0.05 �0.7� LAYOUT OR SOLDER PASTE RESTRICTED AREA 4.05 ±0.05 パターン及び はんだ禁止エリア TYP.(2) 2.85 MIN. TYP.(2) 嵌合図 MATED CONNECTORS B B 推奨基板レイアウト(全極数適用)：実装面側 (参考：基板厚 1.0mm, メタルマスク厚さ 0.12mm, マスク開口率100%) POLARIZED RECOMMENDED PCB LAYOUT(APPLY TO ALL CIRCUITS) : COMPONENT SIDE (REFERENCE: PCB THICKNESS 1.0mm, STENCIL THICKNESS 0.12mm, APERTURE RATIO 100%) THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: J1 DATE: 2021/05/01 P1 RELEASE DATE 9 2022/03/08 NTS ANGULAR TOL ± 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 3.0 ° 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 09:37:17 8 SCALE mm 7 CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) :パターン禁止エリア RESTRICTED AREA NO PCB COMPONENTS ALLOWED A DIMENSION UNITS 6 5 4 EC NO: 698195 DRWN: MIKEDA01 CHK'D: SAKIYAMA APPR: AIDA INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION 2022/02/28 2022/03/08 2022/03/08 PICO-CLASP 1.0 W/B SINGLE ROW RA SMT INNER LOCK GOLD PLATING 0.1 MICRO-METER PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2019/04/02 2019/04/05 DRAWING SERIES A3-SIZE 202396 3 2023960000-SD MATERIAL NUMBER CUSTOMER SEE SHEET 6 2 PSD 000 C SHEET NUMBER 3 OF 6 1 A 10 9 7 8 5 6 4 3 2 1 F F NOTES 10. 梱包数量 2-5 CIRCUIT: 1700個/リール 6-15 CIRCUIT: 1300個/リール 　　NUMBER OF CONNECTORS 2-5 CIRCUIT : 1700 PIECES/REEL 6-15 CIRCUIT : 1300 PIECES/REEL 11. リードテープ長さ 　　LEAD TAPE LENGTH 4 REEL 引き出し方向 PULL OUT DIRECTION ⌀ 380 ±2 �⌀80� E E トップテープ接着部(空エンボス) 100 MIN. TOP TAPE BONDED PART(EMPTY) 引き出し方向 PULL OUT DIRECTION 部品挿入部 CONPONENT SUPPLIER 400 MIN. D Z D ±1.0 2.0 ±0.5 (⌀10) 0°) (2) 160 MIN. 12. トップテープの剥離強度はIEC60286-3に準拠。 　 TOP TAPE PEELING FORCE IS DEFINED BY IEC60286-3. 　 13 2~5極品は乾燥剤入り、ハイバリア梱包による納品となります。 　 2~5 CIRCUITS IS DELIVERED IN A HIGH BARRIER PACKAGING WITH DESICCANT. 14. 梱包仕様書：2023969200 PS 200 　 PACKAGE SPECIFICATION: 33.4 発注番号：SHEET 6 参照 15 ORDER No.：PLEASE REFER TO SHEET 6 FOR PRODUCT LIST. 202396 - ** * * (12 (22) C 末端部(空部) TAIL PART (EMPTY) 25.4 極数 CIRCUIT SIZE ハウジングカラー HOUSING COLOR 0:NATURAL(BEIGE) (⌀21) 製品識別番号 IDENTIFICATION NUMBER 7:EMBOSSED PACKAGE �⌀ 13� 17.5 DETAIL Z B D D 15 14 13 12 11 10 C 9 8 7 6 5 4 3 2 B 極数 CIRCUIT SIZE THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm NTS CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) 番号 部品 A NO. PART 4 材質 MATERIAL リール ポリスチレン(PS) REEL POLYSTYRENE(PS) DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: J1 DATE: 2021/05/01 P1 RELEASE DATE 9 2022/03/08 ± 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 3.0 ° 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 09:37:17 8 ANGULAR TOL 7 6 5 4 EC NO: 698195 DRWN: MIKEDA01 CHK'D: SAKIYAMA APPR: AIDA INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION 2022/02/28 2022/03/08 2022/03/08 PICO-CLASP 1.0 W/B SINGLE ROW RA SMT INNER LOCK GOLD PLATING 0.1 MICRO-METER PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2019/04/02 2019/04/05 DRAWING SERIES A3-SIZE 202396 3 2023960000-SD MATERIAL NUMBER CUSTOMER SEE SHEET 6 2 PSD 000 C SHEET NUMBER 4 OF 6 1 A 9 7 8 12 ±0.1 4 3 16mm幅テープ TAPE WIDTH:16mm Y (5.6) 1 (5.65) F SECTION X-X 6~15 CIRCUITS SECTION Y-Y (2.8) (6.4) R �0.75� (2.0) エンボスポケット中心位置 CENTER OF EMBOSSED POCKET 12 ±0.1 0.2 +0.15 -0.05 DETAIL U PULL OUT DIRECTION 32mm幅テープ TAPE WIDTH:32mm (5.6) D 24mm幅テープ TAPE WIDTH:24mm 1.5 +0.1 0 17.3 16.3 15.3 14.3 13.3 12.3 11.3 10.3 9.3 8.3 7.3 6.3 5.3 4.3 (F) V 6 TOP TAPE W 1.75 ±0.1 5 CARRIER TAPE CIRCUIT 1 部品 PART 5 6 SECTION W-W G (2.0) エンボスポケット中心位置 CENTER OF EMBOSSED POCKET 4.0 ±0.1 累積ピッチ：40±0.2 ACCUMULATIVE PITCH: 番号 NO. (2.8) (6.4) ⌀ 1.5 +0.1 0 DOCUMENT STATUS ポリエチレン(PE)、その他 POLYETHYLENE(PE), etc P1 RELEASE DATE 9 2022/03/08 DIMENSION UNITS SCALE mm NTS ANGULAR TOL ± 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 3.0 ° 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 09:37:17 8 7 15 14 13 12 11 10 32 14.2 11.5 24 7.5 16 コネクタ中心位置 F エンボステープ幅 E SENTER OF CONNECTOR WIDTH OF TAPE C 9 8 7 6 5 4 3 2 極数 CIRCUIT SIZE B CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) キャリアテープ ポリプロピレン(PP)、その他 CARRIER TAPE POLYPROPYLENE(PP), etc FORMAT: master-tb-prod-A3 REVISION: J1 DATE: 2021/05/01 D THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION 材質 MATERIAL トップテープ TOP TAPE SECTION V-V CONNECTOR �G� 28.4 ±0.1 E ±0.3 V B (5.65) DETAIL U W C E �6.1� 4.0 ±0.1 累積ピッチ：40±0.2 ACCUMULATIVE PITCH: Y (5.1) ⌀ 1.5 +0.1 0 (0.5) CIRCUIT 1 1.75 ±0.1 E �5.69� (3.55) �G� X X (F) PULL OUT DIRECTION A 2 2~5 CIRCUITS E ±0.3 F 5 6 (0.5) 10 6 5 4 EC NO: 698195 DRWN: MIKEDA01 CHK'D: SAKIYAMA APPR: AIDA INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION 2022/02/28 2022/03/08 2022/03/08 PICO-CLASP 1.0 W/B SINGLE ROW RA SMT INNER LOCK GOLD PLATING 0.1 MICRO-METER PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2019/04/02 2019/04/05 DRAWING SERIES A3-SIZE 202396 3 2023960000-SD MATERIAL NUMBER CUSTOMER SEE SHEET 6 2 PSD 000 C SHEET NUMBER 5 OF 6 1 A 10 9 8 7 6 5 4 3 2 1 F F E E 13 D 15 製品一覧 PRODUCT LIST D HOUSING COLOR NATURAL(BEIGE) 202396 1507 1407 1307 1207 1107 1007 0907 0807 0707 0607 0507 0407 0307 202396 0207 C B 15 14 13 12 11 10 C 9 8 7 6 5 4 3 2 B 発注番号 ORDER No. 梱包形態：エンボスリール　 PACKAGE:EMBOSSED REEL 極数 CIRCUIT SIZE THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE mm NTS CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) A DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: J1 DATE: 2021/05/01 P1 RELEASE DATE 9 2022/03/08 ± 4 PLACES ± 0.2 3 PLACES ± 0.2 2 PLACES ± 0.2 3.0 ° 1 PLACE ± 0.2 0 PLACES ± 0.2 DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 09:37:17 8 ANGULAR TOL 7 6 5 4 EC NO: 698195 DRWN: MIKEDA01 CHK'D: SAKIYAMA APPR: AIDA INITIAL REVISION: DRWN: AISHIKAWA APPR: KOMURAKAMI THIRD ANGLE PROJECTION 2022/02/28 2022/03/08 2022/03/08 PICO-CLASP 1.0 W/B SINGLE ROW RA SMT INNER LOCK GOLD PLATING 0.1 MICRO-METER PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2019/04/02 2019/04/05 DRAWING SERIES A3-SIZE 202396 3 2023960000-SD MATERIAL NUMBER CUSTOMER SEE SHEET 6 2 PSD 000 C SHEET NUMBER 6 OF 6 1 A